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| Number | Title | Issue Date |
| 7232502 | Sheet-fed treating device A processing unit of the invention is a single wafer processing unit including: a processing container that can be vacuumed; a stage arranged in the processing container, on which an object to be processed can be placed; a discharging pipe connected to a bottom part... | 06/19/2007 |
| 7227303 | Method for forming cold spot region and discharge lamp with such cold spot region A method for forming a cold spot region on a discharge tube of a discharge lamp is disclosed. In the method, a discharge tube is formed, and a tubular extension is formed on at least one end of the discharge tube. The tubular extension has a smaller diameter than th... | 06/05/2007 |
| 7107676 | One piece foliated leads for sealing in light sources Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filam... | 09/19/2006 |
| 6992251 | Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circu... | 01/31/2006 |
| 6949822 | Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance A multichip module has a substrate, which receives several flip chip and for other semiconductor die on one surface and has vias extending through the substrate from the flip chip bottom electrodes to solder ball electrodes on the bottom of the substrate. Passive co... | 09/27/2005 |
| 6880986 | Optical subassembly enclosure A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling featur... | 04/19/2005 |
| 6719601 | Fluorescent lamp and method for manufacturing the fluorescent lamp A fluorescent lamp capable of fully securing a portion for containing a mercury amalgam pellet and reliably preventing the mercury amalgam pellet from moving toward the inside a discharge tube, and a method for manufacturing the fluorescent lamp. The fluorescent lam... | 04/13/2004 |
| 6685525 | Method for manufacturing an incandescent lamp A method for manufacturing an inexpensive lamp, which suppresses distortion of a bulb and prevents decrease in commercial value and breakage of the bulb. In a glass bulb having one end thereof communicating with an exhaust tube, an assembly of a filament,... | 02/03/2004 |
| 6396691 | Thermal cover for T1/HDSL repeater case A repeater case capable of housing HDSL telecommunications modules without an excessive buildup of heat. The repeater case has a base, an open-topped housing, and a closure member that closes the housing. The closure member is provided in the form of a pa... | 05/28/2002 |
| 6350949 | Sealed power distribution module An environmentally sealed power distribution module is disclosed having a hybrid peripheral seal disposed around a power distribution panel and within an interface between a top housing and a base housing. The peripheral seal is comprised of a traditional... | 02/26/2002 |
| 6301097 | Inflatable sealing system for low temperature electronic module An inflatable sealing system and method are provided for a low temperature electronic device such as a cooled multichip integrated circuit module. The inflatable sealing system includes a flexible bladder configured to engage at least one surface of the l... | 10/09/2001 |
| 5896268 | Enclosure for high-density subscriber line modules A repeater case for high-density subscriber lines includes a repeater base and repeater case housing formed of a fiberglass composite and together forming a sealed enclosure for a pressurized atmosphere. The repeater case housing has a removable cover sec... | 04/20/1999 |
| 5812188 | Sterile encapsulated endoscopic video monitor A sterile enclosure is provided having a body portion for encapsulating one or more video monitors used for viewing one or more surgical areas in a sterile operating field. The enclosure may be flexible or rigid and have one or more cable drapes extending... | 09/22/1998 |
| 5734103 | Sealed wire entry for instrument housing and method of sealing A sealed wire entry port for a housing (10) having a base (12) and a top (11), and a body of sealing material (16) joining the top (11) to the base (12) and a pair of insulated wires (21) in which the insulation (31) is removed where the wires (21) run th... | 03/31/1998 |
| 5713610 | Semi-permanent vacuum closure with multiple retubulation capability A vacuum system (20) includes an enclosure (22) having a vacuum-tight wall (26) and an internally threaded aperture (66) through the wall (26). A tip-off fitting (24) has a base (50) with a bore (52) therethrough, a hollow tube (62) fixed to the base (50)... | 02/03/1998 |
| 5675883 | Method of manufacturing a copper-nickel-silicon alloy casing The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The metho... | 10/14/1997 |
| 5576937 | Connector including a connector body, an annular air-tight material and a closure plate to seal an IC A connector for protecting an IC comprising a connector body, a closed plate, and an annular air-tight sealing material. An air-tight chamber is formed centrally of the annular air-tight sealing material by compressing the annular air-tight sealing materi... | 11/19/1996 |
| 5461545 | Process and device for hermetic encapsulation of electronic components According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components... | 10/24/1995 |
| 5311402 | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or b... | 05/10/1994 |
| 5280413 | Hermetically sealed circuit modules having conductive cap anchors A circuit module includes a multilayer circuit board having a plurality of alternate layers defining circuit paths and insulation with conductive vias between selected circuit paths of different layers. A hermetic seal is sealed to the top layer of the mu... | 01/18/1994 |
| 5122926 | Housing for an electric device A housing for an electric device, such as a power transformer or an X-ray tube, comprises a tank which contains electric components of the device and which is filled with an insulating and/or cooling liquid, such as. A lid is arranged at a planar top port... | 06/16/1992 |
| 5080155 | Keyboard enclosure A bag-like envelope is sized to receive a keyboard. The envelope has a reclosable and resealable opening for receiving the keyboard and another sealable opening for the electrical cable from the keyboard. A transparent panel of the envelope overlies the k... | 01/14/1992 |
| 5077536 | Device for protecting electric power resistances and anti-overpressure system A device for the protection of electric power resistances assembled in a battery using rods, insulating guns and isolators all housed within a dust tight and water jet tight parallelepipedic metallic housing, containing only air for cooling the resistance... | 12/31/1991 |
| 5041695 | Co-fired ceramic package for a power circuit Both a co-fired ceramic package for a power circuit is disclosed as well as a method of manufacture thereof. The package includes a base which is formed from a plurality of pyrolizable ceramic films, each of which includes a heat-conductive and electrical... | 08/20/1991 |
| 4686324 | Cold-seal package for withstanding high temperatures A cold-seal package affording resistance to high temperatures, comprising a base and a cover provided with an annular flange and so designed as to be brought into contact with each other in such a manner as to permit cold-sealing and encapsulation of an e... | 08/11/1987 |
| 4556860 | Conductive polymers Method and apparatus for producing an electrical conductor are provided comprising a doped polymeric material and an encasement means substantially impermeable to the dopant, the encasement means having matching surfaces in contact with the polymeric mate... | 12/03/1985 |
| 4375008 | Method for encapsulating components with cases and an encapsulation provided by the method Method for encapsulating components in cases, which includes connecting a gold wire to an aluminum surface, subsequently closing the case by welding in a vacuum, and tempering the case in a hydrogen-containing atmosphere and an encapsulation produced by t... | 02/22/1983 |
| 4249034 | Semiconductor package having strengthening and sealing upper chamber A semiconductor device is described wherein a semiconductor pellet is disposed within a hermetically sealed chamber including a thermally conductive base and a substantially rigid housing, said housing including an open upper chamber in which are disposed... | 02/03/1981 |
| 4159221 | Method for hermetically sealing an electronic circuit package A hermetically sealed electronic circuit package is formed by placing a preformed, uncured sealant between a circuitized ceramic substrate and a ceramic cover. The resultant assembly is placed in an oven which has been preheated to a temperature at least ... | 06/26/1979 |
| 4022317 | Package for fragile objects A package for fragile objects such as radioactive fusion pellets of micron size shipped in mounted condition or unmounted condition with a frangible inner container which is supported in a second inner container which in turn is supported in a final outer... | 05/10/1977 |
| 4008413 | Compact high voltage feedthrough for gas discharge devices A support structure and electrode design geometry for a compact high voltage feedthrough, which is used in low-pressure gas discharge devices. The high voltage coaxial cable which applies voltages to the various electrodes within the discharge device is f... | 02/15/1977 |
| 3953662 | Sealed container housing a mechanical filter A container for a mechanical filter is provided in which the internal pressure is reduced to prevent propagation in the air of sound waves to thereby prevent deterioration of the filter characteristics. A recess with an aperture therethrough is formed in ... | 04/27/1976 |
