Famous Patents
The ice cream cone was invented at the St. Louis Worlds Fair by Ernest Hamwi in 1904. His waffle booth was next to an ice cream vendor who ran short of dishes. Hamwi rolled a waffle to hold ice cream and the cone was born.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7772488 | Case assembly structure and electronic device with same The present invention provides a case assembly structure of an electronic device. The case assembly structure includes a first case, a second case and a heat-dissipating element. The first case has an engaging hole and a first opening. The second case has an engagin... | 08/10/2010 |
| 7436663 | Disk array system In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural disk drives 2, fans 5, and a casing 1. The dis... | 10/14/2008 |
| 7436660 | Heat sinks for electronic enclosures An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to th... | 10/14/2008 |
| 7408774 | Real time adaptive active fluid flow cooling The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. Th... | 08/05/2008 |
| 7397661 | Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The fr... | 07/08/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7382616 | Cooling system for computer hardware The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is provided. The system is mountable to a first side of a circuit board. The... | 06/03/2008 |
| 7382619 | Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency The invention provides an electric apparatus having a printed circuit board with an improved heat dissipation capacity, and, in particular, to provide an electric apparatus requiring plural printed circuit boards that has an improved heat dissipation efficiency and ... | 06/03/2008 |
| 7379300 | Fixing mechanism for a fan fixing frame A fixing mechanism fixes a side of a fan frame having a plurality of cooling fans and provided with a locking elastic tab having a second locking portion to a bottom board of a housing of an electronic device. The fixing mechanism includes a fixing tab fixed to the ... | 05/27/2008 |
| 7375969 | Plasma display device A plasma display device for efficiently dissipating heat from a driver IC packaged in a form of a tape carrier package. The device includes a plasma display panel, a printed circuit board assembly, a chassis base having one surface attached to the plasma display pan... | 05/20/2008 |
| 7362584 | Heat relief socket A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and th... | 04/22/2008 |
| 7362572 | Techniques for redundant computing within a 1U form factor with improved resource partitioning and management An improved redundant computing apparatus includes a chassis assembly configured to (i) mount to a standard electronic equipment rack and (ii) consume substantially 1U of space in a particular direction (e.g., vertical height) within the standard electronic equipmen... | 04/22/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7355857 | Heat sink gasket A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the recept... | 04/08/2008 |
| 7355852 | Modular liquid cooling of electronic assemblies An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to th... | 04/08/2008 |
| 7355851 | Power adapter with fan assembly and control circuit A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The... | 04/08/2008 |
| 7352575 | Dynamic air moving system Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one... | 04/01/2008 |
| 7352572 | Fire block module The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the vertical direction of flame propagation occurring in the event of a fi... | 04/01/2008 |
| 7342786 | Air duct with airtight seal A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one si... | 03/11/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339793 | Interposable heat sink for adjacent memory modules A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first ... | 03/04/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7330352 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 02/12/2008 |
| 7324348 | Telecommunications chassis and card A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor di... | 01/29/2008 |
| 7310232 | Multi-surface heat sink film An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipatio... | 12/18/2007 |
| 7310227 | Electronic apparatus According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-d... | 12/18/2007 |
| 7307844 | Heat dissipation mechanism for electronic apparatus This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air th... | 12/11/2007 |
| 7304845 | Heat sink assembly A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardl... | 12/04/2007 |
| 7301128 | Portable electric grill A portable electric grill including an exhaust fan for indoor grilling is disclosed. The present grill is constructed to permit its supporting frame to be folded from an open position wherein the horizontally disposed grilling plates are supported by folding leg mem... | 11/27/2007 |
| 7301774 | Universal locking device for heat sink A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality... | 11/27/2007 |
| 7301769 | Fan holder A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending... | 11/27/2007 |
| 7298623 | Organic substrate with integral thermal dissipation channels, and method for producing same A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-... | 11/20/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7289331 | Interposable heat sink for adjacent memory modules A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first... | 10/30/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
| 7280365 | Multi-processor module with redundant power One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the proce... | 10/09/2007 |
| 7277286 | Computers Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or more heat-dissipating plates separated from the case by a predetermined ... | 10/02/2007 |
| 7277293 | Heat sink conduction apparatus A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal... | 10/02/2007 |
| 7272004 | Frequency converter A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiati... | 09/18/2007 |
| 7272003 | Encapsulated switching devices having heat emission elements The invention relates to an improvement to the thermal load capacity of generator switches (20, 21, 22). As is known, radiation plates (5, 50, 51, 52) are used between generator switches (20, 21, 22) for different phases (R, Y, B) for convective... | 09/18/2007 |
