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| Number | Title | Issue Date |
| 7939753 | Cable head for assembly in a conduit of a water-cooled, high current cable A compact cable head for assembly in a conduit of a water-cooled, high current cable includes a cable side end to receive conductors; a first circumferential section with saw tooth ribbing to be engaged by clips on the conduit; and a second circumferential region ad... | 05/10/2011 |
| 7777130 | Microwave cable cooling A cable cooling apparatus, for dissipating heat generated by a cable, includes a housing configured for attachment to at least a portion of the cable. The housing is configured to retain a meltable material in a first state and the meltable material is configured to... | 08/17/2010 |
| 7723611 | Cable connector having fluid reservoir Embodiments of a cable connector are provided that include an inner connector assembly and an outer connector housing. In use, the cable connector securely fastens or splices together at least two cables or cable sections and in electrical communication while also p... | 05/25/2010 |
| 7586742 | Heat dissipation module A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation ... | 09/08/2009 |
| 7557295 | Isolating tube for a cooling element which can be loaded with high voltage An exemplary isolating tube, and production method thereof, includes a mechanically load-bearing plastic tube composed of a fiber-reinforced polymer for use in a cooling element which can be loaded with high voltage, during whose operation the isolating tube forms a... | 07/07/2009 |
| 7443681 | Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal t... | 10/28/2008 |
| 7440278 | Water-cooling heat dissipator A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the f... | 10/21/2008 |
| 7432819 | Apparatus for continuous cooling of electrical powered equipment A fluidic cooling assembly for removing heat from electrical equipment includes operational diversity features in which multiple fluid moving devices are mounted in a single housing. The assembly may include a first fluid baffle and a second fluid baffle disposed wi... | 10/07/2008 |
| 7433190 | Liquid cooled electronic chassis having a plurality of phase change material reservoirs A system and method of thermal management of electrical and electronic systems and components that adequately maintains the temperatures of the system electronics and electrical devices within reliable limits during various postulated system malfunctions. The system... | 10/07/2008 |
| 7430119 | Impeller and aligned cold plate According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle.... | 09/30/2008 |
| 7423874 | Magneto-hydrodynamic heat sink A heat sink uses a pump assembly to generate a magnetic field. A direction of electrically and thermally conductive liquid flowing through the pump assembly is dependent on an orientation of the magnetic field and the direction of electrical current induced across f... | 09/09/2008 |
| 7417857 | Power-electronic-cooling device A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the invention, the cooling circuit can include deflectors and/or turbulato... | 08/26/2008 |
| 7414843 | Method and apparatus for a layered thermal management arrangement Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one ... | 08/19/2008 |
| 7414844 | Liquid cooled heat sink with cold plate retention mechanism A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient col... | 08/19/2008 |
| 7408775 | Electrical module and support therefor with integrated cooling A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality ... | 08/05/2008 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/15/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7385813 | Assembly structure for securing heat-dissipating fan An assembly structure provided for securing a heat-dissipating fan, includes a casing board and a fan covering for covering the fan, The casing board has ventilation openings, coupling openings and positioning openings, and the fan covering formed with coupling port... | 06/10/2008 |
| 7382618 | Heat dissipating apparatus for computer add-on cards A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the... | 06/03/2008 |
| 7379301 | Integrated liquid cooling system An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump incl... | 05/27/2008 |
| 7362584 | Heat relief socket A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and th... | 04/22/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7355852 | Modular liquid cooling of electronic assemblies An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to th... | 04/08/2008 |
| 7352572 | Fire block module The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the vertical direction of flame propagation occurring in the event of a fi... | 04/01/2008 |
| 7352578 | Fuel cell system with inverter and phase change material The present invention is a back-up power supply of alternating current and direct current, with the alternating current being generated by an inverter from the direct current, which is produced by a fuel cell. The inverter is at least partially encompassed by a phas... | 04/01/2008 |
| 7349221 | Device for increased thermal conductivity between a printed wiring assembly and a chassis A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the ro... | 03/25/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339789 | Modular, scalable thermal solution One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first int... | 03/04/2008 |
| 7339787 | Heat sink module for dissipating heat from a heat source on a motherboard A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of th... | 03/04/2008 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated ... | 02/26/2008 |
| 7336493 | Cold plate cooling apparatus for a rack mounted electronic module Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower sur... | 02/26/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7333334 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which... | 02/19/2008 |
| 7324342 | Electronics assembly and electronics package carrier therefor An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly al... | 01/29/2008 |
| 7320178 | Standoff for cold plate and cold plate made with the standoff A standoff for a cold plate and a cold plate using the standoff are characterized by a coil pack consisting of a plurality of individual fluid conveying tubes formed into a coil pack having a desired configuration and held in place by a plurality of retaining wires.... | 01/22/2008 |
| 7317615 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a p... | 01/08/2008 |
| 7312986 | Cooling device for an electronic apparatus A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump cham... | 12/25/2007 |
| 7310232 | Multi-surface heat sink film An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipatio... | 12/18/2007 |
| 7309453 | Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is esp... | 12/18/2007 |
