Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
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| Number | Title | Issue Date |
| 7414845 | Circuit board assembly for a liquid submersion cooled electronic device A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, the... | 08/19/2008 |
| 7405935 | Service tray for a thermal management system A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within ... | 07/29/2008 |
| 7375962 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 05/20/2008 |
| 7369409 | Apparatus, method, and control program for cooling electronic devices A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a... | 05/06/2008 |
| 7362574 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 04/22/2008 |
| 7336486 | Synthetic jet-based heat dissipation device A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating... | 02/26/2008 |
| 7331377 | Diamond foam spray cooling system A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section... | 02/19/2008 |
| 7278468 | Heat sink with multiple coolant inlets The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins dis... | 10/09/2007 |
| 7278466 | Semiconductor device cooling apparatus In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact ther... | 10/09/2007 |
| 7277283 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting co... | 10/02/2007 |
| 7270175 | Extended impingement cooling device and method An extended impingement cooling structure to cool outside an air supply plenum comprises an inner wall; an impingement sheet; a series of supports to maintain the inner wall in spaced relation to the impingement sheet, and a baffle supported between the inner wall a... | 09/18/2007 |
| 7269011 | Impingement cooled heat sink with uniformly spaced curved channels A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit positi... | 09/11/2007 |
| 7255153 | High performance integrated MLC cooling device for high power density ICS and method for manufacturing A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the su... | 08/14/2007 |
| 7252140 | Apparatus and method for enhanced heat transfer One embodiment of the cooling module is implemented as a device having a heat sink and an integrated synthetic jet actuator. The heat sink is configured to have a channel and a jet distribution system associated with the synthetic jet actuator directs fluid flow int... | 08/07/2007 |
| 7147432 | Turbine shroud asymmetrical cooling elements A turbine shroud assembly asymmetrical cooling element such as a shroud segment or a baffle includes an arcuate panel. The panel has a plurality of cooling apertures extending through the panel and an axially extending midline of the panel parallel to an axis of rot... | 12/12/2006 |
| 7143815 | Liquid cooling device A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port ( | 12/05/2006 |
| 7063133 | Multi-wall heat exchanger for a water heater A water heater including a tank having a wall defining an interior for holding water is provided. A heat exchange assembly is positioned at least partially within the interior of the tank. The heat exchange assembly has an outer tube extending within the interior of... | 06/20/2006 |
| 6971441 | Device and method for removing heat from object by spraying cooling agent A device and method for removing heat from an object by spraying a cooling agent is disclosed. A cooling casing or a heat sink is mounted to the object. A spray nozzle is arranged to spray the cooling agent onto the cooling casing or the heat sink from a reservoir. ... | 12/06/2005 |
| 6926074 | Exhaust gas cooler An exhaust gas cooler for an internal combustion engine, preferably in a motor vehicle, includes a housing through which exhaust gas can flow in the longitudinal direction and in which a partition extends in the longitudinal direction and separates a first chamber f... | 08/09/2005 |
| 6817405 | Apparatus having forced fluid cooling and pin-fin heat sink A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing ... | 11/16/2004 |
| 6793007 | High flux heat removal system using liquid ice A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, c... | 09/21/2004 |
| 6779597 | Multiple impingement cooled structure A multiple impingement cooled structure is provided having two or more stages of impingement cooling wherein the stages are arranged so as to have substantially constant cooling effectiveness. ... | 08/24/2004 |
| 6781834 | Cooling device with air shower A cooling device with an air shower is disclosed. The cooling device includes a heat mass with a plurality of spaced apart fins connected therewith. An air shower including an injector face with a plurality of disrupter orifices is positioned over the fins so that t... | 08/24/2004 |
| 6688110 | Air impingement cooling system Where gas turbine engine structure eg combustion equipment, is to be air impingement cooled, the surface which receives the air jets is so shaped as to produce boundary layer separation zones 34, 38 and 44 in the cooling air, as it spreads across the surf... | 02/10/2004 |
| 6625023 | Modular spray cooling system for electronic components A modular spray cooling system 10 for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure 12 with an inside wall 14. A spray co... | 09/23/2003 |
| 6603658 | Laminar air jet cooling of heat producing components A low velocity, laminar jet of air is directly impinged on the surface of heat producing components such as a microprocessor chip. A laminar jet air flow has a very low mass flow rate and has a high convection heat transfer rate at the stagnation region o... | 08/05/2003 |
| 6603662 | Computer cooling system A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.... | 08/05/2003 |
| 6588497 | System and method for thermal management by synthetic jet ejector channel cooling techniques One embodiment of a thermal management system comprises a heated body, where a heat energy is contained within this heated body. This first embodiment also comprises an ambient fluid adjacent to an exterior surface of the heated body. Walls forming a chan... | 07/08/2003 |
| 6580610 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 06/17/2003 |
| 6574094 | Method and apparatus for cooling bus bars A method for cooling bus bars 12,14 in order to increase their current-carrying capacity while saving space and weight. The method comprises the steps of providing a housing having an interior wall; locating a distribution manifold 20 within the housing, ... | 06/03/2003 |
| 6519151 | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions forme... | 02/11/2003 |
| 6507492 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 01/14/2003 |
| 6431260 | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective bli... | 08/13/2002 |
| 6418016 | System and method for cooling using an oscillatory impinging jet A system and method for cooling are disclosed. The system for cooling includes an opening out of which a jet of coolant can flow, a target element, and a forcing device which causes the jet of coolant to flow out of the opening. The target element is posi... | 07/09/2002 |
| 6402464 | Enhanced heat transfer surface for cast-in-bump-covered cooling surfaces and methods of enhancing heat transfer An annular turbine shroud separates a hot gas path from a cooling plenum containing a cooling medium. Bumps are cast in the surface on the cooling side of the shroud. A surface coating overlies the cooling side surface of the shroud, including the bumps, ... | 06/11/2002 |
| 6377458 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 04/23/2002 |
| 6366462 | Electronic module with integral refrigerant evaporator assembly and control system therefore An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit c... | 04/02/2002 |
| 6330153 | Method and system for efficiently removing heat generated from an electronic device A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an elect... | 12/11/2001 |
| 6292364 | Liquid spray cooled module A radar system and method of cooling same. In the illustrative embodiment, the inventive system includes a radar array comprising a circuit board; a plurality of radiating elements printed on the circuit board; and a plurality of transmit and receive modu... | 09/18/2001 |
| 6256198 | Method and an apparatus for air-cooling In cooling electrical devices (205) a Laval nozzle, is used for obtaining a cooling effect. The nozzle can be located close to the electrical device (205), which it is intended to cool, whereas the unit (209) supplying the nozzle with air, for example a f... | 07/03/2001 |
