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| Number | Title | Issue Date |
| 7443675 | Heat pipe with guided internal grooves and heat dissipation module incorporating the same A heat pipe includes a heat receiving section, a heat transfer section, and a heat dissipation section. A groove structure is formed inside the heat pipe and extends from the heat receiving section to the heat dissipation section. The groove structure includes at le... | 10/28/2008 |
| 7440278 | Water-cooling heat dissipator A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the f... | 10/21/2008 |
| 7433190 | Liquid cooled electronic chassis having a plurality of phase change material reservoirs A system and method of thermal management of electrical and electronic systems and components that adequately maintains the temperatures of the system electronics and electrical devices within reliable limits during various postulated system malfunctions. The system... | 10/07/2008 |
| 7428150 | Computing platform component cooling with quick disconnect Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat dissipation device thermally coupled to a processor mounted on a printed circui... | 09/23/2008 |
| 7414846 | Cooling structure for interface card A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat i... | 08/19/2008 |
| 7390427 | Hydrofluoroether as a heat-transfer fluid The present invention provides an apparatus comprising a device and a mechanism for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is represented by the following structure: Rf—O—Rh... | 06/24/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7372698 | Electronics equipment heat exchanger system An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near ... | 05/13/2008 |
| 7352577 | Liquid-cooled heat dissipation module A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump;... | 04/01/2008 |
| 7349213 | Coolant control unit, and cooled electronics system and method employing the same A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and secon... | 03/25/2008 |
| 7342789 | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few... | 03/11/2008 |
| 7339792 | Graphics card apparatus with improved heat dissipating assemblies A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewith... | 03/04/2008 |
| 7325589 | Passive fluid recovery system A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic ... | 02/05/2008 |
| 7321491 | Heat sink for a portable computer A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portab... | 01/22/2008 |
| 7319589 | Cooling system for an electronic display A cooling system for an electronic display may include a heat collector plate with internal gas and liquid phase lines. The cooling plate may be thermally isolated together with electronic components of the display within an enclosure of the display, while external ... | 01/15/2008 |
| 7317616 | Mechanism for connecting loop heat pipe and method therefor A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body includes at least a through hole for inserting therein at least two ... | 01/08/2008 |
| 7317615 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a p... | 01/08/2008 |
| 7312986 | Cooling device for an electronic apparatus A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump cham... | 12/25/2007 |
| 7309453 | Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is esp... | 12/18/2007 |
| 7298620 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects ... | 11/20/2007 |
| 7298619 | Cable management arm with integrated heat exchanger In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at least two arm members, at least one flexible coupling configured to ... | 11/20/2007 |
| 7295441 | Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed o... | 11/13/2007 |
| 7283360 | Enhanced flow channel for component cooling in computer systems An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a comp... | 10/16/2007 |
| 7278474 | Heat exchanger A heat exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (... | 10/09/2007 |
| 7280358 | Liquid loop with multiple heat exchangers for efficient space utilization A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability. ... | 10/09/2007 |
| 7251137 | Electronic component cooling apparatus An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for givin... | 07/31/2007 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7243706 | Heatsink for power devices A heatsink for a power device comprises an upper conductive plate providing a first surface; a lower conductive plate providing a second surface; a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a so... | 07/17/2007 |
| 7245495 | Feedback controlled magneto-hydrodynamic heat sink A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is ... | 07/17/2007 |
| 7237337 | Heat dissipating apparatus having micro-structure layer and method of fabricating the same The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the struc... | 07/03/2007 |
| 7234514 | Methods and systems for compact, micro-channel laminar heat exchanging A heat exchanging core for a micro-channel heat exchanger includes at least one heat conducting plate, which has at least one channel formed between a first side and a second side of the heat conducting plate. The at least one channel has a channel length to hydraul... | 06/26/2007 |
| 7233493 | Electronic device having a temperature control system including a ductwork assembly A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in ord... | 06/19/2007 |
| 7224586 | Method of maintaining an IC-module near a set-point A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplet... | 05/29/2007 |
| 7215547 | Integrated cooling system for electronic devices The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The ... | 05/08/2007 |
| 7206203 | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold.... | 04/17/2007 |
| 7190583 | Self contained, liquid to air cooled, memory test engineering workstation Although various embodiments of the method and apparatus of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it will be understood that the invention is not limited to the embodiments discl... | 03/13/2007 |
| 7188662 | Apparatus and method of efficient fluid delivery for cooling a heat producing device A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the ... | 03/13/2007 |
| 7185512 | Installation for the very long storage of products that emit a high heat flux An installation for very long term storage of products emitting a high thermal flux. The installation comprises a container (14), in which the products to be stored are placed, and an evaporator (22) surrounding the container, to evacuate the heat thro... | 03/06/2007 |
| 7187545 | Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for intr... | 03/06/2007 |
