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| Number | Title | Issue Date |
| 7677298 | Jointing structure of a heat dissipating fin A jointing structure of a heat dissipating fin, disposed on an upper level edge and a lower level edge of each fin body of the heat dissipating fin, comprises at least one hole or more on each of the level edges, at least one lock tab or more on the fin body of the ... | 03/16/2010 |
| 7669642 | Thermal module A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. Wit... | 03/02/2010 |
| 7661461 | Cooling device for CPU A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cool... | 02/16/2010 |
| 7661462 | Heat dissipation assembly A heat dissipation assembly includes a heat sink and a fan. The heat sink device has a base and a plurality of fins formed on the base, the fins are parallel with each other, one or more of the fins cooperatively form at least two concave engagement parts. The fan h... | 02/16/2010 |
| 7654308 | Heat exchanger A heat exchanger which has a base plate and several carrier plates projecting from the base plate. At least one cooling element is located on each carrier plate. The cooling elements have a substrate with an underside and an upper side. Webs project from the upper s... | 02/02/2010 |
| 7654309 | Heat dissipation device A heat dissipation device includes a heat sink (10), a fan (20) disposed on top of the heat sink, a fan duct (30) arranged on the fan and a fan guard (40) sandwiched between the fan and the fan duct. The fan defines a through hole (26 | 02/02/2010 |
| 7650928 | High performance compact thermosiphon with integrated boiler plate A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least dist... | 01/26/2010 |
| 7650929 | Cooler module A horizontal cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, and heat pipes each having a first extension arm respectively tightly inserted through the radiation fins and a se... | 01/26/2010 |
| 7647960 | Heat dissipation device A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and towar... | 01/19/2010 |
| 7644751 | Clip for heat sink A heat sink clip (100) includes a spring member (10), a moveable locking member (20) and an actuating member (30). The spring member includes an elongated main body (11) and a first locking leg (14) connecting at one end of ... | 01/12/2010 |
| 7640968 | Heat dissipation device with a heat pipe A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for c... | 01/05/2010 |
| 7637310 | Heat dissipation device with fixtures for attachment of a fan A heat dissipation device includes a heat sink (10) and a fan (30) mounted on the heat sink via a pair of fan holders (20) and clips (40). The fan holders each have a supporting plate (24) attached on the heat sink and a sleeve ( | 12/29/2009 |
| 7637311 | Heat dissipation device A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base a... | 12/29/2009 |
| 7621316 | Heat sink with heat pipes and method for manufacturing the same A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermall... | 11/24/2009 |
| 7612992 | Cooling device for memory chips A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation hole... | 11/03/2009 |
| 7610948 | Cooler module A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves o... | 11/03/2009 |
| 7610947 | Heat-dissipating model A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with ... | 11/03/2009 |
| 7604041 | Heat sink clip A heat sink clip for securing a heat sink to a heat generating electronic component includes a spring member including an elongated main body. A connecting portion is formed at one end of the main body and a first locking leg extends from the other end thereof. A se... | 10/20/2009 |
| 7604040 | Integrated liquid cooled heat sink for electronic components A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper porti... | 10/20/2009 |
| 7600558 | Cooler A cooler comprises a base, a set of radiator fins and a plurality of heat pipes going through the base and the radiator fins. The lower surface of the base is further provided with a recess wherein part of the heat pipes is exposed, whereby a heat-generating element... | 10/13/2009 |
| 7597133 | Heat dissipation device with heat pipes A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin... | 10/06/2009 |
| 7597134 | Heat dissipation device with a heat pipe A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing... | 10/06/2009 |
| 7584780 | Active heat sink structure with flow augmenting rings and method for removing heat An active heat sink is described for use in the transfer of heat from a heat generating device such as a semiconductor chip and the like with a heat sink having an embedded fan surrounded by a plurality of heat conducting flow augmenting rings separated by apertures... | 09/08/2009 |
| 7568518 | Heat sink A heat sink includes a fin unit (10) having a plurality of fins (20) parallel to each other. A flow channel (21) is formed between any of two neighboring fins for an airflow flowing therethough. Three protrusions (26, 27, 28) are arranged... | 08/04/2009 |
| 7556087 | Heat dissipating module The present invention discloses a heat dissipating module applied to a low-level chip for dissipating the heat produced by the low-level chip. The heat dissipating module has a base, and the base accommodates a fan. The base includes first and second fin modules, an... | 07/07/2009 |
| 7556086 | Orientation-independent thermosyphon heat spreader Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peri... | 07/07/2009 |
| 7556088 | Thermosiphon for laptop computer A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc ... | 07/07/2009 |
| 7537046 | Heat dissipation device with heat pipe A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) fo... | 05/26/2009 |
| 7530388 | Heat sink A heat sink includes first and second fin sets. The first fin set includes a plurality of fins each having a flange extending perpendicularly from an edge thereof and oriented in a same first direction. The flanges engage with each other in succession through lockin... | 05/12/2009 |
| 7520314 | Heat dissipation apparatus A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of laminar fins (121) thermally connectin... | 04/21/2009 |
| 7520313 | Locking device for heat sink A locking device (100) used for securing a heat sink (10) to a heat-generating component in accordance with an embodiment includes a pair of retainers (20). The locking device cooperates with a retention frame (30) to secure the heat sink... | 04/21/2009 |
| 7509995 | Heat dissipation element for cooling electronic devices A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating hea... | 03/31/2009 |
| 7509996 | Heat dissipation device A heat dissipation device includes a heat spreader (100), a fin assembly (300) located above the heat spreader and a heat pipe (400). The heat spreader has a bottom (110) for contacting a heat-generating component (500) and an uppe... | 03/31/2009 |
| 7509997 | Heat sink A heat sink includes a first array of fins defining a plurality of first channels therebetween, a second array of fins disposed at opposite sides of the first array of fins, and a plurality of grooves extending through the first array of fins and the second array of... | 03/31/2009 |
| 7497248 | Twin fin arrayed cooling device A cooling device including a core with a plurality of twin fins connected with a plurality of grooves on the core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twi... | 03/03/2009 |
| 7497249 | Thermosiphon for laptop computer A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end ... | 03/03/2009 |
| 7472742 | Heat sink assembly In a cooling system for cooling power electronics on a locomotive where the cooling system includes a finned heat sink that has air passing therethrough an airway passage to reach a plurality of fins where reducing airborne debris clogging of the plurality of fins i... | 01/06/2009 |
| 7458415 | Cooling apparatus and electronic equipment The rotation of axial-flow blades permits air entered through an inlet port to exit directly to outside of a case in the axial direction, and the rotation of centrifugal blades permits air entered through the inlet port to exit through a side surface outlet port to ... | 12/02/2008 |
| 7441590 | Radiator for semiconductor A radiator for a semiconductor includes a main body which is provided for radiating heat from the semiconductor mounted to a substrate, and a plate member attached to the main body. The plate member is provided to have an elasticity relative to the substrate. The pl... | 10/28/2008 |
| 7443684 | Heat sink apparatus The present invention relates to a heat sink apparatus, which discloses that by using a meshed member as a heat sink member, the heat-sinking efficiency will be enhanced owing to increased surface areas. Furthermore, a first linear member is made to contact with a s... | 10/28/2008 |