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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 8028743 | Passive cooling in response to ambient environmental properties A system for passively cooling an electronic component includes a conduit configured to carry a pressurized cooling fluid. The conduit has a plurality of delivery orifices configured to dispense the pressurized cooling fluid from the conduit to cool the electronic c... | 10/04/2011 |
| 7950445 | Combined assembly of fixing base and heat pipe A combined assembly of a fixing base and heat pipes includes a fixing base and at least one heat pipe. The fixing base has a plate body. The bottom surface of the plate body is formed with a transverse opening trough. The opening trough is provided with a through-ho... | 05/31/2011 |
| 7934539 | Electronic apparatus and cooling module A thermal conductive member is mounted on a heat generating object. An air cooling member is attached to the thermal conductive member for radiating heat into air. A liquid cooling member is removably attached to the thermal conductive member for absorbing heat from... | 05/03/2011 |
| 7918267 | Heat dissipation device having cap for protecting thermal interface material thereon A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engagin... | 04/05/2011 |
| 7891410 | Devices for heat exchange A device and method that exchanges heat is described, which includes intaking air into a chamber and then forcing air from holes of a heat conducting surface that fluidly communicate with the chamber to create a toroidal mass of air resulting from vortex shedding. A... | 02/22/2011 |
| 7878232 | Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side o... | 02/01/2011 |
| 7866372 | Method of making a heat exchanger core component In an embodiment of the invention, there is provided a method of making a heat exchanger core component comprising the steps of generating a stereolithography file from design data, slicing the stereolithography file into two-dimensional patterns, repeating the two-... | 01/11/2011 |
| 7766074 | Heat-dissipating device having air-guiding structure A heat-dissipating device having an air-guiding structure includes a heat-conducting seat, a fin assembly, at least one heat pipe for serially connecting to the fin assembly and the heat-conducting seat, and a fan assembly unit. The fin assembly is positioned above ... | 08/03/2010 |
| 7721789 | Heat pipe type cooler To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a... | 05/25/2010 |
| 7721788 | Cooling jacket A cooling jacket for cooling a heat-generating element through transmitting heat-generation into a coolant flowing within an inside of the cooling jacket, which is mounted within an electronic apparatus, and includes a base portion, and a cover portion. The base por... | 05/25/2010 |
| 7712518 | Heat dissipation apparatus A heat dissipation apparatus used in a computer comprises a heat sink and a star-shaped spring with multiple directional arms, wherein each directional arm extends in a corresponding direction, and the tangent direction of the corresponding contact boundary formed b... | 05/11/2010 |
| 7600557 | Heat sink mechanism A heat sink mechanism includes a fixed and a movable clamping piece, at least one adjusting gearwheel rotatably mounted to and between the fixed and the movable clamping piece via a fixing shaft while an end of the fixing shaft is screwed to the movable clamping pie... | 10/13/2009 |
| 7568517 | Thermal module A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another... | 08/04/2009 |
| 7493937 | Heat sink mounting device A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to ... | 02/24/2009 |
| 7478667 | Heat sink clip and assembly A heat sink clip and an assembly incorporating such clip are provided. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member is pivotably mounted to the secur... | 01/20/2009 |
| 7472741 | Foil slot impingement cooler with effective light-trap cavities A slot impingement cooler is formed of a plurality of sets of foils in a stacked and registered array. In each set of foils, a first foil has supply slots that direct a flow of coolant, a second foil has a plurality of effective light-trap cavities, a third foil has... | 01/06/2009 |
| 7464747 | Cooling device for heat-generating elements A cooling device for cooling heat generating elements in which a cooling effect is produced by collision of a coolant with the back face side of the heat-generating elements. The coolant can be introduced into a coolant introduction chamber and is then introduced in... | 12/16/2008 |
| 7443673 | Cooling function power adapter The cooling function power adapter inserts between the ionization gauge tube prongs and the power socket. Its unique cooling function dissipates the heat generated by the ionization gauge tube working under large power current. This adapter also lowers the working t... | 10/28/2008 |
| 7441590 | Radiator for semiconductor A radiator for a semiconductor includes a main body which is provided for radiating heat from the semiconductor mounted to a substrate, and a plate member attached to the main body. The plate member is provided to have an elasticity relative to the substrate. The pl... | 10/28/2008 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7438124 | Evaporative cooling system for a data-communications cabinet An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electr... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7436673 | Heat sink fixing assembly A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the e... | 10/14/2008 |
| 7430119 | Impeller and aligned cold plate According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle.... | 09/30/2008 |
| 7422051 | System and method for using a flexible composite surface for pressure-drop free heat transfer enhancement and flow drag reduction A flexible composite sheet (FCS) comprising a membrane, a substrate coupled to the membrane, and a plurality of ridges coupled between the membrane and the substrate, wherein a vibratory motion is induced from the flow to at least one segment of membrane spanning a ... | 09/09/2008 |
| 7423881 | Arrangement and method for cooling a power semiconductor In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric component. Further, a cooling element is thermally conductively connected... | 09/09/2008 |
| 7417859 | Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a plasma display panel and includes an electronic device covered by a prot... | 08/26/2008 |
| 7417864 | Gear driven socket activation mechanism A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component. ... | 08/26/2008 |
| 7417863 | Cooling device for folder type portable wireless terminal Disclosed is a cooling device for a folder type portable wireless terminal including a main body and an openable folder coupled with the main body. In the cooling device, a cooling plate is installed in the folder with a predetermined size, and a heat transfer eleme... | 08/26/2008 |
| 7415836 | Cooling apparatus and a thermostat with the apparatus installed therein A cooling apparatus (1) has a compressor (2), a condenser (3), an expansion valve (5), an evaporator (6) and an electric valve (10), all connected to each other in this order by a piping line to form a refrigeration circuit.... | 08/26/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7405936 | Hybrid cooling system for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/29/2008 |
| 7400507 | Fastening structure A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member, a heat spreader having its attached side connected to the heatsink module, he... | 07/15/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7394657 | Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pres... | 07/01/2008 |
| 7388750 | Plasma display module A plasma display module, which can effectively dissipate heat, is disclosed. In one embodiment, the plasma display module includes i) a plasma display panel that displays images using gas discharge, ii) a chassis located on one surface of the plasma display panel to... | 06/17/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7382617 | Heat sink assembly A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory mo... | 06/03/2008 |
| 7375970 | High density memory module using stacked printed circuit boards A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit ... | 05/20/2008 |
