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| Number | Title | Issue Date |
| 7836939 | Non-contacting thermal rotary joint An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surfac... | 11/23/2010 |
| 7694717 | Profile traced insulated cover assembly A cover assembly (10) is provided and includes a flexible fabric cover (21) within which a plurality of elongate, hollow thermal transfer fluid profiles (12) is positioned. Each of the profiles includes an arcuate outer surface (13) adapt... | 04/13/2010 |
| 7405935 | Service tray for a thermal management system A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within ... | 07/29/2008 |
| 7370692 | Heat dissipating structure having different compactness A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each o... | 05/13/2008 |
| 7360582 | Flow distributing unit and cooling unit having bypass flow A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are c... | 04/22/2008 |
| 7349217 | IC socket assembly The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit b... | 03/25/2008 |
| 7333334 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which... | 02/19/2008 |
| 7331097 | Method of manufacturing a workpiece chuck A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers app... | 02/19/2008 |
| 7325772 | Aircraft heat sink and electronics enclosure An aircraft component including a first section adapted to be attached at an exterior surface of an aircraft to close an access opening through the exterior surface; and a second section extending outward from the first section and forming heat transfer surfaces to ... | 02/05/2008 |
| 7325588 | High serviceability liquid cooling loop using flexible bellows A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movemen... | 02/05/2008 |
| 7287575 | Component for supporting a filter member, a device including a tubular filter member and said component, a plate heat exchanger including a tubular filter member and said component The invention relates to a component (20) for supporting a tubular filter member (15) in a portable channel (2) in a plate heat exchanger (1). The invention also relates to a device including the component (20) and the filter membe... | 10/30/2007 |
| 7283366 | Electrical connection box An electrical connection box includes a plurality of circuit components at least partially overlapped one above the other and substantially arranged in parallel. Each of the circuit components includes a substrate having a switching member and an electrical power co... | 10/16/2007 |
| 7274005 | Bake plate having engageable thermal mass A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageab... | 09/25/2007 |
| 7269009 | Case for covering electronic parts and display apparatus including the same A case for covering electronic parts and efficiently discharging heat generated from the electronic parts and a display apparatus including the case are provided. The case includes at least one partition wall partially separating at least an inner space of the case.... | 09/11/2007 |
| 7264768 | Single substrate annealing of magnetoresistive structure A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic fiel... | 09/04/2007 |
| 7265985 | Heat sink and component support assembly A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 1... | 09/04/2007 |
| 7238084 | Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the ... | 07/03/2007 |
| 7237606 | Wafer supporter A wafer supporting unit (10) includes a base (12) and a thermally conductive member (14). The base is formed by nickel material. The thermally conductive member is formed in the shape of a lamina, includes silicone rubber (16) serving as ... | 07/03/2007 |
| 7237392 | System for preparing cutaneous tissue samples for oncological histology study and diagnosis A method and apparatus for preparing tissue specimens for histological study utilizing two connectable sections each with hollowed cylinders for receiving first and second buttons, each button including planar disc and cylindrical stem portions, such that the stem p... | 07/03/2007 |
| 7231964 | Cooling appliance for hot beverages A cooling appliance for cooling hot beverages has a base, a heat conducting bar and an electric fan. The heat conducting bar is mounted securely in the base. The electric fan is attached to the base. The heat conducting bar extends into the hot beverages and transmi... | 06/19/2007 |
| 7225859 | Heat exchanger element and heat exchanger member for a stirling cycle refrigerator and method of manufacturing such a heat exchanger member A heat exchanger element for a Stirling cycle refrigerator is produced by integrally forming an annular corrugate fin that is produced by forming a sheet material, corrugated so as to have a large number of grooves, into a cylindrical shape with the grooves parallel... | 06/05/2007 |
| 7223308 | Apparatus to improve wafer temperature uniformity for face-up wet processing A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the ... | 05/29/2007 |
| 7220175 | Device for carrying thin wafers and method of carrying the thin wafers A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity ... | 05/22/2007 |
| 7216696 | External flue heat exchangers A heat exchanger is mounted external to a section of flue pipe or is an integral part of a section of flue pipe. The heat exchanger preheats a domestic hot water supply and boosts the return water temperature prior to reentry to the furnace coil. The heat exchanger ... | 05/15/2007 |
| 7208195 | Methods and apparatus for deposition of thin films A method for depositing a thin film includes the steps of providing a vapor including at least one selected vapor phase component into an evacuated chamber and condensing the vapor onto a heated substrate to form a liquid phase deposit wherein a temperature of the s... | 04/24/2007 |
| 7200006 | Compliant thermal interface for electronic equipment A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and he... | 04/03/2007 |
| 7195056 | Thermal control covers A heat transfer cover mitigates temperature changes of an object. A cover body is configured to receive the object. A plurality of heat transfer channels are defined in an interior of the cover body. The channels are arranged to transport a heat transfer fluid in th... | 03/27/2007 |
| 7180737 | Heat exchanger system for circuit card assemblies An apparatus for housing and cooling circuit card assemblies employed in communication and other systems is disclosed including a chassis having opposed end walls which are formed with a series of spaced inlet card guides and correspondingly spaced outlet card guide... | 02/20/2007 |
| 7173819 | Laptop computer cooling device A device for cooling a computer, the device including a housing with a sidewall and a bottom forming an inner cavity, a horizontal board having a first end and a second end disclosed within the inner cavity, a motor connected to the horizontal board to rotate the ho... | 02/06/2007 |
| 7163587 | Reactor assembly and processing method A reactor assembly and processing method for treating a substrate generally includes a base unit, a chuck assembly, a process chamber, an inlet manifold assembly and an exit manifold assembly. The inlet manifold assembly is in fluid communication with a first openin... | 01/16/2007 |
| 7156924 | System and method for heating and cooling wafer at accelerated rates A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different points of the wafer. ... | 01/02/2007 |
| 7135877 | Temperature and condensation control system for functional tester An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a fe... | 11/14/2006 |
| 7118334 | Fan and fastening element and method of assembling An improved structure and method for mounting a fan, particularly a miniature fan (3), in a supporting wall (4), both facilitates a mounting operation and minimizes noise conduction after the mounting operation. An elastomeric overcoat (1) at le... | 10/10/2006 |
| 7105836 | Method and apparatus for cooling a reticle during lithographic exposure Systems and methods eliminate vibrations produced by coolant fluid flowing through a short stroke stage and prevent change in thermally-induced distortion of the short stroke stage by maintaining the temperature and temperature distribution within the short stroke s... | 09/12/2006 |
| 7106416 | Lithographic apparatus and device manufacturing method A lithographic apparatus including an illumination system for providing a beam of radiation and a support structure for supporting a patterning device. The patterning device serving to impart the beam with a pattern in its cross-section. The apparatus also having a ... | 09/12/2006 |
| 7100389 | Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant ... | 09/05/2006 |
| 7044195 | Heat dissipation structure A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one pene... | 05/16/2006 |
| 7033444 | Plasma processing apparatus, and electrode structure and table structure of processing apparatus An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object (W) to be processed by using a plasma in a process chamber (26) in which a vacuum can be formed. An electrode unit (38) has a heater unit (... | 04/25/2006 |
| 7024266 | Substrate processing apparatus, method of controlling substrate, and exposure apparatus A substrate processing apparatus includes a first chamber, a second chamber which has a first valve, a second valve and a chuck, wherein a substrate is transferred to the second chamber through the first valve, held by the chuck in the second chamber, and then trans... | 04/04/2006 |
| 7017358 | Apparatus and method for controlling the temperature of an electronic device An apparatus for controlling the temperature of an electronic device under test includes a thermal head. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the therma... | 03/28/2006 |
