Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 8187762 | Fuel cell cooling device with ion extraction medium A fuel cell cooling device has a cooling loop for circulating a coolant fluid. At least during the operation of the fuel cell, an ion extraction medium that is in the liquid state is provided. A method for cleaning a coolant with a corresponding fuel cell cooling de... | 05/29/2012 |
| 8162038 | Heat sink assembly A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket i... | 04/24/2012 |
| 8087453 | Programmable controlled heat dissipating fan A programmable controlled heat dissipating fan is comprised of a base, a stator assembly, a magnet frame assembly, a fan blade assembly, an inductor set, a first circuit board and a second circuit board. The stator assembly is firmly installed in the base, while the... | 01/03/2012 |
| 8079406 | Thermal module A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip ( | 12/20/2011 |
| 8069909 | Heat dissipation device A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a fir... | 12/06/2011 |
| 8061414 | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof A boil cooling method forms, with a surface of an object to be cooled or a surface of a heating member in close contact with the surface of the object to be cooled made to serve as a cooling surface, a main flow channel and a sub-flow channel for a cooling liquid fr... | 11/22/2011 |
| 8047270 | Heat dissipation device having heat pipes for supporting heat sink thereon A heat dissipation device includes a base, a fin group located at a top of the base, a fan mounted on a top of the fin group, a first heat pipe and a second heat pipe. The first and second heat pipes connect with the base and the fin group and each includes a conden... | 11/01/2011 |
| 8020611 | Heat dissipating device having G-shaped heat pipes and heat sinks A heat dissipation device includes two heat pipes, three extruded heat sinks and a heat conducting plate. Each heat pipe has a substantially G-shaped configuration and includes a heat absorbing section and first and second heat dissipating sections. The first and se... | 09/20/2011 |
| 8006747 | Micro-chimney and thermosiphon die-level cooling A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit... | 08/30/2011 |
| 7921903 | Heat exchange system A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling circuit and a secondary cooling circuit both being thermally associat... | 04/12/2011 |
| 7891414 | Method for manufacturing heat dissipator having heat pipes and product of the same A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut a... | 02/22/2011 |
| 7870890 | Heat dissipation device with heat pipe A heat dissipation device includes a base for thermally engaging with an electronic device, a fin assembly including of multiple fins, a first heat pipe and a second heat pipe. The first heat pipe includes two evaporation sections engaged in the base, two interconne... | 01/18/2011 |
| 7866375 | Heat dissipation device with heat pipes A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving sect... | 01/11/2011 |
| 7866376 | Heat dissipation device with U-shaped and S-shaped heat pipes A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion a... | 01/11/2011 |
| 7861768 | Heat sink A heat sink having an embedded heat pipe and fins attached to opposite sides of a base plate having a heat spreader component made of a diamond copper composite is disclosed. In various embodiments, the diamond copper composite heat spreader contains channels for re... | 01/04/2011 |
| 7857037 | Geometrically reoriented low-profile phase plane heat pipes A cooling system for removing heat from at least one heat generating component with a first low-profile phase plane heat pipe having a geometrically reoriented surface adapted for receiving heat from the at least one heat generating component along a first section o... | 12/28/2010 |
| 7845395 | Heat-dissipating casing structure A heat-dissipating casing structure includes a base seat, a heat-dissipating module, and a casing. The heat-dissipating module is disposed on the base seat. The heat-dissipating module has a first heat-conducting block and a heat pipe, and one side of the heat pipe ... | 12/07/2010 |
| 7841388 | Radiating fin assembly for thermal module A radiating fin assembly for a thermal module includes a plurality of radiating fins being mounted on a top of a heat radiating base of the thermal module with a heat pipe located between the radiating fins and the base. Each of the radiating fins is provided at a p... | 11/30/2010 |
| 7819175 | Hybrid heat sink with recirculating fluid and interleaving fins A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat sour... | 10/26/2010 |
| 7802616 | Heat dissipation apparatus with heat pipes A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion conta... | 09/28/2010 |
| 7779897 | Heat dissipation device with heat pipes A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has... | 08/24/2010 |
| 7770632 | Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines... | 08/10/2010 |
| 7766076 | Spot cooler for heat generating electronic components A cooler for heat generating electronic components comprising a heat exchange plate configured for heat exchange communication with one or more heat generating electronic components includes a fin stack having a plurality of heat exchange fins and one or more heat p... | 08/03/2010 |
| 7757751 | Heat dissipation device A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate compri... | 07/20/2010 |
| 7753110 | Heat dissipation device A heat dissipation device includes a base adapted for absorbing heat from an electronic device, a heat spreader located above the base, a first fin assembly including a plurality of fins arranged between the base and the heat spreader, and a heat pipe thermally cont... | 07/13/2010 |
| 7753109 | Heat dissipation device with heat pipes A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes eac... | 07/13/2010 |
| 7746631 | Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat g... | 06/29/2010 |
| 7740054 | Heat dissipation device A heat dissipation device includes a heat dissipation fin module, a heat pipe and a centrifugal fan. The heat pipe is connected to the heat dissipation fin module at one end and connected to a heat generating source at an opposite end. The centrifugal fan includes a... | 06/22/2010 |
| 7726385 | Heat dissipation interface for semiconductor chip structures The present invention is directed to a modular heat dissipating device that consists of a plurality of sheet and beam members which are connected together by heat pipes. The sheet or support fin member is constructed by folding a piece of heat conducting material wh... | 06/01/2010 |
| 7703503 | Heat pipe heat exchanger and method of fabricating the same A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base porti... | 04/27/2010 |
| 7694727 | Heat dissipation device with multiple heat pipes A heat dissipation device includes a base for contacting an electronic device. Two first heat pipes are arranged on and thermally engaged with the base for absorbing heat from the electronic device and spread the heat to the base. Each of the two first heat pipes is... | 04/13/2010 |
| 7688579 | Portable electronic device incorporating thermal module A portable electronic device includes a casing, an electronic component disposed in the casing, and a thermal module for dissipating heat of the electronic component. The thermal module includes a heat pipe, a fin unit, and a transverse fan. The heat pipe includes a... | 03/30/2010 |
| 7665511 | Orientation insensitive thermosiphon capable of operation in upside down position The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to an... | 02/23/2010 |
| 7661466 | Heat sink assembly having a fin also functioning as a supporting bracket A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins ... | 02/16/2010 |
| 7658223 | Boiling and cooling device A refrigerant tank includes a base plate made of cooper and a reinforcing frame made of stainless steel. A block made of copper extends through the reinforcing frame and has one face in contact with the base plate and an opposite face in contact with a heating body.... | 02/09/2010 |
| 7654310 | Loop heat pipe A loop heat pipe includes an evaporator and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, t... | 02/02/2010 |
| 7650932 | Loop heat pipe A loop heat pipe includes an evaporator and a sealed pipe. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, t... | 01/26/2010 |
| 7644753 | Domed heat exchanger (porcupine) Three embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1-2, 3 and 4 and each comprises a flange, a dome, a plurality of condensing tubes, a shroud, and a boiler plate. In the first embodim... | 01/12/2010 |
| 7637312 | Unitary field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components A field-replaceable active pumped liquid heat sink module includes a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The li... | 12/29/2009 |
| 7631686 | Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a reservoir (14) distant from the heat sink, a duct (16) connecting with the reservoir, a flexible tube (18) connected to the duct and the heat sink, and a heat-transfer membe... | 12/15/2009 |
