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| Number | Title | Issue Date |
| 8162036 | Heat pipe structure and flattened heat pipe structure A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The c... | 04/24/2012 |
| 8136580 | Evaporator for a heat transfer system A heat transfer system includes an evaporator having a heated wall, a liquid barrier wall containing working fluid, a primary wick positioned between the heated wall and an inner side of the liquid barrier wall, a vapor removal channel located at an interface betwee... | 03/20/2012 |
| 8109325 | Heat transfer system A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator including a wall configure... | 02/07/2012 |
| 7958935 | Low-profile thermosyphon-based cooling system for computers and other electronic devices This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to eva... | 06/14/2011 |
| 7938171 | Vapor cooled heat exchanger A heat exchanger system includes a first fluid layer defining a first flowpath for a gas, a second fluid layer defining a second flowpath for a liquid, a first vapor cycle layer located between the first fluid layer and the second fluid layer for enabling heat trans... | 05/10/2011 |
| 7841386 | Anti-breaking structure for end closure of heat pipe An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between... | 11/30/2010 |
| 7708053 | Heat transfer system A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator including a wall configure... | 05/04/2010 |
| 7694725 | Heat dissipation system A heat dissipation system and a making method thereof are disclosed in accordance with a preferred embodiment. The heat dissipation system mainly includes a body, a cover, and a working fluid. The body includes an evaporation chamber having a first side entryway and... | 04/13/2010 |
| 7686069 | Cooling apparatus having low profile extrusion and method of manufacture therefor A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process. ... | 03/30/2010 |
| 7665508 | Heat pipe A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the... | 02/23/2010 |
| 7661464 | Evaporator for use in a heat transfer system An evaporator includes a cylindrical barrier wall and a cap that fits at an end of the cylindrical barrier wall. The cylindrical barrier wall defines a central axial opening and an outer cylindrical surface. The cap includes an outer surface that is external to the ... | 02/16/2010 |
| 7621318 | Heat pipe structure An exhaust path and a heated portion such as an air duct of an internal combustion engine are connected to each other by a heat pipe. A heat pipe working fluid (water) vaporized by the heat of the exhaust gas in a heat receiving portion of the heat pipe is condensed... | 11/24/2009 |
| 7578338 | Heat dissipating apparatus having micro-structure layer and method of fabricating the same A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure laye... | 08/25/2009 |
| 7575045 | Heat dissipating device A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for p... | 08/18/2009 |
| 7543629 | Type of loop heat conducting device This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core... | 06/09/2009 |
| 7461688 | Heat transfer device The heat transfer device at least comprises: an evaporator, a heat conductor and a connecting pipe. The evaporator comprises: a first hollow tube; a porous core mortised inside the first hollow tube; and a second hollow tube mortised on the first hollow tube. The he... | 12/09/2008 |
| 7443677 | Heat dissipation device A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat... | 10/28/2008 |
| 7441592 | Cooler module A cooler module includes a metal base member, which has accommodation grooves, clamping strips respectively extending along two sides of each accommodation groove, and positioning grooves between each two adjacent accommodation grooves; U-shaped heat tubes that have... | 10/28/2008 |
| 7440279 | Heat dissipation device A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove... | 10/21/2008 |
| 7430803 | Gas removing apparatus for removing non-condensate gas from a heat pipe and method for the same A method and gas removing apparatus removes non-condensate gas from a heat pipe. The gas removing apparatus includes at least one heating unit, a sealing unit and a height-adjusting unit. The heating unit heats the heat pipe and includes a clip to clamp the heat pip... | 10/07/2008 |
| 7430804 | Apparatus and method for manufacturing heat pipe A method of manufacturing a heat pipe, including the steps of: providing a hollow body with an open end and an opposite close end; filling a predetermined quantity of working fluid into the hollow body through the open end thereof after an interior of the hollow bod... | 10/07/2008 |
| 7429720 | Electric heating pipe and electric heating apparatus using it The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast hea... | 09/30/2008 |
| 7424906 | High performance thermosiphon with internally enhanced condensation A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the ele... | 09/16/2008 |
| 7422052 | Low profile thermosiphon A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entran... | 09/09/2008 |
| 7416017 | Method and apparatus for cooling with a phase change material and heat pipes A cooling apparatus (10) includes a housing defined by two aluminum parts (12, 13) which are brazed to each other. A plurality of sector-shaped recesses (21-28) are provided within the housing, and collectively define a chamber having a p... | 08/26/2008 |
| 7404255 | Apparatus and method for removing non-condensing gas in heat pipe An apparatus and a method for removing non-condensing gas in heat pipe are disclosed, In this method, a resilient pad is abutted against an opening of a pipe body of the heat pipe after a working fluid is filled into the heat pipe. The heat pipe is then heated to re... | 07/29/2008 |
| 7403384 | Thermal docking station for electronics For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interf... | 07/22/2008 |
| 7401643 | Heat exchange foam A method and an apparatus for the efficient transfer of heat utilizing micro heat pipes that include a cellular foam or interconnected cellular/truss network having hollow ligaments. A predetermined fraction of the internal volume of the hollow ligaments is filled w... | 07/22/2008 |
| 7391612 | Dual impeller push-pull axial fan sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/24/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385815 | Dual impeller push-pull axial fan A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7385816 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7383688 | Superconducting device having a cryogenic system and a superconducting switch The superconducting device has a cryogenic system to whose first refrigerant there is thermally coupled a superconducting unit and a superconducting switching path, which is electrically connected to said unit and is to be activated thermally by a heater, of a super... | 06/10/2008 |
| 7369412 | Heat dissipation device A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-... | 05/06/2008 |
| 7367385 | Optimized fins for convective heat transfer The invention includes a heat transfer geometry having first and second flow channels in parallel with each other. The flow cross-sectional area of individual channels varies along the length of the flowpath, with one channel undergoing an expansion and the other un... | 05/06/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7365978 | Heat dissipating device A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between ... | 04/29/2008 |
| 7363966 | Heat dissipating device A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20... | 04/29/2008 |
| 7365982 | Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a reservoir (14) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member includes a heat-absorbing segment (162) contacting the... | 04/29/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
