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| Number | Title | Issue Date |
| 7655103 | Ceramic multilayer substrate and method for manufacturing the same In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including a... | 02/02/2010 |
| 7517418 | Production method of electronic device having internal electrode A release layer 22 is formed on a surface of a first supporting sheet 20. Next, an electrode layer 12a is formed on a surface of the release layer 22. When the electrode layer 12a is pressed against a surface of a gre... | 04/14/2009 |
| 7402220 | Method for manufacturing multi-layered unit for multi-layered ceramic electronic component It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an el... | 07/22/2008 |
| 7396425 | Method of production of peeling layer paste and method of production of multilayer type electronic device A method of production of peeling layer paste used for producing a multilayer electronic device, having a step of preparing a primary slurry containing a ceramic powder having an average particle size of 0.1 pm or less, a binder, and a dispersion agent and having a ... | 07/08/2008 |
| 7381283 | Method for reducing shrinkage during sintering low-temperature-cofired ceramics The present invention mainly relates to a method for reducing shrinkage during sintering low-temperature-cofired ceramics, the ceramics comprising a dielectric portion and a heterogeneous material portion, the method comprising the steps of: (a) providing a monolith... | 06/03/2008 |
| 7361242 | Ceramic slurry composition and methods for producing ceramic green sheet and multilayer ceramic electronic device A ceramic slurry composition has a powdered ceramic uniformly dispersed therein without excessive damage thereto. A method for producing a ceramic green sheet using the ceramic slurry composition and a method for producing multilayer ceramic electronic devices are a... | 04/22/2008 |
| 7351676 | Dielectric porcelain composition, multilayer ceramic capacitor, and electronic component A dielectric ceramic composition of the present invention includes 100 parts by mole of BaTiO3, x1 parts by mole of MnO, x2 parts by mole of Cr2O3, x3 parts by mole of Y2O3 and/o... | 04/01/2008 |
| 7344612 | Production method of multilayer electronic device A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet 10a including at least a ceramic powder on a supporting body 20; forming an electrode pattern layer 12a on a surface of... | 03/18/2008 |
| 7341639 | Electroceramic component comprising a plurality of contact surfaces A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact s... | 03/11/2008 |
| 7335328 | Method for manufacturing multilayer ceramic capacitor A method of manufacturing a multilayer ceramic capacitor includes the steps of: preparing a mixture of a raw material powder mainly composed of barium titanate particles; forming the mixture and a binder into a green sheet; alternately layering the green sheet and a... | 02/26/2008 |
| 7332805 | Electronic package with improved current carrying capability and method of forming the same An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wiring... | 02/19/2008 |
| 7327554 | Assembly of semiconductor device, interposer and substrate An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted ... | 02/05/2008 |
| 7325488 | Method of pressing a ceramic stacked layer structure A pressing device and a pressing method, wherein the method includes the steps of accommodating a stacked layer structure in a recess in a die body, and pressing the stacked layer structure in the recess of the die body between a bottom plate of the die body that fo... | 02/05/2008 |
| 7326309 | Method of producing ceramic laminate body This invention provides a method of producing a ceramic laminate body capable of suppressing the occurrence of de-lamination and cracks, and providing high reliability. This method comprises a heat-bonding step of covering a full periphery of side surfaces of cerami... | 02/05/2008 |
| 7323073 | Piezoelectric porcelain composition, laminated piezoelectric device therefrom and process for producing the same A piezoelectric ceramic composition including three components, Pb(Zn1/3Nb2/3)O3, PbTiO3, and PbZrO3, and having a basic composition formula of Pb(Zn1/3Nb2/3)xZryTi | 01/29/2008 |
| 7318874 | Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body The invention relates to a ceramic green body consisting of at least two ceramic bodies that are bonded together. The invention is characterized in that the green body is produced using an adhesive tape that consists of an adhesive film located on a release liner. | 01/15/2008 |
| 7316755 | Method of producing multi-terminal type laminated ceramic electronic component In a method of producing a multi-terminal type laminated ceramic electronic component in which internal electrodes are embedded in a sintered ceramic member, and the internal electrodes have plural first lead-out electrodes led out to a first side surface and plural... | 01/08/2008 |
| 7309397 | Process for the manufacture of piezoceramic multilayer actuators A block of stacked green films provided with internal electrodes is laminated, at least one actuator is separated from the block, the actuator obtains its shape by means of a machining operation, is then sintered, and the sinter skin produced by the sintering is use... | 12/18/2007 |
| 7292120 | Nonreciprocal circuit device and communication device A nonreciprocal circuit device and a communication device having a nonreciprocal circuit device in which each end portion of each center electrode in the bottom layer of a multilayer-electrode structure on a surface of ferrite is thickened by forming a filled-in ele... | 11/06/2007 |
| 7291235 | Thermal dissipating capacitor and electrical component comprising same An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circui... | 11/06/2007 |
| 7286367 | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the r... | 10/23/2007 |
| 7276130 | Production method of multilayer ceramic electronic device A method of producing a multilayer ceramic electronic device, having a firing step for firing a pre-firing element body wherein a plurality of dielectric layers and internal electrode layers containing a base metal are alternately arranged, characterized in that the... | 10/02/2007 |
| 7263895 | Strain detector and method of manufacturing the same A fluid pressure sensor (1) for measuring the pressure of a fluid comprises a diaphragm portion (12) which is a strain generating body, a silicon oxide film (21) as an insulating film, and a strain gauge (20) made of crystalline silicon, ... | 09/04/2007 |
| 7247030 | Bonded three dimensional laminate structure A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent. ... | 07/24/2007 |
| 7233226 | Method of producing a platinum temperature sensor A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cove... | 06/19/2007 |
| 7222419 | Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal condu... | 05/29/2007 |
| 7204900 | Method of fabricating structures using low temperature cofired ceramics Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tap... | 04/17/2007 |
| 7201814 | Fibers and ribbons containing phosphor, conductive metals or dielectric particles for use in the manufacture of flat panel displays This invention is directed to a process for the fabrication of features on a display panel utilizing fibers or ribbons comprising organic polymer and inorganic material, the inorganic material containing phosphoe, conductrice metals or dielectric particles. ... | 04/10/2007 |
| 7189297 | Method of manufacturing ESD protection component A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed from this slurry. A conductor layer is formed on a surface of the varist... | 03/13/2007 |
| 7186307 | Method for manufacturing a ceramic multilayer circuit board By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio filled with the conductive paste is hot pressed on the ceramic green she... | 03/06/2007 |
| 7161371 | Module part A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more com... | 01/09/2007 |
| 7160406 | Ceramic substrate and method for the production thereof A process for producing a ceramic substrate includes preparing a base body using a stack of layers that contain an unsintered ceramic material and a sintering agent, and sintering the stack of layers. At least one of the layers contains an increased proportion of si... | 01/09/2007 |
| 7161241 | Multi-layer board A multi-layer board includes a ceramic layer and plural resin layers which are stacked together. The ceramic layer is provided with an impedance element formed thereon, and the uppermost resin layer is provided with an electronic component mounted thereon. The multi... | 01/09/2007 |
| 7154736 | Ceramic multi-layer element and a method for the production thereof A method of manufacturing a ceramic component having multiple layers includes producing ceramic green foil comprised of PTC ceramic material, applying electrode paste containing tungsten onto areas of the ceramic green foil designated to be electrodes, alternately s... | 12/26/2006 |
| 7151228 | Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit boar... | 12/19/2006 |
| 7147736 | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic The present invention relates to a method to achieve the suppression of planar shrinkage in LTCC ceramic tape laminate structures without externally applied forces or sacrificial constraining tape. The method utilizes a non-sacrificial constraining tape that constra... | 12/12/2006 |
| 7144618 | Multilayer composite and method for preparing the same A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined numbe... | 12/05/2006 |
| 7141129 | Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the... | 11/28/2006 |
| 7137803 | Fluid pressure imprint lithography An improved method of imprint lithography involves using direct fluid pressure to press the mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing... | 11/21/2006 |
| 7127809 | Method of forming one or more base structures on an LTCC cofired module An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC... | 10/31/2006 |
