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Class 156/379.8 - With means to assemble laminae or position them relative to each other


Subclass of Class 156 - Adhesive bonding and miscellaneous chemical manufacture
Definition: Subject matter including a mechanism for handling separately
No. of patents: 250
Last issue date: 05/29/2012


1              
NumberTitleIssue Date
8186406Apparatus for sealing a polymer coated paper or board
The invention relates to a method and an apparatus for jointing members made of plastic-coated paper or board. In accordance with the invention, the sealable members are retained in position with clamps and sealing is performed with a laser sealing means moving alon...
05/29/2012
7926534Pipe welder for simultaneously fusing a plurality of polyethylene pipes
Disclosed are a device and method for the simultaneous fusion of multiple plastic pipe sections. A plurality of pipe sections may be rigidly held, faced off, heated, and joined at the same time using a single piece of equipment. The inventive process allows increase...
04/19/2011
7913735Adhesive tape joining apparatus
An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. A...
03/29/2011
7909079Radio frequency welding system for flexible work pieces and apparatuses for same
A radio frequency welding system for flexible work pieces having a top-side and an underside. The welding system includes a fixed weld platform, a mobile radio frequency welder adapted to move over the fixed weld platform, movable welding electrodes configured over ...
03/22/2011
7886796Chip bonding tool and related apparatus and method
A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passe...
02/15/2011
7849900Apparatus for joining a separating adhesive tape
During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a n...
12/14/2010
7828030Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus
An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing devi...
11/09/2010
7367374Manufacturing method and manufacturing apparatus of display device
The present invention is directed to a display device that overcomes the limitation on tact time, and the defective phenomenon attributed to the generation of bubbles, pasting and visual irregularities at the time of laminating a film to a display panel. A polarizer...
05/06/2008
7318878Method and device for producing continuous belts from plastic films
A method and apparatus for producing continuous belts is disclosed. The belts are formed from plastic films and are used as transfer belts in electrographic printers and copiers. The ends of the film are welded together by abutting their front faces and the ends are...
01/15/2008
7316521Waterproof sheet in-situ application machine
A waterproof sheet in-situ application machine, which can rewind a long roll-like thermal application type waterproof sheet and easily bond the sheet onto the bed surface of a bridge and the surface of a concrete structure in a site, includes a carriage and a combin...
01/08/2008
7295314Metrology/inspection positioning system
A metrology/inspection system moves the imaging and/or measuring equipment of the system relative to a wafer. Accordingly, measurement or inspection of the wafer does not require that the wafer be mounted on a precision stage. This allows the wafer to be at rest on ...
11/13/2007
7289215Image control in a metrology/inspection positioning system
A metrology system includes a positioning system that produces linear and rotational motion between an imaging system and the wafer. The imaging system produces signals representing the image of the wafer in the field of view of the imaging system. A control system ...
10/30/2007
7279069Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus
The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substr...
10/09/2007
7255770Method for laser welding flexible polymers
The present invention concerns methods for joining flexible polymer workpieces using light energy. These methods, referred to as laser welding, can be used to join thermoplastic or thermoset polymers. The laser welding method of the invention is applicable to the cr...
08/14/2007
7252130Apparatus for fabricating a multi-fiber polarization-maintaining fiber assembly
While clamped by a clamping jig 100, polarization-maintaining fiber cables 11 and 12 are automatically oriented with an orientation adjusting unit 200 and then heated by a heater 105 for curing thermoset resins. ...
08/07/2007
7237479Device for successively transporting sheets in a platen press
A device for successively transporting sheets in a platen press includes gripper bars with respective ends fixedly attached to two flexible of endless loop elements. Each loop element is engaged respectively with an intermittent drive wheel and at least one free whe...
07/03/2007
7220334Method of manufacturing microdevice having laminated structure
The present invention provides a method of manufacturing a microdevice having a fine capillary cavity formed as a cut portion of a very thin layer which is likely to be broken, particularly a method of manufacturing a microdevice having complicated passages formed i...
05/22/2007
7199342Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowin...
04/03/2007
7186961Food cooking container
One object of the invention is to provide a container for cooking foods that (1) enables cooking while maintaining an appropriate moisture content, even when the container is heated by an external heating means such as a microwave oven, and (2) can be opened easily....
03/06/2007
7182117Apparatus and method for applying an adhesive film to a surface of a structure
A film dispenser for applying an adhesive film to an elongated structure has a mounting frame, guide members on the bottom portions of the mounting frame sides to engage the shoulder portions of the elongated structure to allow movement of the apparatus in relation ...
02/27/2007
7168472Method and apparatus for applying variable coded labels to items of produce
An apparatus and method are provided for automatically labeling individual produce items. Individual produce items are conveyed towards a rotary bellows or other applicator. A sensor senses at least one variable characteristic, such as size of each of the produce it...
01/30/2007
7167627Substrate with attached filamentary members
A substrate having attached filamentary members is disclosed. The substrate includes a plastic layer and the apparatus for attaching the filamentary member includes an anvil, a needle and a swaging tool movable relatively to the anvil. The method of attachment inclu...
01/23/2007
7165311Method for attaching filamentary members to a substrate
An apparatus and a method for attaching filamentary members to a substrate are disclosed. The substrate includes a plastic layer and the apparatus includes an anvil, a needle and a swaging tool movable relatively to the anvil. The method includes the steps of penetr...
01/23/2007
7163639Metallic building element for optoelectronics
The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or original that can be etched to s...
01/16/2007
RE39412Optical information medium, and method and apparatus for fabricating the same
The disk-shaped optical information medium of this invention includes: a first substrate having a center hole; a second substrate having a center hole; and a radiation curable resin interposed between the first and second substrates for bonding together the first an...
11/28/2006
7138030In-line system and method for manufacturing liquid crystal display
An in-line system for fabricating a liquid crystal display-includes a sealer coating unit for coating a sealer onto a first substrate with a plurality of liquid crystal display cell regions, a liquid crystal injection unit for dropping a liquid crystal onto the firs...
11/21/2006
7135090FPD encapsulation apparatus and method for encapsulating the same
An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism...
11/14/2006
7113336Microlens including wire-grid polarizer and methods of manufacture
Microlenses including wire-grid polarizers and methods for their manufacture are disclosed. The method involves forming wire-grid polarizer patterns on a surface of the microlens. The devices and methods provide simple and economical microlenses with polarizers....
09/26/2006
7089718Apparatus for heat-shrinking film onto an open-topped container and method of using same
A system for heat-shrinking a film onto an open-topped container is provided, including at least one reflective cup having a reflective interior surface, and at least one radiant energy source. The reflective cup and the radiant energy source may be rotationally mou...
08/15/2006
7060154Method and apparatus for removing unwanted substance from semiconductor wafer
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member 28 is placed in contact with the surface of th...
06/13/2006
7058962Information recording medium, label for an information recording medium and method of adhering a label for an information recording medium
An information recording medium, such as a disc, is provided from which data can be read in a stable fashion even when a label for the information recording medium is adhered thereon. A label is partially attached to the information recording member in which an info...
06/06/2006
7044183Apparatus for processing substrates
A processing apparatus for substrates that include a plurality of individual substrates having a photo-curable adhesive layer interposed therebetween, including a mounting table, an irradiating device that irradiates the substrates, and a control device that control...
05/16/2006
7037011Ribbon cartridge having updatable data communication component
A tape ribbon cartridge and method are provided for regulating printer operation of a printer operative to transmit a download signal. The cartridge includes a housing, an ink ribbon, and a data communication component. The ink ribbon is disposed within the housing....
05/02/2006
7032806Methods of positioning components using liquid prime movers and related structures
A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material ...
04/25/2006
7031561Monolithic integration of micro-optics circuits and RF circuits
A chip for integrating functions performed by micro-optics and RF circuits including at least one optical function module that receives an optical signal and performs at least one of a plurality of optical functions. A RF function module that receives a RF signal an...
04/18/2006
7007733Apparatus for manufacturing collimator
An apparatus for manufacturing a collimator by attaching a glass tube assembly, which includes a pigtail having a fiber, and a GRIN lens, which is coaxially arranged with the pigtail, into a metal sleeve having a tube shape. The apparatus includes a supporting part,...
03/07/2006
7005033Apparatus and method for laminating dry film using microwave
The present invention relates to an apparatus and method for laminating a dry film using a microwave which are capable of quickly transforming a photosensitive substance of a dry film to a semi-liquid state by vibrating a water or acryl group copolymer molecular in ...
02/28/2006
6991703Bonding method, bonding stage and electronic component packaging apparatus
A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component th...
01/31/2006
6979377Method for producing components from fiber-reinforced composite ceramic and methods for using the components
A method produces components from high-temperature-proof fiber reinforced composite ceramics from tapes containing carbon fibers. Heating and simultaneously compacting under the influence of pressure and temperature produces a force-locking connection in the region ...
12/27/2005
6977018Optical information recording medium and its manufacturing method and apparatus
An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. T...
12/20/2005
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