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| Number | Title | Issue Date |
| 8043469 | Substrate processing method, substrate processing apparatus, and storage medium At first, with a chamber being filled with a first gas, a process liquid is supplied onto a surface of a wafer in the chamber so as to process the surface of the wafer. At this time, the process liquid discharged from the chamber is returned to a process-liquid supp... | 10/25/2011 |
| 7931775 | Surface treatment device A surface treatment device (10) is provided for applying a surface treatment medium to an article (60). The device comprises an application member (12, 14) for holding and applying the surface treatment medium to the article. The device has a se... | 04/26/2011 |
| 7862680 | Substrate processing apparatus A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 a... | 01/04/2011 |
| 7758716 | Apparatus for spraying etchant solution onto preformed printed circuit board An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed... | 07/20/2010 |
| 7635417 | Semiconductor apparatus and cleaning unit thereof A semiconductor apparatus for processing a wafer comprises a stage, a fluid supply unit, and a cleaning unit. The stage supports the wafer. The fluid supply unit provides a first fluid, wherein the fluid supply unit is moveable between a second position and a first ... | 12/22/2009 |
| 7427333 | Resist removing method and resist removing apparatus In an inventive resist removing method, sulfuric acid and hydrogen peroxide water are supplied to a surface of a substrate to remove a resist from the substrate surface. Thereafter, hydrogen peroxide water is supplied to the substrate surface to remove the sulfuric ... | 09/23/2008 |
| 7412981 | Liquid processing apparatus and method A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ... | 08/19/2008 |
| 7323655 | Inductively coupled plasma reactor for producing nano-powder Disclosed herein is a high-frequency induction plasma reactor apparatus for producing nano-powder, which is configured to continuously manufacture nano-powder in large quantities using solid-phase powder as a starting raw material and to manufacture high-purity nano... | 01/29/2008 |
| 7323080 | Apparatus for treating substrate The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the waf... | 01/29/2008 |
| 7314054 | Liquid processing apparatus with nozzle having planar ejecting orifices A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ... | 01/01/2008 |
| 7241342 | Non-dripping nozzle apparatus According to one aspect of the invention, a dispense head for a wafer processing apparatus is provided. The dispense head may include an inlet, at least one outlet, a drain, and a passageway therethrough interconnecting the inlet, the outlet, and the drain. The inle... | 07/10/2007 |
| 7226514 | Spin-rinse-dryer An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least ... | 06/05/2007 |
| 7189305 | Gas-assist systems for applying and moving ozonated resist stripper to resist-bearing surfaces of substrates A method for moving resist stripper across the surface of a semiconductor substrate that includes applying a wet chemical resist stripper, such as an organic or oxidizing wet chemical resist stripper, to at least a portion of a photomask positioned over the semicond... | 03/13/2007 |
| 7171973 | Substrate processing apparatus The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chem... | 02/06/2007 |
| 7119027 | Method for manufacturing display device that includes supplying solution to the underside of a glass substrate Where a thin film formed on a glass substrate is etched with a solution containing a fluoride, insoluble residues formed by the reaction of the solution with glass substrate components adhere to the back of the substrate to cause etching non-uniformity called roller... | 10/10/2006 |
| 7105074 | Substrate treating method and apparatus A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate.... | 09/12/2006 |
| 7094522 | Developing method, substrate treating method, and substrate treating apparatus A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissol... | 08/22/2006 |
| 7093375 | Apparatus and method for utilizing a meniscus in substrate processing An apparatus for processing a substrate is provided which includes a proximity head proximate to a surface of the substrate when in operation. The apparatus also includes an opening on a surface of the proximity head to a cavity defined in the proximity head where t... | 08/22/2006 |
| 7018481 | Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrat... | 03/28/2006 |
| 7001086 | Developing method, substrate treating method, and substrate treating apparatus A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissol... | 02/21/2006 |
| 6964724 | Etching and cleaning methods and etching and cleaning apparatuses used therefor An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means f... | 11/15/2005 |
| 6964595 | Child's infant-care play center A child's infant-care play center includes a table having a recessed bath tub and a changing-table/bed removably disposed over the tub. Upstanding dividers and a headboard demarcate respective bathing/changing/sleeping and washing-sink/eating areas on the table. A f... | 11/15/2005 |
| 6932884 | Substrate processing apparatus A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas into the chamber. The substrate processing apparatus further comprises ... | 08/23/2005 |
| 6929903 | Developing method, substrate treating method, and substrate treating apparatus A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissol... | 08/16/2005 |
| 6918989 | Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same In a manufacturing apparatus of printed wiring board an aperture of a nozzle pipe located in a central position is larger than that at both sides, or the aperture of the piping to the nozzle pipe in the central position is larger than that of the piping at both side... | 07/19/2005 |
| 6878232 | Method and apparatus for improving a temperature controlled solution delivery process A method and apparatus for improving an operating efficiency for a process including temperature dependent fluid delivery including determining a projected time period to start a process during a non-operating time period; delivering a process fluid for performing t... | 04/12/2005 |
| 6837943 | Method and apparatus for cleaning a semiconductor substrate A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the strip... | 01/04/2005 |
| 6805754 | Device and method for processing substrates A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substa... | 10/19/2004 |
| 6786996 | Apparatus and method for edge bead removal The present invention generally provides an improved apparatus and method for removing an edge bead from a substrate. The apparatus includes a processing chamber having an edge bead removal fluid distribution system positioned therein and a substrate support member ... | 09/07/2004 |
| 6764573 | Wafer thinning techniques Apparatuses (10, 100), and methods of using same, for the simultaneous thinning of the backside surfaces of a plurality of semiconductor wafers (W) using a non-crystallographic and uniform etching process, are described. The apparatuses (10, 100) inclu... | 07/20/2004 |
| 6758938 | Delivery of dissolved ozone An apparatus and method for delivering ozone to a workpiece. In one embodiment, fluid is sprayed onto a workpiece placed in an ozone-rich environment. Alternatively, ozone is mixed with the fluid prior to spraying the fluid onto the workpiece. When spraying the flui... | 07/06/2004 |
| 6699356 | Method and apparatus for chemical-mechanical jet etching of semiconductor structures A chemical-mechanical jet etching method rapidly removes large amounts of material in wafer thinning, or produces large-scale features on a silicon wafer, gallium arsenide substrate, or similar flat semiconductor workpiece, at etch rates in the range of 1... | 03/02/2004 |
| 6630052 | Apparatus for etching glass substrate An apparatus for etching a glass substrate includes a first bath containing an etchant, at least one porous panel having a plurality of jet holes in the first bath, the porous panel containing the etchant to jet the etchant against the glass substrate, a ... | 10/07/2003 |
| 6586342 | Edge bevel removal of copper from silicon wafers Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems apply liquid etchant in a precise manner at the edge bevel region of the wafer u... | 07/01/2003 |
| 6569282 | Etching apparatus A wafer is supplied from a wafer cassette to an etching part by a wafer transport robot so as to be etched. After the etching process, a wafer frame is supplied from a wafer frame supply part to a mount part. The mount part to which the wafer frame is sup... | 05/27/2003 |
| 6537416 | Wafer chuck for use in edge bevel removal of copper from silicon wafers A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for example, attached to arms of the wafer chuck. These members may... | 03/25/2003 |
| 6524429 | Method of forming buried wiring, and apparatus for processing substratum A method of forming a buried wiring comprising the steps of: (A) forming a wiring and a first insulating layer filled between the wirings on a substratum, (B) immersing the first insulating layer in a fluid which can dissolve the first insulating layer, t... | 02/25/2003 |
| 6461437 | Apparatus used for fabricating liquid crystal device and method of fabricating the same An apparatus for manufacturing a liquid crystal display device that can prevent chemical contamination attributed to contacting an external atmosphere, and a method of manufacturing the liquid crystal display device. The apparatus includes a cleaning cham... | 10/08/2002 |
| 6440264 | Method and system for manufacturing a photocathode A system for manufacturing a photocathode includes a cap having a first end and a second end. The first end defines a passage operable to direct an etch compound to an etch surface of the photocathode. The system also includes a support operable to releas... | 08/27/2002 |
| 6309981 | Edge bevel removal of copper from silicon wafers Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems apply liquid etchant in a precise manner at the edge bevel region of the wafer u... | 10/30/2001 |
