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| Number | Title | Issue Date |
| 8029640 | Multilayer retaining ring for chemical mechanical polishing A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion. ... | 10/04/2011 |
| 7622016 | Retainer ring of chemical mechanical polishing device A retainer ring of a chemical-mechanical polishing device which can prevent itself from being twisted and improve defective proportion and equipment operating rate occurred when polishing semiconductor wafers by embedding a metal member inside. Retainer ring ... | 11/24/2009 |
| 7520955 | Carrier head with a multilayer retaining ring for chemical mechanical polishing A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion. ... | 04/21/2009 |
| 7459057 | Substrate retainer A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face... | 12/02/2008 |
| 7361076 | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with highe... | 04/22/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7326105 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 02/05/2008 |
| 7258595 | Polishing apparatus A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A ... | 08/21/2007 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7244336 | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift A temperature-controlled hot edge ring assembly adapted to surround a substrate support in a plasma reaction chamber. The assembly includes a conductive lower ring, a ceramic intermediate ring, and an upper ring. The intermediate ring overlies the lower ring and is ... | 07/17/2007 |
| 7207870 | Seal assembly manufacturing methods and seal assemblies manufactured thereby Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect p... | 04/24/2007 |
| 7189153 | Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during m... | 03/13/2007 |
| 7175508 | Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block an opening in a head housing, a slide guide member and a ring member ... | 02/13/2007 |
| 7172493 | Fine force actuator assembly for chemical mechanical polishing apparatuses A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly ( | 02/06/2007 |
| 7160493 | Retaining ring for use on a carrier of a polishing apparatus The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface incl... | 01/09/2007 |
| 7150673 | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with highe... | 12/19/2006 |
| 7108591 | Compliant wafer chuck A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is include... | 09/19/2006 |
| 7104476 | Multi-sectored flat board type showerhead used in CVD apparatus Disclosed is a showerhead of a CVD apparatus comprising a plate having an empty inside and provided with a plurality of injection holes at one surface thereof; and gas supplying pipes installed at the plate so as to supply gas, wherein introduced gas thereto is inje... | 09/12/2006 |
| 7101271 | Polishing head and chemical mechanical polishing apparatus An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regi... | 09/05/2006 |
| 7094139 | Retaining ring with flange for chemical mechanical polishing A retaining ring has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The outer diameter surface includes an outwardly projecting flange having a lower surface, and the bottom surface includes a... | 08/22/2006 |
| 7063604 | Independent edge control for CMP carriers A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is dispo... | 06/20/2006 |
| 7055535 | Holding unit, processing apparatus and holding method of substrates A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wa... | 06/06/2006 |
| 7040952 | Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribut... | 05/09/2006 |
| 7008308 | Wafer carrier A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material fro... | 03/07/2006 |
| 7004827 | Method and apparatus for polishing a workpiece A carrier has openings for holding workpieces during polishing. Upper and lower polishing pads push against upper and lower surfaces of the workpieces, respectively. A ring is provided within the openings. This ring surrounds the workpieces, and prevents or reduces ... | 02/28/2006 |
| 6979256 | Retaining ring with wear pad for use in chemical mechanical planarization A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconducto... | 12/27/2005 |
| 6976903 | Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that ... | 12/20/2005 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC) devices; and a metal bonding layer deposited on opposing surfaces of t... | 12/13/2005 |
| 6923709 | Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of... | 08/02/2005 |
| 6916226 | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bott... | 07/12/2005 |
| 6916234 | Polishing machine A polishing machine in which adverse influence caused by a surface condition of a retainer ring can be reduced with a simple structure. The polishing machine includes a rotatable polishing plate; a top ring including a holding plate for holding and pressing a wafer ... | 07/12/2005 |
| 6913669 | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatu... | 07/05/2005 |
| 6910949 | Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers A polishing head for use in an apparatus for chemically-mechanically polishing semiconductor wafers is provided. The polishing head includes a first side having at least a portion thereof operably connectable with a spindle on the apparatus; and a second side opposi... | 06/28/2005 |
| 6890402 | Substrate holding apparatus and substrate polishing apparatus A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is ar... | 05/10/2005 |
| 6886442 | Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same An apparatus for punching CMP machine backing film. The apparatus comprises a base, a first plate, and a second plate. The base holds the backing-film. The first plate is disposed on the base in a manner such that it moves between a first position and a second posit... | 05/03/2005 |
| 6863771 | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods An apparatus for applying different amounts of pressure to different locations of a backside of a semiconductor device structure during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pressur... | 03/08/2005 |
| 6828243 | Apparatus and method for plasma treatment A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compen... | 12/07/2004 |
| 6786996 | Apparatus and method for edge bead removal The present invention generally provides an improved apparatus and method for removing an edge bead from a substrate. The apparatus includes a processing chamber having an edge bead removal fluid distribution system positioned therein and a substrate support member ... | 09/07/2004 |
| 6776870 | Ditch type floating ring for chemical mechanical polishing An apparatus for solving an edge exclusion problem when polishing a semiconductor wafer includes a rotatable polishing platen with a polishing pad attached to its upper surface. A polishing slurry is deposited on the upper surface of the polishing pad during polishi... | 08/17/2004 |
| 6758939 | Laminated wear ring A laminated wear ring for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring includes a high stiffness stainless s... | 07/06/2004 |
