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| Number | Title | Issue Date |
| 8070909 | Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing pro... | 12/06/2011 |
| 8043467 | Liquid processing apparatus and liquid processing method A liquid processing apparatus is arranged to planarize a film on a substrate by supplying onto the film a process liquid for dissolving the film while rotating the substrate. The apparatus includes a substrate holding member configured to rotatably hold the substrat... | 10/25/2011 |
| 8043466 | Etching apparatus An etching apparatus is provided for etching a substrate. The etching apparatus includes a first tank including a first etchant, and an etch bath connected to the first tank and receiving the first etchant, the etch bath containing a residual etchant including a dil... | 10/25/2011 |
| 8025759 | Polishing apparatus and polishing method A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configu... | 09/27/2011 |
| 7935216 | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods An apparatus for applying different amounts of pressure to different locations of a semiconductor device structure or other substrate during polishing thereof. The apparatus is configured to be associated with a wafer carrier of a polishing apparatus and includes pr... | 05/03/2011 |
| 7363195 | Methods of configuring a sensor network A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-seri... | 04/22/2008 |
| 7358199 | Method of fabricating semiconductor integrated circuits A method of fabricating semiconductor integrated circuits includes (1) providing a spin-on tool comprising a rotatable platen for holding and spinning a wafer disposed thereon, a fluid supply system for providing spin-on solution onto the wafer, and a detector fixed... | 04/15/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7309618 | Method and apparatus for real time metal film thickness measurement A semiconductor processing system is provided. The semiconductor processing system includes a first sensor configured to isolate and measure a film thickness signal portion for a wafer having a film disposed over a substrate. A second sensor is configured to detect ... | 12/18/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7278901 | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semicon... | 10/09/2007 |
| 7264537 | Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system. The thickness measurements are analyzed to derive a plurality of work p... | 09/04/2007 |
| 7252575 | Polishing state monitoring apparatus and polishing apparatus and method A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a lig... | 08/07/2007 |
| 7241202 | Substrate polishing apparatus A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a tab... | 07/10/2007 |
| 7235154 | Devices and methods for optical endpoint detection during semiconductor wafer polishing A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured... | 06/26/2007 |
| 7235414 | Using scatterometry to verify contact hole opening during tapered bilayer etch Systems and methods are described that facilitate verifying that bottom apertures in tapered vias are open and free of obstruction. Scatterometry can be employed to monitor tapered via formation during and/or after a dry etch process on a photoresist bilayer. Inform... | 06/26/2007 |
| 7229521 | Etching system using a deionized water adding device An etching system (3) includes an etching chamber (31), an etchant solution tank (32) connected with the etching chamber, a heater (34) set in the tank, and a deionized water (DIW) adding device. The DIW adding device includes a DIW feedi... | 06/12/2007 |
| 7202161 | Substrate processing method and apparatus There is provided a substrate processing method which, even when a material having a low mechanical strength is employed as an interlayer dielectric, can produce a semiconductor device having a multi-layer interconnect structure of fine interconnects in higher yield... | 04/10/2007 |
| 7198542 | Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system. ... | 04/03/2007 |
| 7200337 | Optoelectronic transceiver having dual access to onboard diagnostics An optoelectronic transceiver includes first and second controller ICs. Each controller IC includes logic, a memory, an interface, and at least one input port. Each memory is configured to store digital diagnostic data and has a unique serial device address to allow... | 04/03/2007 |
| 7184134 | Real-time monitoring apparatus for plasma process A real-time monitoring apparatus for a plasma process comprises a plurality of measuring units (10) mounted on a semiconductor wafer, a receiving device (7) for receiving a signal transmitted from each of the measuring units (10), and a data pro... | 02/27/2007 |
| 7171334 | Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for autonomously monitoring fabrication equipment, for example, integrated circuit fabrication equipment. In one embodiment of ... | 01/30/2007 |
| 7169015 | Apparatus for optical inspection of wafers during processing The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of this system includes a spectrophotometric channel, an imaging channel... | 01/30/2007 |
| 7163441 | Semiconductor wafer grinder A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat ... | 01/16/2007 |
| 7160739 | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing pro... | 01/09/2007 |
| 7160177 | Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates A device for high-precision machining of the surface of an object, such as for polishing and lapping semiconductor substrates, in which the object is held on an accommodation surface for its machining. The accommodation surface can be deformed by means of a actuator... | 01/09/2007 |
| 7156947 | Energy enhanced surface planarization A substrate processing apparatus equipped to employ an energy directed at a process side of a substrate to enhance and control material removal is provided. ... | 01/02/2007 |
| 7150675 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system. ... | 12/19/2006 |
| 7149430 | Optoelectronic transceiver having dual access to onboard diagnostics The optoelectronic transceiver includes first and second controller ICs. Each controller IC includes logic, a memory, an interface, and at least one input port. Each memory is configured to store digital diagnostic data and has a unique serial device address to allo... | 12/12/2006 |
| 7149643 | Integrated process condition sensing wafer and data analysis system A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a subs... | 12/12/2006 |
| 7144298 | Method for manufacturing semiconductor device and apparatus for manufacturing thereof The object of the invention is to provide a method of manufacturing a semiconductor device and a processing apparatus for planarization wherein to form copper wiring in multiple layers. The removal of a residue of polishing by local electro polishing, the enhancemen... | 12/05/2006 |
| 7134934 | Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart e... | 11/14/2006 |
| 7132035 | Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Methods, apparatuses and substrate assembly structures for mechanical and chemical-mechanical planarizing processes used in the manufacturing microelectronic-device substrate assemblies. One aspect of the invention is directed toward a method for planarizing a micro... | 11/07/2006 |
| 7128803 | Integration of sensor based metrology into semiconductor processing tools A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded i... | 10/31/2006 |
| 7115017 | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The fir... | 10/03/2006 |
| 7112795 | Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer In a method of controlling a metallic layer etching process for fabricating a semiconductor device or a liquid crystal display device, the composition of the etchant used in etching the metallic layer is first analyzed with the NIR spectrometer. The state of the etc... | 09/26/2006 |
| 7108579 | Method and device for polishing The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of p... | 09/19/2006 |
| 7101254 | System and method for in-line metal profile measurement A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either ... | 09/05/2006 |
| 7101799 | Feedforward and feedback control for conditioning of chemical mechanical polishing pad A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioni... | 09/05/2006 |
