Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Application No. | Application Title | Issue Date |
| 20120006485 | SUBSTRATE TREATMENT DEVICE A substrate treatment device including a cleaning chamber that is capable of decreasing a thick waste solution from the chamber, and improving use efficiency of a diluted waste solution from the chamber. The chamber supplies a cleaning solution onto a front surface of a... | 01/12/2012 |
| 20110309478 | SEMICONDUCTOR WAFER PRE-PROCESS ANNEALING AND GETTERING METHOD AND SYSTEM FOR SOLAR CELL FORMATION Techniques are here disclosed for a solar cell pre-processing method and system for annealing and gettering a solar cell semiconductor wafer having an undesirably high dispersion of transition metals, impurities and other defects. The process forms a surface contaminant... | 12/22/2011 |
| 20110309051 | APPARATUS AND METHOD FOR WET TREATMENT OF AN OBJECT AND FLUID DIFFUSION PLATE AND BARREL USED THEREIN An apparatus for wet treatment of an object includes a treatment bath in which an object to be treated is received and treated; a plurality of object supporting rods rotatably installed in the treatment bath and having a plurality of slots formed in surfaces thereof to ... | 12/22/2011 |
| 20110220286 | SOLUTION SUPPLYING UNIT AND SUBSTRATE TREATING APPARATUS HAVING THE SAME A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The ... | 09/15/2011 |
| 20110177674 | PROCESSING OF MULTILAYER SEMICONDUCTOR WAFERS A method and apparatus for machining, or forming a feature in, a patterned silicon wafer includes removing portions of surface layers on the wafer using a first pulsed laser (4) beam with a pulse width between 1 ps and 1000 ps; and removing portions of bulk silic... | 07/21/2011 |
| 20110165365 | METHOD AND DEVICE FOR ENCAPSULATING MICROSTRUCTURES A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate (12), of at least one cover (7) supported by a ... | 07/07/2011 |
| 20110122994 | X-RAY IMAGING SYSTEM AND METHOD The present invention provides systems and methods for x-ray imaging. In some embodiments, an aperture, or a plurality thereof, are configured to have image transfer functions lacking a zero within a usable spatial frequency range. In further embodiments, the image tran... | 05/26/2011 |
| 20110117373 | COMPOUND MATERIAL, METHOD OF PRODUCING THE SAME AND APPARATUS FOR PRODUCING THE SAME Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coat... | 05/19/2011 |
| 20110111202 | MULTILAYER FILM STRUCTURE, AND METHOD AND APPARATUS FOR TRANSFERRING NANO-CARBON MATERIAL The invention discloses a method and apparatus for transferring nano-carbon material. The nano-carbon material is grown, by chemical vapor deposition, on a catalyst layer provided between a first and a second oxide layer of a multilayer film structure grown on a first s... | 05/12/2011 |
| 20110017707 | METHOD AND DEVICE FOR SELECTIVE ETCHING Method and device for selectively etching a first material (4) relative to a second material (2), comprising a bath (11) of a solution capable of producing at least one chemical species for etching the first material (4) but not the second (<... | 01/27/2011 |
| 20110017703 | SELECTIVE PLANARIZATION METHOD AND DEVICES FABRICATED ON PLANARIZED STRUCTURES A method and system for treating a surface structure of a workpiece. The method provides a carrier-gel to the surface structure of the workpiece. The carrier-gel includes an etchant for selectively etching a first material of the surface structure and has a gel particle... | 01/27/2011 |
| 20100246016 | GLASS HAVING ANTI-GLARE SURFACE AND METHOD OF MAKING A glass article having an anti-glare surface. The anti-glare surface has a distinctness-of-reflected image of less than 95, and a haze of less than or equal to 50%. In one embodiment, the glass article further includes a smudge-resistant surface disposed on the anti-gla... | 09/30/2010 |
| 20100233884 | PROCESSING APPARATUS AND METHOD FOR MAKING SEMICONDUCTOR DEVICES A process apparatus and a method for making semiconductor devices is implemented in a semiconductor equipment and utilizes three magnetic objects arranged in a helical path. Chemicals within the chemical pipe are magnetized, and the chemicals include etch acids, photore... | 09/16/2010 |
| 20100213174 | Method for Manufacturing Glass Cliche Using Laser Etching and Apparatus For Laser Irradiation Therefor A method for manufacturing a glass cliché using laser etching includes a dipping step for dipping a glass cliché, which will be etched, into an etching solution, a patterning step for irradiating laser to the glass cliché dipped in the etching solution to form a patt... | 08/26/2010 |
| 20100151597 | METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid... | 06/17/2010 |
| 20100116423 | MICRO-FLUID EJECTION DEVICE AND METHOD FOR ASSEMBLING A MICRO-FLUID EJECTION DEVICE BY WAFER-TO-WAFER BONDING A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of t... | 05/13/2010 |
| 20100108642 | METHOD FOR REMOVING FINE-GRAIN SILICON MATERIAL FROM GROUND SILICON MATERIAL AND APPARATUS FOR CARRYING OUT THE METHOD A method and an apparatus for removing fine-grain silicon material from coarse-grain ground silicon material are disclosed. In the method, ground silicon material is selected that exhibits a predominantly brown color in an aqueous suspension, indicating that a considera... | 05/06/2010 |
| 20100105179 | METHOD FOR MANUFACTURING FLASH MEMORY DEVICE A method for manufacturing a flash memory device is capable of controlling a phenomenon in which a length of the channel between a source and a drain is decreased due to undercut. The method includes forming a gate electrode comprising a floating gate, an ONO film and a... | 04/29/2010 |
| 20100093128 | METHOD FOR MANUFACTURING IMAGE SENSOR In a method for manufacturing an image sensor, readout circuitry is formed in a first substrate. A first interlayer dielectric is formed over the first substrate. An interconnection is formed at the first interlayer dielectric, and the interconnection is electrically co... | 04/15/2010 |
| 20100055398 | Single-Sided Textured Sheet Wafer An apparatus for texturing two-sided wafers has a body capable of containing texturing chemistry (i.e., not necessarily containing the chemistry at this time), and a transport mechanism for transporting wafers through the texturing chemistry. The transport mechanism is ... | 03/04/2010 |
| 20100032410 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD A substrate processing apparatus includes a bath in which a liquid or a gas is fed, and a mechanism which feeds out a liquid or a gas into the bath. The substrate processing apparatus processes a to-be-processed substrate which is disposed in the bath. The mechanism inc... | 02/11/2010 |
| 20100015756 | HYBRID HETEROJUNCTION SOLAR CELL FABRICATION USING A DOPING LAYER MASK Embodiments of the invention contemplate the formation of a high efficiency solar cell using a novel processing sequence to form a solar cell device. In one embodiment, the methods include forming a doping layer on a back surface of a substrate, heating the doping layer... | 01/21/2010 |
| 20100015810 | SURFACE PROCESSING METHOD AND SURFACE PROCESSING APPARATUS A processing object 2 is sucked and fixed by a sucker 11 and rotated by a rotator 12. In that state, a processing liquid supplied from a processing liquid supply 22 is applied through a processing liquid application tube 21 onto a surf... | 01/21/2010 |
| 20090301515 | MICROWAVE ASSISTED CHEMICAL STRIPPING OF COATINGS A method for chemically stripping a metallic coating from a substrate is described. The coating is treated in the presence of microwave energy with a solution containing at least one acid known to dissolve the coating. The application of microwave energy accelerates the... | 12/10/2009 |
| 20090250431 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD A substrate processing method that processes a substrate on which a plurality of patterns adjacent to each other are formed, has: supplying a first processing liquid to a principal surface of the substrate that is dry and has the patterns formed thereon to make the firs... | 10/08/2009 |
| 20090227114 | APPARATUS AND METHOD FOR ETCHING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE A process for etching the surfaces of semiconductor substrates utilizes a texturing tank which introduces a process fluid through a circulating system. The process fluid is heated to a desired temperature and maintained at a desired concentration prior to entering a pro... | 09/10/2009 |
| 20090176349 | Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeri... | 07/09/2009 |
| 20090114619 | WET ETCHING METHOD AND WET ETCHING APPARATUS A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by bringing a solution in which nitrous oxide (N2O) is dissolved into... | 05/07/2009 |
| 20090081881 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR PERFORMING ETCHING PROCESS WITH PHOSPHORIC ACID SOLUTION An additive containing a hexafluorosilicic acid solution (H2SiF6+H2O) is sequentially inputted into a phosphoric acid solution pooled in an immersion bath from an additive input mechanism. Further, a trap agent containing a fluoroboric a... | 03/26/2009 |
| 20090075421 | Wet etching of zinc tin oxide thin films A method of wet etching semiconductor zinc tin oxide includes submerging a semiconductor zinc tin oxide film in a bath solution. The film is partially covered with a pattern of protective material, and the bath solution etches semiconductor zinc tin oxide film not cover... | 03/19/2009 |
| 20090042385 | METHOD OF MANUFACTURING METAL LINE A method of manufacturing a metal line according to embodiments includes forming an interlayer dielectric layer over a semiconductor substrate. A dielectric layer is formed over the interlayer dielectric layer. A trench may be formed by etching the dielectric layer and ... | 02/12/2009 |
| 20090032492 | APPARATUS AND METHOD FOR WET-CHEMICAL PROCESSING OF FLAT, THIN SUBSTRATES IN A CONTINUOUS METHOD The invention relates to a method and apparatus for wet-chemical processes (cleaning, etching, stripping, coating, dehydration) in a continuous method for flat, thin and fracture-sensitive substrates, the substrate transport and the wet process being effected by media-a... | 02/05/2009 |
| 20090032497 | System and method for controlling the application of acid etchers or cleaners by means of color-changing dye An acidic etcher solution for etching a substrate's surface. The acidic etcher solution includes an acid and a pH indicator, the pH indicator having at least one color transition at a pH below 7. The acidic etcher solution having an initial color at an initial pH when a... | 02/05/2009 |
| 20090011600 | METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE The present invention is directed to a method and an apparatus for manufacturing a semiconductor device including step S22 to form an insulating film on a front surface of a semiconductor wafer that is a surface on which a semiconductor element is to be formed an... | 01/08/2009 |
| 20090008364 | Method and Device for Etching Substrates Contained in an Etching Solution The invention relates to a method for etching substrates (4) received in an etching solution (2). Said method comprises the following steps: A basin (1) which can receive the etching solution (2) is prepared, the substrate (4) is compl... | 01/08/2009 |
| 20080296262 | Process and Device for Cleaning and Etching a Substrate Wi A simple process is disclosed for treating substrates having pre-structured zinc oxide layers on rigid or flexible supports. The ZnO is treated with an etching medium then with a cleaning liquid. The treatment with the etching and cleaning liquids is carried out while t... | 12/04/2008 |
| 20080277380 | PROCESSES AND APPARATUSES FOR PRODUCING POROUS MATERIALS Processes and apparatuses for producing a porous material, such as nano-porous silicon (npSi) media suitable for storage and retrieval of elemental hydrogen. Processes of this invention generally entail applying a magnetic field to a substrate that contains charge carri... | 11/13/2008 |
| 20080264905 | METHODS AND SYSTEMS FOR MEASURING A CHARACTERISTIC OF A SUBSTRATE OR PREPARING A SUBSTRATE FOR ANALYSIS Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cr... | 10/30/2008 |
| 20080236745 | METHOD AND APPARATUS FOR FABRICATING OR ALTERING MICROSTRUCTURES USING LOCAL CHEMICAL ALTERATIONS A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure.... | 10/02/2008 |
| 20080242103 | Method of manufacturing semiconductor device and semiconductor manufacturing apparatus A method of manufacturing a semiconductor device having a process for cleaning a semiconductor substrate after the semiconductor substrate is etched for patterning includes a first process of preparing the semiconductor substrate having a first temperature, a second pro... | 10/02/2008 |
