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| Number | Title | Issue Date |
| 8062469 | Adhesive resin composition and bonding method The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radica... | 11/22/2011 |
| 8062468 | Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures... | 11/22/2011 |
| 8062467 | Two-component adhesive for producing semi-finished products and composite sandwich materials Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecul... | 11/22/2011 |
| 7998305 | Electrical interconnect using locally conductive adhesive An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two c... | 08/16/2011 |
| 7967943 | Circuit-connecting material and circuit terminal connected structure and connecting method A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as esse... | 06/28/2011 |
| 7922860 | Manufacturing inkjet head by adhering with epoxy resins and alkyl imidazole Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturi... | 04/12/2011 |
| 7892396 | Toughened activatable material for sealing, baffling or reinforcing and method of forming same An activatable material and articles incorporating the same is disclosed. The activatable material includes at least three of epoxy resin; impact modifier; blowing agent; curing agent; and filler. The activatable material is preferably used for sealing, baffling, ad... | 02/22/2011 |
| 7785440 | Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii... | 08/31/2010 |
| 7740734 | Low shrinkage epoxy-cationic curable compositions The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or mixtures of those; at least one compound with two aromatic rings and at leas... | 06/22/2010 |
| 7547373 | Two-part epoxy adhesives with improved flexibility and process for making and using same A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer and an unmodified or modified aliphatic amine, an unmodified or modif... | 06/16/2009 |
| 7524394 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an... | 04/28/2009 |
| 7384683 | Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a ... | 06/10/2008 |
| 7368170 | Viscous chemical anchoring adhesive A chemical anchoring adhesive includes a first part having a viscosity of about 200,000 to about 4,000,000 centipoise and a second part having a viscosity of about 200,000 to about 4,000,000 centipoise. The chemical anchoring adhesive can be in the form of a slug or... | 05/06/2008 |
| 7360867 | Adhesive agent and inkjet head and manufacturing method thereof Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bis... | 04/22/2008 |
| 7354499 | Method for making a lubricating fast setting epoxy composition A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystallin... | 04/08/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7342053 | Resin composition, adhesive film using the same and multilayer printed circuit board Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curi... | 03/11/2008 |
| 7335301 | Fold protection for spiral filtration modules utilizing UV cured adhesive and method of providing same The present invention encompasses a leaf packet useful in forming a spiral filtration module, wherein the fold area of the leaf packet is reinforced with a UV cured adhesive. The invention further encompasses a spiral filtration module wherein the fold line, side se... | 02/26/2008 |
| 7326316 | Electrical interconnect using locally conductive adhesive An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at feast one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two c... | 02/05/2008 |
| 7326755 | Coolant resistant and thermally stable primer composition A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additi... | 02/05/2008 |
| 7317055 | Adhesive resin and adhesive resin composition for liquid crystalline polymer An adhesive resin for a liquid crystal polymer, comprising a modified polyolefin (D) prepared by graft polymerizing at least one epoxy group-containing ethylenically unsaturated monomer (B) to a polyolefin (A) obtained by polymerizing one or more olefins selected fr... | 01/08/2008 |
| 7303675 | Blister protection for spiral wound elements A method for preventing osmotic blistering in spirally-wound elements of semipermeable membrane sheet material (14) by applying an effective coating of a sealant (41, 43, 45) to the upstream surface of such membrane material in regions where such poten... | 12/04/2007 |
| 7288161 | Reworkable adhesives containing thermally labile groups Embodiments of the present invention relate to adhesive compositions containing thermally-labile groups for decreasing the degradation temperature of the adhesive for reworkability of electronic components in surface mounting applications. In one embodiment, the the... | 10/30/2007 |
| 7278212 | Universal joint with adhesive bearing cup retention method A universal joint including a spider having a plurality of trunnions. The universal joint also includes a pair of yokes, where each yoke has a pair of arms with an aperture formed therethrough, and each yoke is arranged such that an opposite pair of the trunnions ar... | 10/09/2007 |
| 7267868 | Composite products and molded articles obtained from said products An uncured composite product having a middle fibrous reinforcement, a thermosetting-resin based layer and a hardening-agent based layer for the thermosetting resin. The thermosetting-resin based layer is placed on one side of the fibrous reinforcement and the harden... | 09/11/2007 |
| 7265044 | Method for forming bump on electrode pad with use of double-layered film A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrod... | 09/04/2007 |
| 7262514 | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less semiconductor device encapsulation which device comprising an encapsulating resin laye... | 08/28/2007 |
| 7252735 | Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii... | 08/07/2007 |
| 7247381 | Adhesive for bonding circuit members, circuit board, and method of producing the same An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and... | 07/24/2007 |
| 7247596 | Stabilized organoborane polymerization initiators and polymerizable compositions The invention is polymerizable compositions comprising in one part an organoboron compound capable of forming a free radical generating species and a stabilizing amount of one or more compounds comprising a dihydrocarbyl hydroxyl amine, an alicyclic hydroxyl amine, ... | 07/24/2007 |
| 7208062 | Method of producing multilayer printed wiring board Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting res... | 04/24/2007 |
| 7208105 | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing directi... | 04/24/2007 |
| 7198989 | Method of producing a COF flexible printed wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF fl... | 04/03/2007 |
| 7186310 | Method for forming a honeycomb sandwich composite panel A method for forming a honeycomb sandwich composite panel comprising dry fabrics, an unpermeating-resin film, a non-low-viscosity-resin film, a honeycomb core, a non-low-viscosity resin film, an unpermeating-resin film and dry fabrics, stacked in this order in a mol... | 03/06/2007 |
| 7169462 | Waterproofing membrane A waterproofing membrane composition is provided which is strong, easy to use, trowelable, flexible, passes negative hydrostatic test ASTM D4068 and which can be flood tested after 24 hours @ 70° F. of application. The waterproofing membrane composition contains a ... | 01/30/2007 |
| 7166180 | Method of vacuum-laminating adhesive film The present invention relates to a vacuum-laminating method for adhesive films where adhesive bleeding is reduced. ... | 01/23/2007 |
| 7157143 | Two-component epoxy adhesive formulation for high elongation with low modulus Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, ... | 01/02/2007 |
| 7157399 | Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo... | 01/02/2007 |
| 7153788 | Method and apparatus for attaching a workpiece to a workpiece support A method for attaching a workpiece, for example a semiconductor die, to a workpiece holder, for example a lead frame die support, comprises the steps of interposing an uncured adhesive between the semiconductor die and the die support and preheating the adhesive fro... | 12/26/2006 |
| 7144630 | Aqueous adhesive compositions for bonding elastomers The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal. ... | 12/05/2006 |
