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Class 156/323 - Interposing subsequently removed flexible element between lamina and a pressure applying surface


Subclass of Class 156 - Adhesive bonding and miscellaneous chemical manufacture
Definition: Processes in which a removable flexible and/or resilient
No. of patents: 168
Last issue date: 02/14/2012


1          
NumberTitleIssue Date
8114243Mounting method using thermocompression head
A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having ...
02/14/2012
7279062Method for the production of a laminate with mutually offset layers
A method for the production under elevated pressure and temperature of a laminate (1, 1′) consisting of a pack with alternating metal layers (2) and plastic bonding layers (3), comprises stacking a first series (8) of layers on top of o...
10/09/2007
7223318Method for forming a laminate with a rebate
A method for the production of a laminate consisting of metal layers as well as at least one fibre-reinforced bonding layer (5–7) that is located between the metal layers (1–4), which laminate has at least one region (9) that has a smaller n...
05/29/2007
6986827Method for bonding non-magnetic members
A method for bonding a plurality of non-magnetic members includes the steps of (1) mating the non-magnetic members via an uncured adhesive interposed between their surfaces to be bonded; (2) applying pressure to their mated portions between a pressing magnet jig and...
01/17/2006
6866731Process for structuring a paper poster or paper photograph
The process in accordance with the invention for producing a three-dimensional surface structure in a paper poster or paper photograph is used especially for the plastic reproduction of paintings. A paper poster or paper photograph is thereby placed face down onto a...
03/15/2005
6849150System and method of forming structural assemblies with 3-D woven joint pre-forms
A system and method for forming structural assemblies with 3-D woven joint pre-forms. The method of the present invention forms complex structural assemblies with pre-formed structures. Adhesive is applied between the preformed structures and uncured 3-D woven texti...
02/01/2005
6802931Method for producing composite structure
A method for producing a composite structure having a three-dimensionally curved portion and a cylindrical portion, comprising the steps of: (a) placing an outer skin made of a composite prepreg on a forming die; (b) mounting a honeycomb core on a portion of the out...
10/12/2004
6802925Laminating film and lamination process using the same
The present invention provides a laminating film which has a thin base material processable with a low energy and a protection layer capable of giving a high optical density and a high glossiness to a printed image by lamination, and to provide a process for laminat...
10/12/2004
6790306Method for forming a cover layer on a disk
Method for forming a cover layer on a disk. The method includes a coating step, in which an uncured cover layer is coated on the surface of the disk, and the average thickness of the cover layer is enough to support to the requirement of a predetermined laminating t...
09/14/2004
6688948Wafer surface protection method
In a wafer surface protection method, a protective film is formed on a front surface of a wafer before the wafer performs a potentially wafer process. The protective film is a non-adhesive layer. An adhesive tape is adhered onto the protective film before...
02/10/2004
6669805Drill stack formation
The present invention provides a method of temporarily adhering a stack of sheets together to facilitate drilling a hole through the stack of sheets. The method includes using a temporary adhesive that prevents burring while drilling a hole through the st...
12/30/2003
6620489Self-adhering image
A self-adhering image made by the steps comprising: forming an imaged receiver sheet (140) having an image (230), a first thermoplastic layer (304), and a first support layer (150); laminating an imageless receiver sheet (160) with a second thermoplastic ...
09/16/2003
6616793Production of multilayered thin plasters comprising a carrier material based on polyurethane
A process for producing multilayered thin plasters with a carrier material based on polyurethane with the steps of applying at least one layer of uncured polyurethane to a transfer layer, applying an adhesive composition to a release layer, laminating the...
09/09/2003
6572720Method for laminating high quality transparencies
Various methods for laminating a high quality transparency which consist of the steps: creating an imaged receiver sheet (140) with a first support layer (150); laminating an imageless second receiver sheet (160) with an second support layer (170) to the ...
06/03/2003
6551441Method for producing honeycomb sandwich panel
A honeycomb sandwich panel is produced by (a) mounting a honeycomb core on a lower prepreg laminate skin placed on a forming die, (b) superimposing thereon an upper prepreg laminate skin to cover the honeycomb core, (c) mounting flat plate-shaped elastic ...
04/22/2003
6517658Fiber-resin composite body for providing electromagnetic shielding, comprising an electrical contact strip, and method for making same
A method for fabricating a fiber-resin composite body for providing electromagnetic shielding. The body has a resin-impregnated fiber fabric and an electrically conductive fiber fabric, wholly or partially impregnated with resin material, one surface of t...
02/11/2003
6458237Mounting method of semiconductor device
A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board....
10/01/2002
6423167Method for controlling laminate gloss
A method for forming a glossy decorative laminate is disclosed. The method is achieved by stacking a decorative laminate sheet assembly having a top layer, casting a polypropylene release sheet wherein the polypropylene release sheet is processed with chi...
07/23/2002
6423174Apparatus and insertless method for forming cavity substrates using coated membrane
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavitie...
07/23/2002
6391142Method of bonding substrates
A substrate is permanently bonded to a thermoplastic member by applying a sufficient degree of heat and pressure. Thermoplastic is notoriously non-receptive to even the most aggressive adhesives. As such, it has been extremely difficult to attach non-plas...
05/21/2002
6336987Process for the manufacture of a flexible heat exchanger
A method of producing a flexible heat-exchange device including a body having a flexible mats and an internal passageway for heat-carrying fluid, an inlet and an outlet, including placing first and second plastic elastic mats in a mould die having support...
01/08/2002
6306240Method for making smart cards, and resulting cards
A method for making cards with an electronic module is disclosed. The method comprises the steps of providing a card body (1) having a cavity (3, 4), an electronic module (5) shaped to fit said cavity, and a cyanoacrylate adhesive, depositing said adhesiv...
10/23/2001
6270879Release member for use in producing a multi-layer printed wiring board
The release member has a thermoplastic layer sandwiched between stripping films such that it flows toward the hole upon melting when it is heated under pressure and the stripping film in contact with the laminate has a breaking elongation of not less than...
08/07/2001
6270602Air removal and fastener extraction system
An air removal and fastener extraction system for use in retreading tires is disclosed. The system includes a strap that is disposed over a splice region of the tread during precure retreading. A plurality of fasteners are inserted through the strap and a...
08/07/2001
6270603Repair method for uniformly heating composite structure
We control the cure temperature within &#b1;15° F. (8° C.) for organic resin matrix composites with a thermal diffusion apparatus which contains a liquid fluid transfer medium to convey heat from an immersed resistance heater to the repair site. Uniform...
08/07/2001
6203652Method of forming a via in a substrate
A method of forming a via in a substrate is provided. The method generally includes laminating a support to the substrate, forming the via in the substrate, and then stripping the support from the substrate. The support is preferably a photoresist that co...
03/20/2001
6179951Method of protecting a non-planar feature using compressive pads and apparatus thereof
The present invention relates generally to a new apparatus and method for forming non-planar surfaces in substrates. More particularly, the invention encompasses an apparatus and a method for fabricating non-planar surfaces in semiconductor substrates whe...
01/30/2001
6113730Metal-foil-clad composite ceramic board and process for the production thereof
A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) und...
09/05/2000
6103047Three dimensional molded body using urethane elastomer and method for manufacturing the same
A three dimensional molded body which is thin and has an excellent shape-maintainability and a method for manufacturing the three dimensional molded body, which is low in cost and high in productivity. An urethane elastomer (33), which comprises a non-foa...
08/15/2000
6090237Apparatus for restraining adhesive overflow in a multilayer substrate assembly during lamination
Resin overflow in the interior cavity of a multilayer substrate assembly during lamination is restricted and controlled by a plug inserted into the cavity prior to bonding. The plug is shaped to mate with the stepped vertical profile of the cavity. The pl...
07/18/2000
5989377Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating
A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer to one side of a protective film, and applying a preferably electron beam ...
11/23/1999
5972140Method of fabricating multilayer structures with nonplanar surfaces
A method of fabricating a plurality of multilayer structures which includes at least one recess defined by a nonplanar surface. The method including the steps of: (a) providing a resilient, compliant material on over one or more stacks of layers including...
10/26/1999
5922159Ink jet imaging layer transfer process
A method for the preparation of ink jet receptor elements that contain receptor layers on difficult to coat substrates is disclosed. An element that contains, in order, a carrier sheet, a receptor layer, and an adhesive layer is laminated to the substrate...
07/13/1999
5902443Method for bonding with cyanoacrylate adhesive
There is disclosed a method for accelerating the cure of cyanoacrylate adhesive by contacting the adhesive with a coating of an accelerator on a tape or sheet. Preferred embodiments relate to bonding a fabric to a substrate by placing a fabric in pressure...
05/11/1999
5882455Apparatus and method for forming isotropic multilayer ceramic substrates
Disclosed is an apparatus for laminating a plurality of ceramic greensheets which includes a frame, a bottom plate at one end of the frame, a punch at a second end of the frame, and a non-metallic pad within the frame and between the bottom plate and punc...
03/16/1999
5866470Method of using an interface layer for stacked lamination sizing and sintering
A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect ...
02/02/1999
5851339Method of making a laminated product such as a mattress and furniture insulator pad
The present invention relates to a method of making a laminated product, such as an insulator pad comprised of foam and stiffening layers held together with adhesive. A thin protective barrier foam sheet is placed between the surface of a compression roll...
12/22/1998
5837341Laminated printing sheet
Process for producing a composite tamper resistant product. A laminated printing sheet includes a sheet of fusible synthetic paper having an outer surface and an inner surface, the inner surface of the fusible synthetic paper being removably adhered by a ...
11/17/1998
5784782Method for fabricating printed circuit boards with cavities
A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized ...
07/28/1998
5759320Method of forming cavity substrates using compressive pads
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavitie...
06/02/1998
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