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| Number | Title | Issue Date |
| 7572351 | Process for producing wiring circuit board The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the pat... | 08/11/2009 |
| 7517424 | Elastic microchannel collimating arrays and method of fabrication A microchannel collimating array may be fabricated by casting an elastic sheet onto a substrate containing a plurality of pedestals. The elastic sheet may be cured, and then pulled away from the substrate, leaving the elastic sheet with a plurality of tubes at the l... | 04/14/2009 |
| 7442270 | Highly reflective asphalt-based roofing membrane A prefabricated asphalt-based waterproof roofing membrane for use in a multi-ply asphalt-based commercial roofing system, e.g. a cap sheet that forms the exposed layer of a multi-ply built-up roofing system, is manufactured at a factory to have a highly reflective t... | 10/28/2008 |
| 7426766 | Tufted air mattress and method of making same A tufted air mattress including a first printed sheet and a second sheet. The first printed sheet is printed over a selected area with an ink containing a fluoropolymer. The portion of the printed sheet with the ink defines a coated area. The first printed sheet att... | 09/23/2008 |
| 7410551 | Method of hot marking, and a multilayer structure for implementing such a method The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect... | 08/12/2008 |
| 7402220 | Method for manufacturing multi-layered unit for multi-layered ceramic electronic component It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an el... | 07/22/2008 |
| 7396425 | Method of production of peeling layer paste and method of production of multilayer type electronic device A method of production of peeling layer paste used for producing a multilayer electronic device, having a step of preparing a primary slurry containing a ceramic powder having an average particle size of 0.1 pm or less, a binder, and a dispersion agent and having a ... | 07/08/2008 |
| 7393425 | Methods for cable sealing Methods for providing a cable closure enclosing a cable splice include wrapping a flexible wrap including a gel layer and a flexible support layer around the cable splice with the gel layer adjacent the cable splice. The gel layer may have an adhesion-reducing subst... | 07/01/2008 |
| 7374633 | Extended wrap label A method for making a unitary label suitable for attachment to an object with a circumference, including forming the label with first and second contiguous label portions. The first and second label portions each have top and bottom surfaces. The first and second la... | 05/20/2008 |
| 7372200 | Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment The present invention uses plastic film in vacuum sealing an OLED. Inorganic insulating films which can prevent oxygen or water from being penetrated therein and an organic insulating film which has a smaller internal stress than that of the inorganic insulating fil... | 05/13/2008 |
| 7371298 | Linear stamp applicator machine and method of operating the same A method for applying tax stamps to individual cigarette packages of different cigarette cartons, having different height dimensions, comprises the provision of a cigarette carton height determination station, a cigarette carton opening station, a cigarette package ... | 05/13/2008 |
| 7361247 | Matched heat transfer materials and method of use thereof A heat transfer material kit is disclosed that includes a first heat transfer material that includes a printable, peelable transfer film, and a second, different heat transfer material that includes an overlay transfer film. A method of using the kit is disclosed th... | 04/22/2008 |
| 7354498 | Pallet labeler system A pallet labeler station for applying a printed label to a loaded pallet at a predetermined label position includes a label printer for printing a label to be affixed to the loaded pallet, a rotatable label applicator mechanism for applying the printed label to the ... | 04/08/2008 |
| 7346982 | Method of fabricating printed circuit board having thin core layer A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after t... | 03/25/2008 |
| 7334586 | Imprinting device for a cosmetic product and method of using same An imprinting device for a cosmetic product is shown. The imprinting device comprises a transparent substrate and an application element which is fixedly or removeably affixed to and protrudes outwardly from one surface of the transparent substrate. The application ... | 02/26/2008 |
| 7332047 | Adherent, removable barrier film for tire carcass A bond of a rubbery component to a virgin surface of a tire's cured innerliner which virgin surface has never been contaminated by the remnants of a release agent left after buffing with a wire brush and solvent-cleaning the cured innerliner, is unexpectedly stronge... | 02/19/2008 |
| 7332205 | Adhesive articles with improved air egress This invention relates to an adhesive article which provides air egress. Air egress is provided by supplying a route, such as areas of no initial adhesion for the air to flow out from under the construction. The invention relates to an adhesive article comprising a ... | 02/19/2008 |
| 7326857 | Method and structure for creating printed circuit boards with stepped thickness A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the bre... | 02/05/2008 |
| 7320173 | Method for interconnecting multi-layer printed circuit board A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer expos... | 01/22/2008 |
| 7318590 | Pattern adhesive seal products and method of production The present invention is drawn to a method of making a sealing product, by a) selecting an a sealing material of an optimum film, mat or multi-well plate surface material for a specific sealing application; b) treating the sealing material; and c) directly coating t... | 01/15/2008 |
| 7309399 | System and method for manufacturing filling strips configured for use with a corrugated member A method of manufacturing filling strips for placement between a surface and a corrugated member wherein the corrugation defines a profile. The method includes: providing a sheet of material having a longitudinal axis and first and second major surfaces; forming at ... | 12/18/2007 |
| 7308991 | Blown bottle with intrinsic liner A container for holding and dispensing liquid having a container wall comprising a rigid portion that dimensionally defines the container, a liner portion disposed within the container adjacent to the rigid portion, and an adhesive layer disposed between the rigid p... | 12/18/2007 |
| 7282257 | Resin composition and adhesive film for multi-layered printing wiring board The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being... | 10/16/2007 |
| 7279400 | Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass A method of fabricating a silicon-on-plastic layer via layer transfer includes depositing a layer of SiGe on a silicon substrate; depositing a layer of silicon; implanting splitting hydrogen ions into the silicon substrate; bonding a glass substrate to the silicon l... | 10/09/2007 |
| 7273288 | Ribbed telescope mirrors with thermal gradient control Ribbed mirrors allowing heat to be conducted past the glass during optical polish and application of coatings and methods of fabricating same. The method comprises placing a bridge of thermally conductive material in thermal contact with the mirror plate and the sup... | 09/25/2007 |
| 7272888 | Method of fabricating semiconductor chip assemblies A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of t... | 09/25/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7244331 | Method of producing an LTCC substrate with cavities having improved bondability A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchab... | 07/17/2007 |
| 7241356 | Composite structure with one or several polyurethane layers, method for their manufacture and use thereof A composite structure is disclosed. The structure includes one or several polyurethane layers, a support layer, in particular a textile support layer, as well as an optional adhesive layer placed between these layers. The composite structure is characterized in that... | 07/10/2007 |
| 7238246 | Process for the flush connection of bodies In the swell-welding according to the invention of two bodies, of which at least one body consists of plastic, the connection surface of the plastic body is firstly exposed to a gas which contains the vapor of a swelling agent for the plastic. The plastic body rever... | 07/03/2007 |
| 7235465 | Process for producing semiconductor chips having a protective film on the back surface A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release she... | 06/26/2007 |
| 7235294 | Cohesive coating for snack food packaging A water based, cold seal, cohesive coating for bonding one or more substrates together to form a flexible package to contain an article, especially useful for snack food packaging. The cohesive coating includes about 25% to about 90% by weight of a natural rubber la... | 06/26/2007 |
| 7232501 | Laminate sheet, laminate sheet roll, and producing methods therefor An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 30... | 06/19/2007 |
| 7224278 | Label with electronic components and method of making same A method of making an electronic label, such as an RFID label, includes attaching a circuit, such as an antenna, to a substrate material, applying an adhesive layer to the substrate material over the circuit, adding a release layer over the adhesive layer, forming a... | 05/29/2007 |
| 7210276 | Wooden floor The invention relates to a wooden floor, consisting of a hardenable adhesive (12) which is painted onto a floor base (10) in a continuous layer, and covering elements (16) consisting of wood or a wood material that are joined to the adhesive in ... | 05/01/2007 |
| 7207157 | Stack sealing method using multilayer packaging film A heat-shrinkable multilayer film comprises (A) a first layer, which is an outer layer, and which comprises polyolefin; (B) a second layer comprising at least one member selected from the group consisting of polyolefin, polystyrene, and polyurethane, wherein the sec... | 04/24/2007 |
| 7195689 | Double-sided labels and methods of manufacture and use The invention generally relates to double-sided labels and methods of manufacture and use. More specifically, the invention relates to labels that include printed information on their front and back sides. The labels also include a detachable portion, which includes... | 03/27/2007 |
| 7191930 | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of ... | 03/20/2007 |
| 7189302 | Multi-layer printed circuit board and fabricating method thereof A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of th... | 03/13/2007 |
| 7189300 | Flexible film packaging having removable strip Slitters cut through a first layer of film immediately prior to lamination of the first layer to a second layer of film to form a strip therebetween. The degree of bonding between the first and second layers is adjusted so that the strip can be removed without harmi... | 03/13/2007 |