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| Number | Title | Issue Date |
| 8101040 | Method for producing fusion-bonded body A fusion-bonded body which includes a fusion-bonded part obtained by fusion-bonding to each other a first part to be fusion-bonded which comprises a first thermoplastic resin and first carbon fibers and a second part to be fusion-bonded which comprises a second ther... | 01/24/2012 |
| 7510621 | Conductive adhesive bonding Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed togeth... | 03/31/2009 |
| 7402269 | Environmentally stable hybrid fabric system for exterior protection of an aircraft A method of forming an exterior surface protective structure (12) for an aircraft (10) includes uniting a loaded surfacer (52) having a carrier (51) to a hybrid prepreg substrate (32). The prepreg substrate (32) includes a c... | 07/22/2008 |
| 7371303 | Fastening device for fastening small components to a mounting surface by adhesive bonding A fastening device for fastening a small component, in particular a stud provided with an adhesive flange, to a mounting surface using a heat-activated adhesive that creates an adhesive bond between the component and the mounting surface, has an induction coil to he... | 05/13/2008 |
| 7368035 | Method for brazing and adhesive bonding An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge portion of the second panel with the edge portion of the first panel s... | 05/06/2008 |
| 7338085 | Fusion-bonded processed product of resin member, method for producing same and method for fusion-bonding resin members When resin members (3, 4) are fusion-bonded to each other by electric-conduction heating, a net-form or pattern-form metal wire (2) as a resistance heating element is disposed at a joint portion of the resin members (3, 4), and a metal wire (... | 03/04/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7285235 | Manufacturing conduits for use in placing a target vessel in fluid communication with a source of blood Methods and devices for manufacturing a conduit for placing a target vessel in fluid communication with a source of blood, such as a heart chamber containing blood. The conduit includes first and second portion adapted to be placed in fluid communication with a hear... | 10/23/2007 |
| 7256374 | Induction heating apparatus for controlling the welding parameter of temperature for heat treating a section of piping The present invention relates to a novel induction heating apparatus for controlling the welding parameter of temperature for a pre-weld heating operation, interpass operation, or a hydrogen bake-out operation. Specifically, the present invention relates to using a ... | 08/14/2007 |
| 7239485 | Localized heating element for a suspension assembly The present invention provides a suspension assembly having a slider body with a trailing edge face. A bond pad is positioned on the trailing edge face and a conductive trace is connected to the bond pad to form an electrical connection. A heating element includes a... | 07/03/2007 |
| 7208115 | Method of fabricating a polymer matrix composite electromagnetic shielding structure An exemplary method of manufacturing a polymer matrix composite electromagnetic shielding structure includes pretreating a dry fiber reinforcement with a composition including a carrier and a conductive element, laying out the pretreated reinforcement to form a pre-... | 04/24/2007 |
| 7196698 | Display apparatus and assembly of its driving circuit A display apparatus and an assembly of a driving circuit for the display apparatus having a display device, a film carrier with a lead to transfer a signal for driving the display device, and a bus board to supply a signal to the lead. A dummy lead is provided along... | 03/27/2007 |
| 7192841 | Method of wafer/substrate bonding A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer (2) on one of the components (1,4) and arranging the components (1,4) in spaced relationship with the intermediate layer (2) therebetwee... | 03/20/2007 |
| 7153759 | Method of fabricating microelectromechanical system structures A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stackin... | 12/26/2006 |
| 7115182 | Anodic bonding process for ceramics A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed ov... | 10/03/2006 |
| 7092193 | Dynamically adjustable head disk spacing slider using thermal expansion A disk drive includes a slider assembly and a controller that directs current to the slider assembly to dynamically adjust the head-to-disk spacing. In one embodiment, the slider assembly includes a write element having a first end, a second end and an intermediate ... | 08/15/2006 |
| 7061104 | Apparatus for conditioning power and managing thermal energy in an electronic device In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device.... | 06/13/2006 |
| 7041589 | Metal bump with an insulating sidewall and method of fabricating thereof Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions o... | 05/09/2006 |
| 7018217 | Structurally integrable electrode and associated assembly and fabrication method A structurally integrable electrode, an assembly with an integrated electrode, and an associated method are provided. The electrode is configured to provide an electrically conductive path between nodes of an electrical circuit of a structural member. In particular,... | 03/28/2006 |
| 6962642 | Treating copper surfaces for electronic applications A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consis... | 11/08/2005 |
| 6958539 | Metal bump with an insulating sidewall and method of fabricating thereof Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions o... | 10/25/2005 |
| 6951798 | Method of bonding a stack of layers by electromagnetic induction heating A method of bonding multiple layers is provided. The method includes the steps of stacking the multiple layers on top of each other and volumetrically heating the stack of multiple layers to a predetermined temperature. It is preferred that the stack is heated by el... | 10/04/2005 |
| 6887328 | Induction splicing of photographic film strips A method is described for splicing together overlapping ends of first and second lengths of photographic film strips of common film strip width, comprising positioning a bonding element between an overlapping end of the first length of photographic film and a corres... | 05/03/2005 |
| 6838617 | Macroencapsulation container having both releasable and permanent sealing means A macroencapsulation container having in combination an inner container member with an inner lid member and an inner body member, and an outer container member with an outer lid member and an outer body member, the inner container member being composed of a thermopl... | 01/04/2005 |
| 6832716 | Bonded products and methods of fabrication therefor This invention relates to a method of fabricating a bonded product comprising at least two components that are bonded together, the method comprising the steps of: a) bringing the components together; and b) heating the components; wherein at least one of the compon... | 12/21/2004 |
| 6833042 | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating a... | 12/21/2004 |
| 6823693 | Anodic bonding A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The c... | 11/30/2004 |
| 6706136 | Resin composition for high-frequency bonding A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume o... | 03/16/2004 |
| 6667100 | Ultra-thin flexible expanded graphite heating element An ultra-thin flexible expanded graphite heating high resistance element is produced by a method including the steps of providing a flexible expanded graphite sheet having a surface adhered to a substrate; pulling apart the sheet and the substrate with a ... | 12/23/2003 |
| 6605168 | Method for fastening a flat strip lamella to the surface of a building component A method for fastening a flat strip lamella (10) to the surface of a building component (12). According to the inventive method, the face (14) of the flat strip lamella (10) is pressed against the surface of the building using an adhesive coating (16) con... | 08/12/2003 |
| 6544430 | Methods for detaching a layer from a substrate Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric fi... | 04/08/2003 |
| 6527903 | Substrate bonding method, bonded product, ink jet head, and image forming apparatus A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are al... | 03/04/2003 |
| 6524690 | Method of prepregging with resin and novel prepregs produced by such method Disclosed is a process of forming a prepreg material having substantially no voids. According to the process of the invention, the reinforcing material is heated to a temperature above the temperature of the impregnating resin. The prepreg formed has subs... | 02/25/2003 |
| 6475326 | Anodic bonding of a stack of conductive and glass layers We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The... | 11/05/2002 |
| 6471799 | Method and device for producing gypsum boards Provided are a process and an apparatus for producing gypsum boards, both of which feature minimized occurrence of defective products and especially excellent continuous productivity and superb efficiency. Making use of the facts that lining paper sheets ... | 10/29/2002 |
| 6461455 | Method of producing a hybrid leaf spring In a method for making a hybrid leaf spring at least one layer of composite material is provided and a metal primary leaf. The layer of composite material and metal primary leaf are positioned adjacent one another in a mold having an interior cavity defin... | 10/08/2002 |
| 6440776 | Securing an optical component onto a micro bench A method of attaching a component onto a microbench includes laying the component in a groove in the substrate, and locally deforming a portion of the groove, to thereby hold the component in the groove. Preferably, the microbench is a silicon substrate u... | 08/27/2002 |
| 6413350 | Method and device for fitting pull-off tabs to pourable food product packaging material A method of fitting pull-off tabs (2), made of heat-seal material, to strip packaging material (4) having a number of through openings (3) and covered, on the opposite side to that to which the tabs (2) are fitted, with at least a first and a second lamin... | 07/02/2002 |
| 6409183 | Reinforced elongate metal body An elongate metal body, for instance an aluminium rod, with a chosen cross-sectional form manufactured by extrusion. It is a first object of the invention to make an elongate metal body stiffer and stronger without this entailing an increase in weight. In... | 06/25/2002 |
| 6391220 | Methods for fabricating flexible circuit structures Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive l... | 05/21/2002 |
