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| Number | Title | Issue Date |
| 8101037 | Phase-changing sacrificial materials for manufacture of high-performance polymeric capillary microchips A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed t... | 01/24/2012 |
| 8092628 | Cyclic olefin compositions for temporary wafer bonding New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to as... | 01/10/2012 |
| 8080121 | Method of bonding, thinning, and releasing wafer An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surf... | 12/20/2011 |
| 8025752 | Method of fabricating conductive composites A method of fabricating a conductive composite wherein at least one predetermined electrical access area of a conductive material is coated with a maskant. The conductive material is included in a composite ply lay-up which is cured and then the maskant is removed f... | 09/27/2011 |
| 7931769 | Method of forming temporary carrier structure and associated release techniques A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the rece... | 04/26/2011 |
| 7803241 | Composite pressure tank and process for its manufacture A pressure vessel and method for producing a pressure vessel is disclosed. The pressure vessel comprises a liner shell fabricated from composite material applied to a soluble mandrel having a body shaped to pattern an interior of the pressure vessel, the liner shell... | 09/28/2010 |
| 7691218 | Method of attaching a label to a thermoplastic substrate A label with top, bottom and edge surfaces is attached to a thermoplastic substrate by a method comprising the steps of: A. Placing the bottom surface of the label in contact with a surface of the substrate; B. Mel... | 04/06/2010 |
| 7686907 | Phase-changing sacrificial materials for manufacture of high-performance polymeric capillary microchips A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed t... | 03/30/2010 |
| 7632371 | Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film A flocked transfer is produced by applying a release agent to a release sheet, and then applying the flocking to a release agent. Unlike the traditional method, a binder and thermoplastic hot melt film is applied to the back of the flock. The transfer, which is esse... | 12/15/2009 |
| 7479198 | Methods for forming nanofiber adhesive structures A method for forming a nanofiber adhesive structure includes, in one embodiment, providing a plurality of generally parallel fiber bundles secured in a first binder and in which each of the fiber bundles includes a plurality of generally parallel fibers secured in a... | 01/20/2009 |
| 7476287 | Soluble rivet tape A soluble rivet tape is provided. The tape includes a soluble film and an adhesive coating that is applied to one or more sections of the soluble film. A plurality of rivets are inserted into place on a product, such as an airplane. The soluble rivet tape is applied... | 01/13/2009 |
| 7402222 | Flocked transfer and article of manufacture including the flocked transfer A flocked transfer is produced by applying a release agent to a release sheet and then applying the flocking to the release agent. Unlike the traditional method, a binder and hot melt film is not applied to the back of the flock. The transfer (which is essentially a... | 07/22/2008 |
| 7381284 | Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film A flocked transfer is produced by applying a release agent to a release sheet, and then applying the flocking to a release agent. Unlike the traditional method, a binder and thermoplastic hot melt film is applied to the back of the flock. The transfer, which is esse... | 06/03/2008 |
| 7373214 | 3-d product printing system A system that prints three dimensional products, the system including at least one object incorporation device that incorporates non-printed objects into partially completed product, the non-printed objects not being printed by the system. ... | 05/13/2008 |
| 7361245 | Compressible printing blanket and method of manufacturing a compressible printing blanket Disclosed is a compressible printing blanket in which voids are formed in the compressible layer by using microballoons, comprising at least two fabric layers, an adhesive layer interposed between adjacent fabric layers, a surface rubber layer, and a compressible la... | 04/22/2008 |
| 7361408 | Molded resin object, electronic instrument using the same, and method of processing a molded resin object A molded resin object including a molded substrate containing a biodegradable resin and an applied coating formed on a surface of the molded substrate is disclosed, wherein the applied coating contains a proliferation accelerating agent for accelerating proliferatio... | 04/22/2008 |
| 7357078 | Method for making a multilayer printing blanket and resulting blanket A method for making a multilayer printing blanket whereof at least an outer layer is provided with embedded particles has the embedded in the surface of the outer layer by exerting pressure on said particles. Such a printing blanket is useful in the field of printin... | 04/15/2008 |
| 7355216 | Fluidic nanotubes and devices Fluidic nanotube devices are described in which a hydrophilic, non-carbon nanotube, has its ends fluidly coupled to reservoirs. Source and drain contacts are connected to opposing ends of the nanotube, or within each reservoir near the opening of the nanotube. The p... | 04/08/2008 |
| 7348786 | Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate... | 03/25/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7342473 | Method and apparatus for reducing cantilever stress in magnetically actuated relays Methods, systems, and apparatuses are disclosed for magnetically-actuated relays/switches that suppress cantilever and/or hinge deformation. A permanent magnet produces a first magnetic field. A movable element is held between a pair of axially-aligned, rotationally... | 03/11/2008 |
| 7318912 | Microfluidic systems and methods for combining discrete fluid volumes Microfluidic devices capable of combining discrete fluid volumes generally include channels for supplying different fluids toward a sample chamber and means for establishing fluid communication between the fluids within the chamber. Discrete fluid plugs are defined ... | 01/15/2008 |
| 7297040 | Method for manufacturing a flexible panel for a flat panel display A method for manufacturing a flexible panel is disclosed, which has the following steps. First, a first substrate having a plurality of functional switches or conducting lines thereon is provided. Then, a second substrate is bonded on the functional switches or cond... | 11/20/2007 |
| 7282106 | Fibers and ribbons for use in the manufacture of solar cells This invention is directed to a process for the fabrication of features on a silicon wafer utilizing ribbons comprising organic polymer and inorganic material. ... | 10/16/2007 |
| 7276788 | Hydrophobic foamed insulators for high density circuits A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive s... | 10/02/2007 |
| 7270888 | Composite body made of ceramic layers and method for its manufacture A composite body made of at least two ceramic layers, in which the ceramic layers are permanently bonded to one another at defined bonding points by a contact layer made of a bonding material. To achieve a permanent, thermally stable bond of ceramic layers having di... | 09/18/2007 |
| 7263261 | Process for producing a leached fiber bundle, and improved leached fiber bundle A leached fiber bundle with the light outlet points positioned as accurately as possible is provided, in which the end faces are not completely fused together, but rather are only fused together at their contact surfaces. The interstices formed are permanently fille... | 08/28/2007 |
| 7259351 | Heat treating assembly and method The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy w... | 08/21/2007 |
| 7257874 | Process for manufacturing ring-type metal joints for high pressure ducts Improved process for manufacturing ring-type metal joints for high pressure ducts, characterized because it presents the following steps: a) oval bar manufacturing and b) ring-type metal joints manufacturing, wherein the oval bar manufacturing comprises the followin... | 08/21/2007 |
| 7252795 | High thermal conductivite element, method for manufacturing same, and heat radiating system It is an object of the present invention to provide a high thermal conductive element that has improved thermal conductivity in the layer direction while retaining the high thermal conductivity characteristics in the planar direction possessed by graphite. The prese... | 08/07/2007 |
| 7247212 | Orthogonal weaving for complex shape preforms An orthogonal stitch-weave method and fiber architecture. The architecture allows near-net-shape composite preforms to be fabricated, thereby reducing costs associated with complex preform shapes and increasing desired strengths of the composite. ... | 07/24/2007 |
| 7244034 | Low CTE metal-ceramic composite articles, and methods for making same A mirror having low density, low CTE, high thermal conductivity, high elastic modulus, and a reflective, polishable surface. The instant mirror features a silicon-based metal coating as the reflective surface, and a composite body as a support or substrate for the r... | 07/17/2007 |
| 7238247 | Method of making a multi-perforated part out of ceramic matrix composite material A fiber preform for constituting the fiber reinforcement of composite material is prepared and then consolidated by depositing sufficient matrix phase therein to bond the fibers together while not completely densifying the preform. Pins of rigid material are put int... | 07/03/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7226649 | Laser weldable flexible medical tubings, films and assemblies thereof The present invention provides a tubing assembly having a sidewall having a first layer. The first layer is fabricated from a first polymer blend comprising a first component of a material not thermally responsive to laser beam and selected from the group consisting... | 06/05/2007 |
| 7225045 | System and method for three dimensional model printing A method and a system for three-dimensional printing of a three dimensional model is provided. The method includes dispensing a first interface material from a printing head, dispensing at least a second interface material from the printing headland combining the fi... | 05/29/2007 |
| 7224064 | Semiconductor device having conductive interconnections and porous and nonporous insulating portions A semiconductor device and manufacturing method, wherein the semiconductor device has a semiconductor substrate on which a plurality of elements constituting a logic type device have been formed; a first interlayer insulating film on the semiconductor substrate; a p... | 05/29/2007 |
| 7216420 | Method of manufacturing print head A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the proje... | 05/15/2007 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting re... | 05/15/2007 |
| 7214639 | Immobilized metal complex catalysts, process for preparation thereof and use thereof The present invention provides a novel immobilized metal complex catalyst of the formula I wherein M is a Group VIII metal, n is an integer with a value between 2 and 6, MLx is an organometallic comple... | 05/08/2007 |
