Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 8083878 | Fire resistant veneer assembly for aircraft interiors A fire resistant wood veneer assembly includes at least a decorative veneer layer and at least one aluminum foil layer. The aluminum foil layer is bonded to the decorative wood veneer with phenolic adhesive at high pressure and high temperature to produce a fire res... | 12/27/2011 |
| 8002923 | Method of manufacturing glass substrate A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annula... | 08/23/2011 |
| 7645354 | Audio device having dense sound enhancing component A musical instrument having strings, a wooden body and a granite veneer bonded to the wooden body. The granite has a density of at least 1.7 thousand kilograms per cubic meter and optionally can have a thickness in the range from about 7/64th of an inch t... | 01/12/2010 |
| 7431788 | Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive ... | 10/07/2008 |
| 7395596 | Process of manufacturing a soft magnetic metal electromechanical component A three dimensional soft magnetic metal mass suitable for milling is formed wrapping soft magnetic metal ribbon into a three dimensional shape and then applying adhesive to the three dimensional shape. The adhesive permeates the three dimensional shape. The adhesive... | 07/08/2008 |
| 7384490 | Method for manufacturing open cell rubber material and method for manufacturing rubber roller The object is to provide a manufacturing method of various elastic rollers whose rubber hardness is remarkably reduced. A hollow cylindrical rubber tube (1) is prepared. Thereafter, a metal shaft (2) is inserted in the rubber tube and the rubber... | 06/10/2008 |
| 7374498 | All-weather golf club grip A slip-resistant shock absorbing golf club grip that includes a felt layer, a fabric mesh formed of fibers and a polyurethane coating covering the mesh and felt, the fibers of the mesh defining grooves in the surface of the slip-resistant polyurethane which are enga... | 05/20/2008 |
| 7370807 | Identity card and travel document An identity card that can be used, for example, in a travel document or as a separate card, includes at least two core layers, preferably of polycarbonate material, that are fused to one another. In each of the core layers there is a recess, each of a different size... | 05/13/2008 |
| 7373053 | Optical fiber array and manufacturing method thereof The present invention provides a high-density and high-precision optical fiber array which can stably be manufactured with excellent operability and which can maintain excellent characteristics while suppressing insertion loss with respect to optical parts by optimi... | 05/13/2008 |
| 7373051 | Optical device A first optical device has an optical fiber mount with an optical fiber disposed thereon, and an optical demultiplexer for demultiplexing a portion of an optical signal beam transmitted through the optical fiber, as a demultiplexed optical signal beam, and guiding t... | 05/13/2008 |
| 7367900 | Golf club head A hollow golf club head containing a face component made of a metal material and including a face plate forming a face portion of the head and a turnback extending backward from the face plate; a FRP component made of a fiber reinforced resin; and an elastomeric ins... | 05/06/2008 |
| 7368332 | SOI substrate manufacturing method This invention makes it possible to simplify a process of manufacturing an SOI substrate whose insulator is not exposed to the side surface. The SOI substrate manufacturing method includes a first step of forming a structure (230) in which an insulating layer... | 05/06/2008 |
| 7357503 | Ophthalmic lens with an optically transparent composite film exhibiting both impact resistance property and polarizing property, and a process for its manufacture The present invention relates to a light polarizing ophthalmic lens comprising a substrate made of organic glass and an optically transparent composite film deposited on the front main face of the substrate, said transparent composite film comprising a latex layer h... | 04/15/2008 |
| 7353979 | Method of fabricating substrate placing stage A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite... | 04/08/2008 |
| 7347912 | Process for the manufacture of a veneer A process for the manufacture of veneer comprises gluing board-like, plane pieces of wood together with an adhesive to form a beam-like block of wood. The humidity content of the beam-like block of wood is increased. Veneer is cut from the beam-like block of wood an... | 03/25/2008 |
| 7341330 | Substrates adapted for adhesive bonding A first substrate suitable for bonding to a second substrate using an adhesive is provided. The first substrate has a plurality of etched trenches defined in a first bonding surface. The etched trenches are configured for receiving the adhesive during bonding, there... | 03/11/2008 |
| 7341383 | Dual inner diameter ferrule device and method A fiber optic ferrule includes a body extending from a first end to a second opposite end, with the body including an axial passage extending between the first and second ends. The axial passage includes a first diameter portion having a diameter of at least 125 mic... | 03/11/2008 |
| 7331528 | Smartcard and method for production of a smartcard The invention relates to a smart card and also to a method of producing such a smart card having a card body (11), at least one recess (12a, 12b) arranged therein for receiving at least one chip module (16) having module con... | 02/19/2008 |
| 7311790 | Hybrid structure using ceramic tiles and method of manufacture A hybrid structure (50) and method of manufacturing the same including a structural ceramic matrix composite (CMC) material (42) coated with a layer of ceramic insulating tiles (24). Individual ceramic tiles are attached to a surface (22)... | 12/25/2007 |
| 7301226 | Conductor substrate, semiconductor device and production method thereof A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and t... | 11/27/2007 |
| 7297040 | Method for manufacturing a flexible panel for a flat panel display A method for manufacturing a flexible panel is disclosed, which has the following steps. First, a first substrate having a plurality of functional switches or conducting lines thereon is provided. Then, a second substrate is bonded on the functional switches or cond... | 11/20/2007 |
| 7291520 | Piezoelectric element and liquid jet head using the piezoelectric element Provided are a piezoelectric element and a liquid-jet head using the same, in which favorable crystallinity can be obtained with improved uniformity, breakage of a piezoelectric film can be prevented, thereby providing stable displacement properties. The piezoeletri... | 11/06/2007 |
| 7285825 | Element formation substrate for forming semiconductor device A support-side substrate having a thermal oxide film on the major surface is bonded to an active-layer-side substrate having a thermal oxide film on the major surface while making the major surfaces oppose each other. The active-layer-side substrate and part of the ... | 10/23/2007 |
| 7285177 | Thin-walled reinforced sleeve with integral compressible layer A sleeve for a print cylinder comprising a fiber reinforced, thin-walled material and having a seamless surface ready to be covered with a surface material. The sleeve may be used in flexographic printing, either as a support for photo-polymerized printing plates or... | 10/23/2007 |
| 7281809 | Open lattice mirror structure and method of making same A method of making a mirror structure includes assembling a supporting isogrid framework, assembling an isogrid back plane, interconnecting the supporting isogrid framework with the isogrid back plane by a truss core, and disposing an optical surface on the supporti... | 10/16/2007 |
| 7282105 | Support planar and tapered quasi-planar germanium waveguides for infrared evanescent-wave sensing Miniature planar IR waveguides of thickness 30–50 μm, consisting of 12-mm long, 2-mm wide strips of Ge supported on ZnS substrates and tapered quasi-tapered waveguides, tapered from a thickness of 1 mm at the ends to a minimum of 1–100 μm at the center, are di... | 10/16/2007 |
| 7279796 | Microelectronic die having a thermoelectric module A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias i... | 10/09/2007 |
| 7273529 | Method of making a window covering from fabric segments In a method for making a window covering the user selects a first segment of cellular material in which there is a top cell having a top surface, at least one glue line on the top surface and a strip of fabric on the at least one glue line. The strip of fabric and a... | 09/25/2007 |
| 7273788 | Ultra-thin semiconductors bonded on glass substrates A method for forming a semiconductor on insulator structure includes providing a glass substrate, providing a semiconductor wafer, and performing a bonding cut process on the semiconductor wafer and the glass substrate to provide a thin semiconductor layer bonded to... | 09/25/2007 |
| 7264403 | Optical ferrule having a covering and associated method of ablating an optical fiber An optical ferrule is provided with a ferrule body having a front face and at least one covering applied to the front face to protect the front face of the ferrule from a laser beam used during a trimming process. The optical ferrule may also have a second covering ... | 09/04/2007 |
| 7265674 | Thin flexible, RFID labels, and method and apparatus for use A radio frequency identification (REID) device may include a first, thin, flexible sheet, an antenna, and an integrated circuit. A surface portion of the first sheet may be affixed to a second, thin, flexible sheet to form a thin, flexible label. Such a label may be... | 09/04/2007 |
| 7261490 | Jet blast resistant vehicle arresting blocks, beds and methods Aircraft arresting beds constructed of cellular concrete at ends of runways may be subject to damaging effects of jet blast phenomena. Arresting units resistant to such effects and related methods are described. A block of compressible material, such as cellular con... | 08/28/2007 |
| 7262428 | Strained Si/SiGe/SOI islands and processes of making same A process of making a strained silicon-on-insulator structure is disclosed. A recess is formed in a substrate to laterally isolate an active area. An undercutting etch forms a bubble recess under the active area to partially vertically isolate the active area. A the... | 08/28/2007 |
| 7245002 | Semiconductor substrate having a stepped profile A semiconductor substrate which effectively prevents a chipping phenomenon, wherein the outer peripheral extremity of the insulation layer is located between the outer peripheral extremity of the semiconductor layer and the outer peripheral extremity of the support ... | 07/17/2007 |
| 7235148 | Selectively roughening conductors for high frequency printed wiring boards A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfac... | 06/26/2007 |
| 7235461 | Method for bonding semiconductor structures together A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydro... | 06/26/2007 |
| 7220656 | Strained semiconductor by wafer bonding with misorientation One aspect of the present invention relates to a method for forming a strained semiconductor structure. In various embodiments, at least two strong bonding regions are defined for a desired bond between a crystalline semiconductor membrane and a crystalline semicond... | 05/22/2007 |
| 7216512 | Method of making an optical fiber by laser cleaving A field-installable connector includes a connector housing and a ferrule having front and rear opposed faces and at least one fiber bore defined longitudinally therethrough. A laser processed stub optical fiber is disposed within the one fiber bore of the ferrule an... | 05/15/2007 |
| 7208216 | Disposable cutting sheet A disposable cutting sheet for cutting and preparation of food items thereon includes a first cut resistant layer having an absorbent ply and a thermoplastic ply, wherein the thermoplastic ply includes a plurality of apertures therethrough. The sheet further include... | 04/24/2007 |
| 7208062 | Method of producing multilayer printed wiring board Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting res... | 04/24/2007 |
