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| Number | Title | Issue Date |
| 7358189 | Copper clad laminate To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thi... | 04/15/2008 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7291241 | Bonded part and method for producing same A bonded part such as a rubber to metal bonded part and process for producing a bonded part including a rubber and metal part, and particularly for producing an automotive torsional vibration damper, comprising the steps of placing uncured elastomer composition comp... | 11/06/2007 |
| 7287468 | Nickel alloy plated structure A structure and associated methods of formation. The structure includes a layered configuration comprising a copper layer, a first layer, and a second layer. The copper layer consists essentially of copper. The first and second layers are disposed on opposite sides ... | 10/30/2007 |
| 7273537 | Method of production of metal particles through electrolysis A method of producing metal particles through electrolysis. A cathode having a plurality of active zones on a surface thereof is at least partially immersed in a reaction solution. The cathode is spaced from an anode also at least partially immersed in the reaction ... | 09/25/2007 |
| 7253517 | Method and apparatus for combining multiple integrated circuits An apparatus includes a circuit having first, second and third circuit portions, the first and third circuit portions each including at least one semiconductor circuit component. The second circuit portion includes at least one non-semiconductor circuit component, a... | 08/07/2007 |
| 7242012 | Lithography device for semiconductor circuit pattern generator General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 07/10/2007 |
| 7235148 | Selectively roughening conductors for high frequency printed wiring boards A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfac... | 06/26/2007 |
| 7225596 | Self supportive panel system A self supporting panel system used to fabricate ceilings, floors, walls, or roofs. The panel system is assembled from a plurality of panels, each having a core that is sandwiched between opposing plate members. In a preferred embodiment, the core of each panel incl... | 06/05/2007 |
| 7223696 | Methods for maskless lithography General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 05/29/2007 |
| 7193239 | Three dimensional structure integrated circuit A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 03/20/2007 |
| 7191515 | Method for manufacturing an interconnected circuit board assembly An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit... | 03/20/2007 |
| 7192654 | Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first el... | 03/20/2007 |
| 7189437 | Mobile plating system and method An exemplary method for using a mobile plating system is provided that includes locating the mobile plating system at a desired location for plating, positioning an external vacuum pump from an interior position of a mobile storage volume of the mobile plasma platin... | 03/13/2007 |
| 7176545 | Apparatus and methods for maskless pattern generation General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 02/13/2007 |
| 7172681 | Process for producing rubber-based composite material Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion ... | 02/06/2007 |
| 7156938 | Method for making multi-layer ceramic acoustic transducer Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to... | 01/02/2007 |
| 7153590 | Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( | 12/26/2006 |
| 7145243 | Photo-thermal induced diffusion Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, s... | 12/05/2006 |
| 7138295 | Method of information processing using three dimensional integrated circuits A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 11/21/2006 |
| 7112889 | Semiconductor device having an alignment mark formed by the same material with a metal post A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts ... | 09/26/2006 |
| 7096578 | Manufacturing method for wiring circuit substrate A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas and to form protrusions in other areas which extend above the etched a... | 08/29/2006 |
| 7082026 | On chip capacitor A high capacity silicon capacitor formed on an integrated circuit substrate includes a metal portion on the substrate; a silicon nitride (SiN) portion sputtered on the metal; a silicon (Si) portion sputtered on the silicon nitride portion, another SiN layer and fina... | 07/25/2006 |
| 7077389 | Method of forming a molded powertrain mount assembly The invention provides a method of forming a molded powertrain mount assembly. A metal insert is provided, the metal insert including an engine interface portion and a molded base interface portion. At least one seal member is positioned onto the engine interface po... | 07/18/2006 |
| 7078104 | Bonded part and method for producing same A bonded part such as a rubber to metal bonded part and process for producing a bonded part including a rubber and metal part, and particularly for producing an automotive torsional vibration damper, comprising the steps of placing uncured elastomer composition comp... | 07/18/2006 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
| 7051848 | Temperature specific mechanism retaining brake pads in a caliper assembly during shipping A brake system includes a caliper and a brake element. The brake system further includes an adhesive that adheres the brake element to the caliper. The adhesive stops adhering the brake element to the caliper after the adhesive heats to an elevated temperature. The ... | 05/30/2006 |
| 7052936 | Use of polybenzoxazoles (PBOS) for adhesion The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafe... | 05/30/2006 |
| 7049007 | Composite foil and its manufacturing process A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group includin... | 05/23/2006 |
| 7015563 | On chip capacitor A high capacity silicon capacitor formed on an integrated circuit substrate includes a metal portion on the substrate; a silicon nitride (SiN) portion sputtered on the metal; a silicon (Si) portion sputtered on the silicon nitride portion, another SiN layer and fina... | 03/21/2006 |
| 7002728 | Electrophoretic particles, and processes for the production thereof Copper chromite particles can advantageously be used as black particles in electrophoretic media and displays. Preferably, the copper chromite particles are coated with a silica coating and a polymer coating. ... | 02/21/2006 |
| 6974200 | Fuse density on an inkjet printhead chip A programmable memory on an inkjet printhead chip. The memory includes at least a memory array that has a plurality of memory elements, and a bipolar device that isolates a memory element from another memory element in the memory array. ... | 12/13/2005 |
| 6930068 | Methanol reforming catalyst A methanol reforming catalyst that generates a reformed gas containing hydrogen by reforming methanol in the atmosphere containing oxygen and steam contains a metal oxide support and Pd—Zr alloy with which the metal oxide support is impregnated. The reforming cata... | 08/16/2005 |
| 6924043 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the n... | 08/02/2005 |
| 6905582 | Configurable vacuum system and method An exemplary configurable vacuum system is provided for use in coating or plating that provides the capability and versatility to handle substrates of significantly different shapes and sizes. The configurable vacuum system includes a vacuum table assembly, a mechan... | 06/14/2005 |
| 6849168 | Electrochemical microsensor package An electrochemical microsensor package comprises a substrate matrix having a upper non-conductive layer and an adjacent lower non-conductive layer with a conductive trace or pad extending over an area therebetween. The conductive pad has integral therewith a project... | 02/01/2005 |
| 6733886 | Laminate and method of manufacturing the same A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in ... | 05/11/2004 |
| 6682619 | Composite pre-preg ply having tailored dielectrical properties and method of fabrication thereof A structural dielectrically tailored prepreg panel includes structural materials having desired electrical qualities in one or more desired areas without loss of structural integrity or the addition of parasitic weight. In one method of manufacture an app... | 01/27/2004 |
| 6632319 | Process for producing rubber-based composite material A process for producing a rubber-based composite material including steps of laminating a rubber compound onto a substrate, with a bonding layer of metal or metal compound interposed therebetween, and subsequently vulcanizing the rubber compound, characte... | 10/14/2003 |
| 6531013 | Adhesive bonding process for aluminum alloy bodies including hypophosphorous acid anodizing An adhesive bonding process for making vehicle structures wherein a surface portion of an aluminum alloy body is anodized in an aqueous solution of hypophosphorous acid (H3 PO2) to form an anodic oxide coating. A layer of adhesive is... | 03/11/2003 |
