Famous Patents
Pong, the Atari creation that launched the computer game craze, came with these instructions: "Avoid missing ball for high score."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7846285 | Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode arr... | 12/07/2010 |
| 7363701 | Method of making a heat pipe An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the so... | 04/29/2008 |
| 7351660 | Process for producing high performance interconnects A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. Th... | 04/01/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7328831 | Method of making a brazed metal article and the article formed thereby A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal via a braze composition. In one preferred method, a polymeric foam is c... | 02/12/2008 |
| 7323245 | Electric connecting part It comprises an electric conduction pattern member (11) which is flexible and plate-shaped, a gel member (13) having the electric conduction pattern member embedded therein, and flexible substrate sheets (15a, 15b) holding the gel ... | 01/29/2008 |
| 7312142 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrat... | 12/25/2007 |
| 7293353 | Method of fabricating rigid flexible printed circuit board Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent prob... | 11/13/2007 |
| 7286293 | Method of fabricating diffractive optical element A diffractive optical element is fabricated to have a first element and a second element of different materials bonded to each other with a diffraction grating formed between the elements. In forming the first element, a material thereof is stamped with a die having... | 10/23/2007 |
| 7285727 | Flexible wiring boards for double-side connection A flexible wiring board for double side connection is capable of improving the reliability of connection to circuit boards and a manufacturing process thereof. The flexible wiring board for double-side connection includes a polyimide film having a through-hole at a ... | 10/23/2007 |
| 7281325 | Method of manufacturing circuit board A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a ... | 10/16/2007 |
| 7282257 | Resin composition and adhesive film for multi-layered printing wiring board The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being... | 10/16/2007 |
| 7271349 | Via shielding for power/ground layers on printed circuit board A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In on... | 09/18/2007 |
| 7260806 | Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiri... | 08/21/2007 |
| 7253091 | Process for assembling three-dimensional systems on a chip and structure thus obtained A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate con... | 08/07/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7253029 | Non-magnetic, hermetically-sealed micro device package A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions;... | 08/07/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7223635 | Oriented self-location of microstructures with alignment structures An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the microstructures to be oriented in receptacles having shapes that are com... | 05/29/2007 |
| 7200927 | Method for producing a wiring transfer sheet A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 04/10/2007 |
| 7202007 | Method of forming patterned films This method forms a patterned film. The method prepares a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed, performs stripping treatment on surfaces of at least ridges formed on the transfer surf... | 04/10/2007 |
| 7195145 | Electrical circuit apparatus and method for assembling same A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the g... | 03/27/2007 |
| 7192509 | Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substr... | 03/20/2007 |
| 7189302 | Multi-layer printed circuit board and fabricating method thereof A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of th... | 03/13/2007 |
| 7176484 | Use of an energy source to convert precursors into patterned semiconductors The present invention provides a substrate having thereon a patterned small molecule organic semiconductor layer. The present invention also provides a method and a system for the production of the substrate having thereon a patterned small molecule organic semicond... | 02/13/2007 |
| 7172927 | Warpage control of array packaging During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-in... | 02/06/2007 |
| 7170368 | Phase matching using a high thermal expansion waveguide An apparatuses and methods for phase matching power combined signals are described. A typical apparatus includes at least a waveguide portion in at least a first branch conducting a first electromagnetic signal of a combiner, the waveguide portion having an effectiv... | 01/30/2007 |
| 7168152 | Method for making an integrated active antenna element An array of electrically conductive waveguides is made by a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots register... | 01/30/2007 |
| 7170152 | Wafer level semiconductor package with build-up layer and method for fabricating the same A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the ... | 01/30/2007 |
| 7159311 | Method of making an interposer with contact structures A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package.... | 01/09/2007 |
| 7156640 | Insert dies, molds, and methods for fabricating the same A method for manufacturing an insert die with a pattern region to be transferred onto a molding part is provided. The method includes (a) adhering a first base member having the pattern region and a second base member with an adhesive material, and (b) sealing an ex... | 01/02/2007 |
| 7156938 | Method for making multi-layer ceramic acoustic transducer Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to... | 01/02/2007 |
| 7154045 | Wired circuit board A wired circuit board having a semi-conducting layer which has excellent chemical resistance, such as acid resistance and alkali resistance, provides no possibility of minute particles being mixed into parts mounted on the wired circuit board; and yet has excellent ... | 12/26/2006 |
| 7141310 | Metal matrix composite structure and method Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound preform is infiltrated with a liquid metal which is then solidified ... | 11/28/2006 |
| 7138294 | Circuit substrate device, method for producing the same, semiconductor device and method for producing the same A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit... | 11/21/2006 |
| 7127796 | Method of manufacturing a waveguide A method of manufacturing a waveguide includes forming two waveguide units, each waveguide unit having a channel defined by a bottom wall and two side walls generally transverse to the bottom wall, flanges extending from the side walls, outside the groove, transvers... | 10/31/2006 |
| 7105208 | Methods and processes utilizing microwave excitation The invention includes methods and processes in which microwave radiation is utilized to activate at least one component within a reaction chamber during deposition of a material over a substrate within the reaction chamber. ... | 09/12/2006 |
| 7105997 | Field emitter devices with emitters having implanted layer Structures and methods to ease electron emission and limit outgassing so as to inhibit degradation to the electron beam of a field emitter device are described. In one method to ease such electron emission, a layer of low relative dielectric constant material is for... | 09/12/2006 |
| 7100885 | Seat mounting rail, particularly for a commercial aircraft A seat mounting rail for securing seats to a floor of a passenger aircraft is made of a seat securing upper section and a rail mounting lower section. Both sections are made of different metals. The upper section is made of a titanium alloy for corrosion protection.... | 09/05/2006 |
| 7093356 | Method for producing wiring substrate A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, elec... | 08/22/2006 |
