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| Number | Title | Issue Date |
| 7776166 | Texture and grain size controlled hollow cathode magnetron targets and method of manufacture The present invention relates to methods for improving deposited film uniformity and controlling the erosion of sputter targets. Improved methods for achieving predetermined microstructure orientation in copper hollow cathode magnetron (HCM) sputter targets and targ... | 08/17/2010 |
| 7285174 | Method for producing metallic strips A method for producing metallic strips having a high-grade cube texture based on nickel, copper, aluminum, silver or alloys of these metals including austenitic iron-nickel alloys makes it possible to obtain, during a subsequent annealing process and with lower tota... | 10/23/2007 |
| 7235143 | Controlled-grain-precious metal sputter targets A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has... | 06/26/2007 |
| 7204893 | Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is ca... | 04/17/2007 |
| 7172665 | Cu-based alloy and method of manufacturing high strength and high thermal conductive forged article using the same A melt of a Cu-based alloy containing 2 to 6% (% by weight, the same shall apply hereinafter) of Ag and 0.5 to 0.9% of Cr are solidified by casting, and the solidified article after subjecting to a homogenizing heat treatment is subjected to hot-working. The hot-wor... | 02/06/2007 |
| 7045444 | Method of manufacturing semiconductor device that includes selectively adding a noble gas element Phosphorus is implanted into a crystalline semiconductor film by an ion dope method. However, a concentration of phosphorus required for gettering is 1×1020/cm3 or higher which hinders recrystallization by later anneal, and thus this becomes a... | 05/16/2006 |
| 6689232 | Copper alloy The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weigh... | 02/10/2004 |
| 6689235 | Method of manufacturing rolled copper foil for flexible printed circuit A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling be... | 02/10/2004 |
| 6679956 | Process for making copper-tin-zinc alloys A process for making a copper base alloy comprises the steps of casting a copper base alloy containing tin, zinc, iron and phosphorous and forming phosphide particles uniformly distributed throughout the matrix. The forming step comprises homogenizing the... | 01/20/2004 |
| 6627055 | Manufacture of fine-grained electroplating anodes A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than... | 09/30/2003 |
| 6478902 | Fabrication and bonding of copper sputter targets The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500° C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 ... | 11/12/2002 |
| 6458222 | Metal material, brass and method for manufacturing the same A brass for forging which has an apparent Zn content of 37 to 50 wt % and contains 0.5 to 7 wt % Sn. The brass has a microstructure of at least an phase and a γ phase at a temperature of 300 to 550° C. and has crystal grain sizes which are made ... | 10/01/2002 |
| 6436206 | Copper alloy and process for obtaining same The present invention relates to copper base alloys containing tin, phosphorous, iron, and zinc and having phosphide particles uniformly distributed through the alloy matrix, which phosphide particles include fine and coarse phosphide particles. The alloy... | 08/20/2002 |
| 6395110 | Copper-based alloy excelling in corrosion resistance, method for production thereof, and products made of the copper-based alloy The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the bal... | 05/28/2002 |
| 6258187 | Copper trolley wire and a method of manufacturing copper trolley wire Copper trolley wire consisting essentially of at least 99.90% copper and at most 0.10% of a metal selected from the group consisting of silver, cadmium, tellurium, titanium, magnesium, manganese, chromium, zirconium, tin and combinations thereof, has a mi... | 07/10/2001 |
| 5916386 | Copper alloy and process for obtaining same A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, i... | 06/29/1999 |
| 5322575 | Process for production of copper base alloys and terminals using the same A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and anneali... | 06/21/1994 |
| 5149499 | Cooper-Fe-P-Nb alloys for electrical and electronic parts and its manufacturing process A cooper base alloy and process having high electrical conductivity. An alloy consists of from 0.005 to 0.15% by weight Niobium, about 0.005 to 0.15% by weight Iron, 0.01 to 0.05% by weight phosphorus, and the balance copper.... | 09/22/1992 |
| 5039355 | Process for obtaining parts made of copper of very fine texture from a billet made by continuous casting The process according to the invention makes it possible to form parts from copper of high purity and fine structure. Beginning with a billet (1) made by continuous casting, it includes the following main phases: a kneading of the billet (1, 4) comprising upse... | 08/13/1991 |
| 4437911 | Beta alloys with improved properties An aluminum bearing beta copper alloy that on heating to a first temperature shows a transition from an (alpha+beta)-region, an (alpha+beta+gamma)-region or a (beta+gamma)-region to a beta-region. Its average grain size is less than 200 μm and it contains alu... | 03/20/1984 |
| 4430298 | Copper alloys for electric and electronic devices and method for producing same A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.... | 02/07/1984 |
| 4369074 | Method of producing bellows from metal alloys A method of producing bellows from metal alloys comprises reeling a tubular workpiece to reduce the wall thickness thereof under volume deformation, heating the reeled tubular workpiece at a rate of 100 to 800° C. per sec by passing electric current ther... | 01/18/1983 |
| 4362579 | High-strength-conductivity copper alloy A copper alloy with high strength and excellent electrical conductivity, corrosion resistance, and spring qualities, comprises 0.4-8% nickel, 0.1-3% silicon, 10-35% zinc, concomitant impurities, and the remainder copper, all by weight. It further comprise... | 12/07/1982 |
| 4354880 | Method of forge-conditioning non-ferrous metals prior to rolling A method of continuously casting a molten metal in a casting means to obtain a solidified cast bar at a hot-forming temperature, passing the cast metal at a hot-forming temperature from the casting means to a hot-forming means, and hot forming the cast ba... | 10/19/1982 |
| 4264360 | Chromium modified silicon-tin containing copper base alloys A copper base alloy and process of treating same. The alloy consists essentially of: about 1.0 to 4.5% silicon; about 1.0 to 5.0% tin; about 0.01 to 0.45% chromium; and the balance essentially copper. Preferably, the chromium level is less than about 0.12... | 04/28/1981 |
| 4259124 | Modified brass alloys with improved stress relaxation resistance An alloy system which exhibits improved resistance to stress relaxation at elevated temperatures utilizes additions of silicon or tin or mixtures of silicon and tin to a copper-zinc base to attain the stress relaxation performance. The composition and pro... | 03/31/1981 |
| 4202708 | Corrosion resistant copper base alloys for heat exchanger tube An alloy system is disclosed which is particularly useful for heat exchanger and water tubing applications. This alloy system utilizes additions of zinc, nickel and iron to a copper base. Cobalt and manganese may also be added to the alloy and such elemen... | 05/13/1980 |
| 4148633 | Minimization of edge cracking during hot rolling of silicon-tin bronzes Particular copper base alloys consisting essentially of silicon, tin and mischmetal are disclosed which exhibit improved resistance to edge cracking during hot working operations. Various other elements such as chromium, manganese, iron and nickel may als... | 04/10/1979 |
| 4137105 | Method of forming tooling for superplastic metal sheet There is provided a method of making a compression die set of the type including front and back die pieces for compressively forming a sheet of soft, pliable metal, such as superplastic metal, therebetween with one of the die pieces including surface impr... | 01/30/1979 |
| 3977913 | Wrought brass alloy An improved ternary brass alloy includes silicon as the additive material. The composition limits of the constituents of the brass are fixed by two factors: (1) the Ms or Martensite transformation temperature, and (2) the brass must be a totall... | 08/31/1976 |
| 3941620 | Method of processing copper base alloys Method of processing nickel-tin containing copper base alloys in order to obtain an improved combination of strength and bend properties. The alloys processed herein contain from 7 to 14% nickel and from 1.5 to 3.3% tin.... | 03/02/1976 |
| 3930894 | Method of preparing copper base alloys An improved phosphor-bronze copper alloy having good hot workability and mechanical properties, and method of processing same. A preferred alloy contains from 2 to 11% tin, from 0.01 to 0.3% phosphorus, from 0.2 to 0.8% chromium and from 0.3 to 2.0% each ... | 01/06/1976 |
