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| Number | Title | Issue Date |
| 8038810 | Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a... | 10/18/2011 |
| 7931760 | Whiskerless plated structure and plating method A plated structure is disclosed that includes a base formed of a copper-based material containing copper as a major component, a plating film formed of a tin-based material containing tin as a major component and provided over the base, and a tin-copper compound bar... | 04/26/2011 |
| 7267733 | Copper base alloy A copper base alloy, which is resistant or immune to carburization, metal dusting and coking, and resistant to oxidation, the alloy having the following composition (all contents in weight %): Al >0-15 Si 0-6 ... | 09/11/2007 |
| 7192495 | Intermediate anneal for metal deposition The present teachings and illustrations describe a process for forming a plurality of conductive structures in or on a substrate. In one embodiment, the process comprises forming a plurality of recesses in or on the substrate, wherein the plurality of recesses inclu... | 03/20/2007 |
| 7063896 | Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second in... | 06/20/2006 |
| 7041252 | Copper base alloy A copper base alloy, which is resistant or immune to carburization, metal dusting and coking, and resistant to oxidation, the alloy having the following composition (all contents in weight %): Al >0–15 Si 0–6 | 05/09/2006 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/21/2006 |
| 6935243 | Bullet A plated hollow-point bullet has a metallic plating which completely encapsulates a metallic core. A core precursor is formed having a nose compartment with an inwardly extending cavity. A metallic coating is applied to the precursor to completely encapsulate the pr... | 08/30/2005 |
| 6777106 | Metal blocks suitable for machining applications The present invention is directed to a metal block suitable for machining, the metal block comprising at least two superimposed metal plates, each having a thickness of at least 12.5 mm, wherein the yield strength of the block is at least 75% of the yield strength o... | 08/17/2004 |
| 6737175 | Metal dusting resistant copper based alloy surfaces A method for inhibiting metal dusting corrosion of surfaces exposed to supersaturated carbon environments comprising constructing said surfaces of, or coating said surfaces with a copper based alloy. The invention is also directed to a composition resistant to metal... | 05/18/2004 |
| 6692588 | Method and apparatus for simultaneously cleaning and annealing a workpiece The present invention is directed to a method and apparatus for simultaneously cleaning and annealing a plated semiconductor workpiece. A chamber for simultaneously cleaning and annealing a semiconductor workpiece is provided herein. The method according ... | 02/17/2004 |
| 6638378 | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article A passive electrical article comprising (a) a first self-supporting substrate having two opposing major surfaces, (b) a second self-supporting substrate having two opposing major surfaces, and (c) an electrically insulating or electrically conducting laye... | 10/28/2003 |
| 6613165 | Process for heat treating bullets comprising two or more metals or alloys Embodiments of the described method include (a) forming a core comprising a lead alloy, (b) applying copper or a copper alloy to at least a portion of an exterior surface of the core to form a jacketed bullet, (c) heating the jacketed bullet at a pre-sele... | 09/02/2003 |
| 6540850 | Membrane and a method for making a membrane A membrane 30 and a method 12 for making the membrane 30comprising the steps of selectively placing a first material 14 upon a substrate 16, depositing a certain material 26 upon a first material 14, and heating the materials 14, 16, 26, thereby forming a... | 04/01/2003 |
| 6479168 | Alloy based laser welding A method is disclosed for laser lap welding a pair of metal members together. At least one of the pair of metals having a protective metal layer. Each of the metal members having a melt temperature greater than the melt temperature of the protective metal... | 11/12/2002 |
| 6475635 | Sliding material made of copper alloy, method of producing same, and sliding bearing A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy ph... | 11/05/2002 |
| 6455172 | Laminated ribbon and method and apparatus for producing same A method for producing a laminated metal ribbon comprises the steps of (a) vapor-depositing a third metal layer on at least one welding surface of a first metal ribbon 4 and a second metal ribbon 5 in a vacuum chamber 1, the third metal being the same as ... | 09/24/2002 |
| 6451185 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to al... | 09/17/2002 |
| 6352600 | Process for heat treating bullets comprising two or more metals or alloys, and bullets made by the method One embodiment of the present process, which is particularly useful for forming bullets from two dissimilar metals and/or alloys that have been bonded together, comprises heat-treating such bullets to simultaneously harden the core and soften the jacket. ... | 03/05/2002 |
| 6336979 | Wear resistant copper base alloy, method of preparing the same and electrical part using the same Wear resistant copper or a wear resistant copper base alloy having formed on the outermost surface thereof an oxide layer having a thickness of 10-1000 nm and a layer of an intermetallic compound primarily comprising Cu--Sn having a thickness of 0.1-10 μ... | 01/08/2002 |
| 6306523 | Method of manufacturing porous electrode wire for electric discharge machining and structure of the electrode wire The present invention relates to a porous electrode wire for use in electrical discharge machining and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which results fr... | 10/23/2001 |
| 6299708 | Carbide dispersed, strengthened copper alloy A carbide dispersed, strengthened copper alloy includes copper as a major constituent, carbide particles, and a dispersing agent. The carbide particles consist of one or more carbides selected from chromium carbide, tungsten carbide, molybdenum carbide, a... | 10/09/2001 |
| 6274015 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy sol... | 08/14/2001 |
| 6206987 | Method for manufacturing a casting-die body and a casting-die body A casting-die body (1) made of a hardenable copper alloy is provided with an inner wear-protective layer (7) of chromium whose hardness decreases from the billet-side surface (8) in the direction of the casting-die body (1). The wear-protective layer (7) ... | 03/27/2001 |
| 6205643 | Method for manufacturing an electrically conductive metallic strip The invention relates to a method for the manufacture of an electrically conductive metallic strip for the production of plug contact elements. A starting strip of copper or a copper alloy having an initial thickness which is greater than its final thickn... | 03/27/2001 |
| 6126761 | Process of controlling grain growth in metal films A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The ... | 10/03/2000 |
| 6096145 | Method of making clad materials using lead alloys and composite strips made by such method Lead alloy strip material (4, 6, 8) is roll bonded on one or both opposite face surfaces of a core strip material (2). The core material can be commercially pure titanium, austenitic stainless steel, low carbon steel, copper, aluminum, alloys thereof or o... | 08/01/2000 |
| 6077370 | Thin-walled monolithic metal oxide structures made from metals, and methods for manufacturing such structures Monolithic metal oxide structures, and processes for making such structures, are disclosed. The structures are obtained by heating a metal-containing structure having a plurality of surfaces in close proximity to one another in an oxidative atmosphere at ... | 06/20/2000 |
| 6022426 | Multilayer laminate process A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the ste... | 02/08/2000 |
| 5895533 | Beryllium-copper bonding material For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy t... | 04/20/1999 |
| 5849424 | Hard coated copper alloys, process for production thereof and connector terminals made therefrom A coated Cu alloy having a high hardness surface which contains intermetallic compounds consisting essentially of Cu and Sn is produced by coating the surface of a Cu alloy with Sn and heat treating the coated Cu alloy to form on the surface thereof a hig... | 12/15/1998 |
| 5762726 | Wire electrode and process for producing a wire electrode, particular for a spark erosion process In order to produce a wire electrode having a core consisting of a copper/zinc alloy and to produce a specific sheath layer, the sheath layer is coated onto the core at a temperature at which no diffusion occurs. The wire electrode is subsequently heated ... | 06/09/1998 |
| 5704993 | High conductivity composite metal Electrical conductors and methods of producing them, where the conductors possess both high strength and high conductivity. Conductors are comprised of carbon steel and a material chosen from a group consisting of copper, nickel, silver, and gold. Diffusi... | 01/06/1998 |
| 5370753 | Process for cladding precious metals to precipitation hardenable materials A process for cladding precious metals to precipitation hardenable materials. In accordance with one aspect of the present invention, are the steps of (i) placing a precious metal layer of a first selected thickness atop a selected beryllium-copper alloy ... | 12/06/1994 |
| 5330592 | Process of deposition and solid state reaction for making alloyed highly conductive copper germanide The present invention relates to novel compounds that exhibit unusually low electrical resistivity at room temperature. More specifically, it has been discovered that the incorporation of at least 1 to 15 atomic percent of gallium and/or at least 1 to 15 ... | 07/19/1994 |
| 5252147 | Modification of surface properties of copper-refractory metal alloys The surface properties of copper-refractory metal (CU-RF) alloy bodies are modified by heat treatments which cause the refractory metal to form a coating on the exterior surfaces of the alloy body. The alloys have a copper matrix with particles or dendrit... | 10/12/1993 |
| 5230756 | Method of forming weld bead of pure copper on ferroalloy base material In forming a weld bead of pure copper on a ferroalloy base material by laying a powder of copper and melting the powder by a high density energy source such as laser beams, TIG arc or electron beams, the powder of copper is beforehand mixed with a powder ... | 07/27/1993 |
| 5198044 | Copper alloy and process for its preparation Process for the preparation of a substantially homogeneous alpha phase copper-nickel-tin alloy comprising copper and 4-18% by weight of nickel and 3-13% by weight of tin, comprising atomizing a molten alloy having the before-indicated composition and coll... | 03/30/1993 |
| 5196074 | Copper alloys capable of spinodal decomposition and a method of obtaining such alloys A method is disclosed for manufacturing a finished product which consists at least partially of a copper nickel and tin based alloy which has undergone spinodal decomposition. A liquid bath of the Cu Ni Sn based alloy is prepared containing also titanium ... | 03/23/1993 |
| 5176812 | Copper fin material for heat-exchanger and method of producing the same A copper fin material for heat-exchangers is characterized in that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elem... | 01/05/1993 |
