Bizarre Patents
A sealed crustless sandwich for providing a convenient sandwich without an outer crust which can be stored for long periods of time without a central filling from leaking outwardly.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7850795 | Build-up wear-resistant copper alloy and valve seat While securing the building-up ability and crack resistance, to provide a build-up wear-resistant copper alloy and valve seat. The build-up wear-resistant copper alloy and valve seat are characterized by having a composition of nickel: 5.0-24.5%, iron: 3.0-20.0%, si... | 12/14/2010 |
| 7815756 | Build-up wear-resistant copper-based alloy This is to provide a build-up wear-resistant copper-based alloy, which is advantageous for enhancing the cracking resistance and machinability, which is appropriate for cases of building up to form built-up layers especially, and which is equipped with the wear resi... | 10/19/2010 |
| 7291231 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous net... | 11/06/2007 |
| 7202417 | Security cable, a method for making the same and a method for securing an electronic device A security cable for electrically connecting an electrical device, such as, for example, a digital camera, a cam-corder, digital audio player, or like device are provided. Also provided is a method for making the security cable and a method for securing the electric... | 04/10/2007 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6210636 | Cu-Ni-Zn-Pd alloys A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, ... | 04/03/2001 |
| 5487867 | Copper-bismuth casting alloys A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, ... | 01/30/1996 |
| 5387293 | Copper base alloys and terminals using the same A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm2, a spring limit of at least 40 kgf/mm2, a stress relaxation of not more than 10% and a conduct... | 02/07/1995 |
| 5288683 | Wear-resistant copper alloys and synchronizer rings for automobiles comprising the same A wear-resistant copper alloy which consists essentially of 56 to 65 wt. % of Cu, 28 to 32 wt. % of Zn, 3.5 to 5.5 wt. % of Al, 0.5 to 2.0 wt. % of Fe, 1.0 to 3.0 wt. % of Ni, 0.1 to 1.0 wt. % of Nb, and 0.4 to 1.5 wt. % of Ti, provided that Ti+Nb is equa... | 02/22/1994 |
| 5256214 | Copper alloys and method of manufacture thereof A method for the manufacture of a copper based alloy and the alloy produced thereby having improved mechanical properties. An alloy containing a dispersoid ingredient and a precipitating ingredient are spray cast so that during spray casting the dispersoi... | 10/26/1993 |
| 5248351 | Copper Ni-Si-P alloy for an electronic device A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities. The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of ... | 09/28/1993 |
| 5188799 | Wear-resistant copper-base alloy A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %, Ni: 10.0 to 30.0%; Si: 0.5 to 3%; Co: 2.0 to 15.0%; at least one metal selected from the group consisting of Mo, W, Nb and V: 2.0 to 15.0%; and the balance being Cu and unavoid... | 02/23/1993 |
| 5164157 | Copper based alloy A copper based alloy, which when employed in a marine environment with a cathodic protection system or when galvanically coupled to a dissimilar metal, is resistant to hydrogen embrittlement, copper being present in an amount of about 70% to 80% by weight... | 11/17/1992 |
| 5104748 | Wear resisting copper base alloy A copper base alloy exhibits improved wear resistance particularly at elevated temperatures, which consists essentially of, in percent by weight, 10-40% of Ni, 1-7% of Si, 0.5-5% of B, 1-20% of Cr, and the balance of Cu, wherein particles of at least one ... | 04/14/1992 |
| 5100487 | As-cast, age-hardened Cu-Sn-Ni worm gearing and method of making same Worm gearing having improved wear and strength properties comprises a Cu, 8.0-13.0 w/o Sn, 3.5-5.0 w/o Ni alloy aged in the as-cast condition to strengthen the dendritic microstructural constituent (e.g., alpha phase) while retaining the as-cast, relative... | 03/31/1992 |
| 5085712 | Iron/copper/chromium alloy material for high-strength lead frame or pin grid array An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 1... | 02/04/1992 |
| 5041176 | Particle dispersion-strengthened copper alloy A particle dispersion-strengthened copper alloy consisting essentially of copper as the main component, 0.1-10% by weight of nickel, 0.1-10% by weight of tin, 0.05-5% by weight of silicon, 0.01-5% by weight of iron, and 0.0001-1% by weight of boron. The a... | 08/20/1991 |
| 5028391 | Copper-nickel-silicon-chromium alloy A copper-nickel-silicon-chromium alloy having the combination of high hardness and high electrical conductivity. The alloy is composed by weight of 9.5% to 11.5% nickel, in an amount sufficient to provide a nickel-silicon ratio of 3.4 to 4.5, 0.5% to 2.0%... | 07/02/1991 |
| 5028282 | Cu-Ni-Sn alloy with excellent fatigue properties A Cu-Ni-Sn alloy with excellent fatigue properties comprising 6 to 25 wt % of Ni, 4 to 9 wt % of Sn, 0.04 to 5 wt % in total of at least one element selected from the following elements: Zn . . . 0.03-4 wt %, Zr . . . 0.01-0.2 wt %, Mn . . . 0.03-1.5 wt %, Fe ... | 07/02/1991 |
| 5024815 | Copper alloy with phosphorus and iron A copper alloy comprising: (A) 0.15-1.0 wt % Fe, (B) 0.05-0.3 wt % P, and (C) (1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or (2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or (3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or (4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si, with the b... | 06/18/1991 |
| 5004581 | Dispersion strengthened copper-base alloy for overlay A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, Ni: 5 to 30%; B: 0.5 to 3%; Si: 1 to 5%; Fe: 4 to 30%; Sn: 3 to 15% and/or An: 3 to 30%; and the remainder being Cu and u... | 04/02/1991 |
| 4871437 | Cermet anode with continuously dispersed alloy phase and process for making Cermet electrode compositions and methods for making are disclosed which comprise NiO--NiFe2 O4 --Cu--Ni. Addition of an effective amount of a metallic catalyst/reactant to a composition of a nickel/iron/oxide, NiO, copper, and nicke... | 10/03/1989 |
| 4871399 | Copper alloy for use as wiring harness terminal material and process for producing the same A copper alloy obtained by preparing a blank of an alloy that consists of 1.0-3.0% Ni, 0.5-1.5% Ti (the ratio of Ni/Ti in weight percent being in the range of 1-3), 0.1-2.0% Zn, 0.01-0.5% Mg, no more than 50 ppm of oxygen, and the balance being Cu and inc... | 10/03/1989 |
| 4871438 | Cermet anode compositions with high content alloy phase Cermet electrode compositions comprising NiO-NiFe2 O4 -Cu-Ni, and methods for making, are disclosed. Addition of nickel metal prior to formation and densification of a base mixture into the cermet allows for an increase in the total ... | 10/03/1989 |
| 4869758 | Iron/copper/chromium alloy material for high-strength lead frame or pin grid array An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 1... | 09/26/1989 |
| 4838959 | Method for manufacturing high strength copper alloy wire A method for processing a copper alloy wherein the alloy comprises from 0.2-1.0% beryllium, 1.4-2.2% nickel or cobalt and remainder copper. Said method comprising one or more processing steps and characterized in that said steps conclude with cold working... | 06/13/1989 |
| 4818307 | Dispersion strengthened copper-base alloy Herein disclosed is a dispersion strengthened copper-base alloy having an excellent wear resistance, which alloy contains 5 to 30% (in weight) of nickel, 1 to 5% of silicon, 0.5 to 3% of boron and 4 to 30% of iron, the remainder being copper and unavoidab... | 04/04/1989 |
| 4728372 | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide i... | 03/01/1988 |
| 4727002 | High strength copper alloy wire A wire having a tensile strength of at least 95 psi and conductivity of at least 60 percent IACS is provided. The wire is manufactured from a precipitation hardenable alloy, the alloy consisting essentially of about 0.38 percent beryllium, 1.66 percent ni... | 02/23/1988 |
| 4715910 | Low cost connector alloy The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the pre... | 12/29/1987 |
| 4696704 | Material for lead frames An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation ... | 09/29/1987 |
| 4692192 | Electroconductive spring material A low cost electroconductive spring material excellent in electroconductivity and spring performance, has from 1.8 to 3.0% by weight of Ni, from 0.15 to 0.35% by weight of Be, from 0.2 to 1.2% by weight of Si and the balance being copper. This low cost el... | 09/08/1987 |
| 4666795 | Clad material for ornamental use In construction of a clad material for ornamental use such as eyeglass frames and watch bands, use of age-hardenable alloy sheath followed by age-hardening enables production of product with light weight, high mechanical strength, excellent workability an... | 05/19/1987 |
| 4657601 | Thermomechanical processing of beryllium-copper alloys The invention contemplates a thermomechanical process applicable to beryllium copper alloys consisting essentially of about 0.2 wt % to about 0.7 wt % beryllium; from about 1.0 wt % to about 3.5 wt % nickel and cobalt in the aggregate, where nickel compri... | 04/14/1987 |
| 4642146 | Alpha copper base alloy adapted to be formed as a semi-solid metal slurry A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from ab... | 02/10/1987 |
| 4640723 | Lead frame and method for manufacturing the same A lead frame consists of a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium and having a precipitate with a grain size of 0.5 to 50 μm distributed therein at a rate of 1,000 to 10,000 grains/mm2.... | 02/03/1987 |
| 4620885 | Spring material for electric and electronic parts A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point a... | 11/04/1986 |
| 4601879 | Copper-nickel-tin-titanium-alloy and a method for its manufacture A copper-nickel-tin-titanium-alloy suitable for use as a base material for semiconductors includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, and 0.12 to 1.5% titanium, the remainder being copper and common impurities. An alternative form of the i... | 07/22/1986 |
| 4599120 | Processing of copper alloys This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and nickel, e.g., about 0.05% to about 0.5% beryllium and about 0.05% to about 1% nickel where ... | 07/08/1986 |
| 4594117 | Copper base alloy for forging from a semi-solid slurry condition A process and apparatus for forming a thin-walled, elongated member having superior strength properties from an age hardenable copper base alloy consisting essentially of about 3% to about 20% nickel, about 5% to about 10% aluminum, and the balance essent... | 06/10/1986 |
