Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
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| Number | Title | Issue Date |
| 7955446 | Welding repair method for full hoop structures A unique heat treat method for relieving stresses caused by a repairing weld joint in a full hoop part heat treats locally, at the location of the weld joint, and at a diametrically opposed location. By providing the diametrically opposed heat treat location, the pr... | 06/07/2011 |
| 7806994 | Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an e... | 10/05/2010 |
| 7749340 | Technique for increasing the compliance of lead-free solders containing silver A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced wi... | 07/06/2010 |
| 7682468 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/23/2010 |
| 7431779 | Ultrasonic impact machining of body surfaces to correct defects and strengthen work surfaces Metallic workpieces of diverse shapes having work surfaces which are deformed at the surface and adjacent sub-surface layers by surface impact from ultrasonic transducers employing freely axially moving impacting elements propelled and energized by a transducer osci... | 10/07/2008 |
| 7425299 | Lead-free solder balls and method for the production thereof Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by w... | 09/16/2008 |
| 7422721 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 09/09/2008 |
| 7341175 | Bonding of light emitting diodes having shaped substrates Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do... | 03/11/2008 |
| 7341949 | Process for forming lead-free bump on electronic component A process for forming a lead-free bump on an electronic component includes preparing the electronic component with at least one bond pad and a passivation layer formed thereon; forming an under bump metallurgy (UBM) structure on the passivation layer and the bond pa... | 03/11/2008 |
| 7338567 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/04/2008 |
| 7335269 | Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P) A Pb-free solder alloy based on Sn as matrix is provided, which is a metal that has no toxicity and is environmental friendly. The Pb-free solder comprises a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.4 weight % Ag, and 0.6 to ... | 02/26/2008 |
| 7320736 | High-purity aluminum sputter targets and method of manufacture The high-purity aluminum sputter target is at least 99.999 weight percent aluminum and has a grain structure. The grain structure is at least 99 percent recrystallized and has a grain size of less than 200 μm. The method forms high-purity aluminum sputter targets b... | 01/22/2008 |
| 7282174 | Lead-free solder and soldered article The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the... | 10/16/2007 |
| 7282175 | Lead-free solder A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point ... | 10/16/2007 |
| 7280668 | Ceramic metal matrix diaphragm for loudspeakers This invention provides a method of manufacturing speaker diaphragm for a loudspeaker that has a composite material formed of two layers of ceramic material separated by a light metal substrate and where the core is formed by stamping a sheet of standard gauge alumi... | 10/09/2007 |
| 7264037 | Molding of slurry-form semi-solidified metal Made up of a step of preparing a map expressing a correlation between solid phase percentage and viscosity of a slurry-form semi-solid metal (27) for a given metal composition; a step of setting a target viscosity corresponding to a target solid phase percent... | 09/04/2007 |
| 7259033 | Flip-chip bonding of light emitting devices Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submoun... | 08/21/2007 |
| 7250678 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device. | 07/31/2007 |
| 7250135 | Pb-free solder alloy Provided is a Pb-free solder alloy used for mounting electronic parts on a printed circuit board. The Pb-free solder alloy is highly resistant to oxidation and impact. The Pb-free solder alloy includes Ag of 2.8 wt % to 4.2 wt %, Cu of 0.3 wt % to 0.8 wt %, Ge of 0.... | 07/31/2007 |
| 7240529 | Partially reinforcing method and apparatus of metal material The present invention intends to provide the partially reinforcing method and apparatus for reinforcing the required part of the metal material having good forming property and relatively low strength (hardness and yield stress) by the press processing. The p... | 07/10/2007 |
| 7235143 | Controlled-grain-precious metal sputter targets A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has... | 06/26/2007 |
| 7221553 | Substrate support having heat transfer system A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoi... | 05/22/2007 |
| 7179417 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/20/2007 |
| 7175805 | Tin-zinc lead-free solder, its mixture, and solder-joined part An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/13/2007 |
| 7175804 | Sn-Zn lead-free solder alloy, and solder junction portion An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt %... | 02/13/2007 |
| 7175705 | Process for producing compound semiconductor single crystal A process for producing compound semiconductor single crystal, comprises the steps of: putting a compound semiconductor raw material into a crucible, setting the crucible in a vertical type of heating furnace to heat and melt the raw material by a heater, promoting ... | 02/13/2007 |
| 7172726 | Lead-free solder A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and ... | 02/06/2007 |
| 7160504 | Alloy type thermal fuse and fuse element thereof The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type. The fuse element has an alloy composition in which a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Bi, Cu, Ni, and Pd is added... | 01/09/2007 |
| 7156283 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux ... | 01/02/2007 |
| 7148426 | Lead-free solder, and connection lead and electrical component using said lead-free solder In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip ... | 12/12/2006 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps a... | 12/05/2006 |
| 7138086 | Soldering alloy There is disclosed a soldering alloy which prevents an iron tip of a soldering iron from being deteriorated. The soldering alloy comprises: 0.3 to 3% by weight of Cu; 0.01 to 0.1% by weight of Fe; 0.001 to 0.004% by weight of Ga; and a remainder including Sn and una... | 11/21/2006 |
| 7132020 | Solder for use on surfaces coated with nickel by electroless plating A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, ... | 11/07/2006 |
| 7111771 | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of ... | 09/26/2006 |
| 7074627 | Lead solder indicator and method A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder syst... | 07/11/2006 |
| 7070736 | Sn-Zn lead-free solder alloy and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt %... | 07/04/2006 |
| 7041180 | Method for joining workpieces using soldering alloy A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum;... | 05/09/2006 |
| 7029542 | Lead-free solder alloy A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high ... | 04/18/2006 |
| 7022282 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 04/04/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
