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Class 134/902 - SEMICONDUCTOR WAFER


Subclass of Class 134 - Cleaning and liquid contact with solids
Definition: Apparatus including means to contact a semiconductor wafer
No. of patents: 1671
Last issue date: 10/28/2008


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NumberTitleIssue Date
7441299Apparatuses and methods for cleaning a substrate
An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate...
10/28/2008
7435301Cleaning solution of silicon germanium layer and cleaning method using the same
Disclosed are a cleaning solution for preventing damage of a silicon germanium layer when cleaning a semiconductor device including the silicon germanium layer and a cleaning method using the same. The cleaning solution of a silicon germanium layer includes from abo...
10/14/2008
7435396High-pressure processing apparatus and high-pressure processing method
Mixing baths 6A and 6B which temporarily hold chemical agents A and B respectively are disposed. The mixing baths 6A and 6B are each connected with a high-pressure fluid supplying unit 2. For surface treatment using a mixture of th...
10/14/2008
7435302Surface treatment apparatus and method for manufacturing liquid crystal display device
A cleaning apparatus according to the present invention is provided with a brush drive mechanism which brings a brush being rotating closer to a substrate, measures electrical potentials generated on a plurality of conductor patterns formed on the substrate, by a co...
10/14/2008
7434589Wafer cleaning apparatus with anticipating malfunction of pump
Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the clean...
10/14/2008
7434590Method and apparatus for clamping a substrate in a high pressure processing system
An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficultie...
10/14/2008
7431038Wet processing device and wet processing method
The flow of a processing liquid poured onto the surface of a substrate at a standstill to process the substrate from the surface to the back surface of the substrate is suppressed to achieve satisfactory cleaning. When a processing liquid is poured onto a sub...
10/07/2008
7431040Method and apparatus for dispensing a rinse solution on a substrate
An apparatus and method for dispensing a rinse solution on a substrate in which the rinse solution is dispensed through one nozzle array substantially near a center of a substrate and is dispensed through a second nozzle array across a radial span of the substrate. ...
10/07/2008
7428907Substrate processing apparatus
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, interm...
09/30/2008
7427168Developing method and developing unit
In a developing method for performing developing treatment of a substrate by supplying a developing solution onto a resist film formed on a surface of the substrate, the present invention controls a zeta potential of the surface of the substrate at a predetermined p...
09/23/2008
7422681Substrate treating apparatus
A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the...
09/09/2008
7422639Method of reducing water spotting and oxide growth on a semiconductor structure
The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. ...
09/09/2008
7422641Substrate cleaning apparatus and substrate cleaning method
A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During clea...
09/09/2008
7422024Ultrasonic shower cleaning apparatus of double-side cleaning type
An ultrasonic shower cleaning apparatus is disclosed which is capable of efficiently cleaning both surfaces of an article and configured to have a reduced size enabling an installation space thereof to be decreased. A pair of ultrasonic shower cleaning mechanisms ea...
09/09/2008
7418970Substrate processing apparatus for drying substrate
A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust ...
09/02/2008
7419614Method of etching and cleaning objects
A method of etching and cleaning objects contained in a vessel, includes etching the objects by providing etching solution into the vessel, forcing out the etching solution from the vessel by providing pressurized gas into the vessel; cleaning the objects by providi...
09/02/2008
7416611Process and apparatus for treating a workpiece with gases
In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or ...
08/26/2008
7415985Substrate cleaning and drying apparatus
A substrate cleaning and drying apparatus for performing drying treatment after cleaning treatment of substrates. The apparatus includes a treating tank for storing a treating liquid, and performing the cleaning treatment of the substrates immersed in the treating l...
08/26/2008
7417018Method of cleaning a solid surface by removing organic and/or mineral soils using a microemulsion
The invention relates to a method of cleaning a solid surface comprising the following stages: a) the solid surface is cleaned using a microemulsion-type cleaning composition; e) the cleaned surface is drained; f) the drained surface is rinsed with an organic solven...
08/26/2008
7412982Cleaning probe and megasonic cleaning apparatus having the same
A cleaning probe capable of providing uniform cleaning to an entire wafer while not damaging the edge portion of the wafer, and a megasonic cleaning apparatus having the cleaning probe are provided. The cleaning probe comprises a front portion located near the cente...
08/19/2008
7412983Pattern forming method and apparatus, and device fabrication method and device
The invention saves resources and energy. A cleaning/fluid-feeding head integrates a cleaning head portion and a fluid-feeding head portion. The cleaning head portion includes an organic substance cleaning unit, an inorganic substance cleaning unit, a rinsing unit a...
08/19/2008
7412981Liquid processing apparatus and method
A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ...
08/19/2008
7410543Substrate processing method
Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atm...
08/12/2008
7410545Substrate processing method of and substrate processing apparatus for freezing and cleaning substrate
A substrate immersed in pure water held inside a processing bath disposed to a cleaning unit 1 and accordingly washed, as it bears an aqueous film on its surface, is transported by a substrate transportation mechanism 3 to a spin-processing unit 2
08/12/2008
7406972Substrate proximity processing structures
An apparatus for generating a fluid meniscus to process a substrate is provided. The apparatus includes a manifold head with a manifold surface having a plurality of conduits configured to generate a fluid meniscus on a substrate surface when positioned proximate th...
08/05/2008
7404863Methods of thinning a silicon wafer using HF and ozone
A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of t...
07/29/2008
7402213Stripping and removal of organic-containing materials from electronic device substrate surfaces
Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising o...
07/22/2008
7395611System processing a substrate using dynamic liquid meniscus
A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parall...
07/08/2008
7396416Substrate cleaning device
A substrate cleaning device comprises a chamber for cleaning a substrate; a substrate support installed in the chamber providing a surface for supporting the substrate during cleaning thereof; at least one cleaning solution supply outlet for spraying a cleaning solu...
07/08/2008
7395827Apparatus to produce acoustic cavitation in a liquid insonification medium
An apparatus to produce acoustic cavitation by controlling cavitation events in a liquid insonification medium utilizing a waveform to excite a transducer with a series of bipolar inharmonic tone bursts having medium recovery intervals between respective bursts so t...
07/08/2008
7392812Substrate processing apparatus and substrate transporting device mounted thereto
The invention provides a substrate processing apparatus including a processing tank for processing substrates, a transporting path provided along the processing tank, a substrate transporting device moving along the transporting path for transporting the substrates,...
07/01/2008
7392815Chamber for wafer cleaning and method for making the same
A wafer processing chamber “chamber” is provided. Broadly speaking, the chamber allows a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. More specifically, the chamber utilizes removable plates that can be configured to ...
07/01/2008
7389783Proximity meniscus manifold
An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first ...
06/24/2008
7387132Apparatus for treating wafer
An apparatus for treating a wafer preferably includes a rotating chuck for rotating the wafer and a treating fluid supplying part for supplying the wafer with one or more treating fluids. The treating fluid(s) can be used to clean and/or dry the wafer. The treating ...
06/17/2008
7387689Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the h...
06/17/2008
7386944Method and apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer
A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in ...
06/17/2008
7383601Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
In one embodiment, a substrate preparation system is provided. The system includes a brush, a front head, and a back head. The brush is configured to brush scrub a back surface of a substrate using a brush scrubbing chemistry. The front head is defined in close prox...
06/10/2008
7383843Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the...
06/10/2008
7384484Substrate processing method, substrate processing apparatus and substrate processing system
After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary tran...
06/10/2008
7383844Meniscus, vacuum, IPA vapor, drying manifold
A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface an...
06/10/2008
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