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| Number | Title | Issue Date |
| 8038799 | Substrate processing apparatus and substrate processing method A substrate processing apparatus and a substrate processing method, with which a resist can be removed satisfactorily from the substrate and a processing solution used for removing the resist can be recycled, are provided. The substrate processing apparatus includes... | 10/18/2011 |
| 8007594 | Method for manufacturing semiconductor device A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface of the wafer. The cleaning process is conducted by injecting onto the... | 08/30/2011 |
| 7985297 | Method of cleaning a quartz part A cleaning solution for a quartz part and a method for cleaning the quartz part are provided. The cleaning solution includes from about 5 to about 35 wt % of an ammonium compound, from about 7 to about 55 wt % of an acidic oxidizing agent, from about 5 to about 30 w... | 07/26/2011 |
| 7947130 | Troika acid semiconductor cleaning compositions and methods of use Semiconductor processing compositions for use with silicon wafers having an insulating layers and metallization layers on the wafers comprising water and one or more Troika acids which is also referred to as α,α-disubstituted trifunctional oximes or α-(Hydroxyimi... | 05/24/2011 |
| 7799140 | Process for the removal of photoreceptor coatings using a stripping solution The disclosed embodiments are directed to processes for removing photoreceptor coatings from a substrate, wherein the photoreceptor coatings disposed over a substrate of an electrophotographic photoreceptor. More specifically, the invention discloses a photoreceptor... | 09/21/2010 |
| 7771542 | Compositions and methods for removing lead from metal surfaces The invention provides an aqueous composition that includes a hydroxy-substituted mono-, di-, or tri-carboxylic acid; phosphoric acid; a surfactant; and water. The invention further provides a method for removing lead from the surface of metal, the method includes c... | 08/10/2010 |
| 7718009 | Cleaning submicron structures on a semiconductor wafer surface Cleaning solutions and cleaning methods targeted to particular substrates and structures in semiconductor fabrication are described. A method of cleaning fragile structures having a dimension less than 0.15 um with a cleaning solution formed of a solvent having a su... | 05/18/2010 |
| 7699936 | Composition and method for surface treatment of oxidized metal The present invention provides an electrically conductive element for a proton exchange membrane fuel cell having low electrical contact resistance and high corrosion resistance. The conductive element comprises a corrosion susceptible metal substrate with a surface... | 04/20/2010 |
| 7597765 | Post etch wafer surface cleaning with liquid meniscus A method for cleaning the surface of a semiconductor wafer is disclosed. A first cleaning solution is applied to the wafer surface to remove contaminants on the wafer surface. The first cleaning solution is removed with some of the contaminants on the wafer surface.... | 10/06/2009 |
| 7531043 | Magnetic disk substrate and production method of magnetic disk The invention can provide a production method for a magnetic disk substrate capable of reducing the number of surface defects of a glass substrate. When a magnetic disk is produced by using the resulting magnetic disk substrate, the yield and, furthermore, the relia... | 05/12/2009 |
| 7452426 | Process solutions containing surfactants used as post-chemical mechanical planarization treatment Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse sol... | 11/18/2008 |
| 7435355 | Liquid-based gravity-driven etching-stop technique for controlling structure dimension A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an em... | 10/14/2008 |
| 7431853 | Selective etching of oxides from substrates A method and system for release etching a micro-electrical-mechanical-systems (MEMS) device from a substrate. In one aspect, the invention is a method comprising (a) supporting at least one substrate having a sacrificial oxide and a non-sacrificial material in a pro... | 10/07/2008 |
| 7431860 | Etching process A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the material. Droplets may be deposited from a print head of the type having a... | 10/07/2008 |
| 7422639 | Method of reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. ... | 09/09/2008 |
| 7419614 | Method of etching and cleaning objects A method of etching and cleaning objects contained in a vessel, includes etching the objects by providing etching solution into the vessel, forcing out the etching solution from the vessel by providing pressurized gas into the vessel; cleaning the objects by providi... | 09/02/2008 |
| 7416611 | Process and apparatus for treating a workpiece with gases In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or ... | 08/26/2008 |
| 7417016 | Composition for the removing of sidewall residues The present invention relates to a composition for the removal of so-called “sidewall residues” from metal surfaces, in particular from aluminium or aluminium-containing surfaces, in particular from aluminium or aluminium-containing surfaces, during the producti... | 08/26/2008 |
| 7415983 | Method of cleaning articles in a dish machine using an acidic detergent An acidic detergent composition can be used for removing soils on articles in a dish machine. The acidic detergent composition may be inserted into a dish machine dispenser and a use solution may be formed that contacts a soil on an article and removes the soil on t... | 08/26/2008 |
| 7410902 | Composition for cleaning semiconductor device A sulfur-containing detergent composition for cleaning a semiconductor device having an aluminum wire, wherein the sulfur-containing detergent composition is capable of forming a protective film containing a sulfur atom on a surface of an aluminum film in a protecti... | 08/12/2008 |
| 7404863 | Methods of thinning a silicon wafer using HF and ozone A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of t... | 07/29/2008 |
| 7402213 | Stripping and removal of organic-containing materials from electronic device substrate surfaces Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising o... | 07/22/2008 |
| 7402552 | Non-corrosive cleaning composition for removing plasma etching residues A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary amm... | 07/22/2008 |
| 7402258 | Methods of removing metal contaminants from a component for a plasma processing apparatus Methods of removing metal contaminants from a component for a plasma processing apparatus are provided. The method includes cleaning a surface of the component with a cleaning liquid that includes at least one acid selected from oxalic acid, formic acid, acetic acid... | 07/22/2008 |
| 7399365 | Aqueous fluoride compositions for cleaning semiconductor devices The present invention relates to dilute fluoride solutions and methods for cleaning plasma etch residue from semiconductor substrates including such dilute solutions. The compositions and methods according to the invention can advantageously provide both cleaning ef... | 07/15/2008 |
| 7396417 | Method for removing laser scales A degreasing method for descaling or removing laser scales from iron-containing metal part surface by treating the iron-containing metal part surfaces that is optionally tainted with laser scales with an aqueous solution containing at least one type of highly water-... | 07/08/2008 |
| 7387964 | Copper polishing cleaning solution A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine includ... | 06/17/2008 |
| 7384901 | Process for cleaning aluminum and aluminum alloy surfaces with nitric acid and chromic acid-free compositions A process for cleaning (e.g., desmutting) an aluminum surface, using compositions free of nitric acid and chromic acid and comprising, in one embodiment, an oxidant and at least one mineral acid salt. In another embodiment, the process uses a composition free of nit... | 06/10/2008 |
| 7377984 | Method for cleaning a photomask Disclosed herein is a method of cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidat... | 05/27/2008 |
| 7371056 | Fluid pump, cooling system and electrical appliance A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member... | 05/13/2008 |
| 7368019 | Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material A technique is provided to precludes elution of the nickel by infallibly removing the nickel adhering to the inner surface of plumbing hardware, realize a treatment for efficient (treating temperature, treating duration, etc.) preclusion of both or either of lead an... | 05/06/2008 |
| 7368383 | Hillock reduction in copper films A method for treating a copper surface of a semiconductor device provides exposing the copper surface to a citric acid solution after the surface is formed using CMP (chemical mechanical polishing) or other methods. The citric acid treatment may take place during a ... | 05/06/2008 |
| 7367343 | Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution The invention includes methods of cleaning a surface of a cobalt-containing material, methods of forming an opening to a cobalt-containing material, semiconductor processing methods of forming an integrated circuit comprising a copper-containing conductive line, and... | 05/06/2008 |
| 7368173 | Siloxane resin-based anti-reflective coating composition having high wet etch rate Herein we disclose a composition, comprising a siloxane resin having the formula (HSiO3/2)a. (SiO4/2)b(HSiX3/2)c(SiX4/2)d, wherein each X is independently —O—, —OH, or —O... | 05/06/2008 |
| 7364625 | Rinsing processes and equipment Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension ... | 04/29/2008 |
| 7361631 | Compositions for the removal of organic and inorganic residues A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid sele... | 04/22/2008 |
| 7361231 | System and method for mid-pressure dense phase gas and ultrasonic cleaning Workpieces are loaded into a cleaning chamber. The cleaning chamber is pressurized with a first dense-phase cleaning fluid, the temperature and pressure of the first dense-phase fluid being maintained at less than about 1500 psi using a temperature control device. T... | 04/22/2008 |
| 7354890 | Cleaning composition and method Cleaning compositions composed of specific amounts of carbonic acid and/or carbonate, hydrogen peroxide, aluminum fluoride and water are highly effective for cleaning electronic devices of resist, resist residues, titanium dioxide, aluminum oxide and silicon dioxide... | 04/08/2008 |
| 7351391 | System and method for converting the spent remnants of a first pickling acid solution into a usable second pickling acid solution A system and method of economically converting a spent first pickling acid solution that contains hydrochloric acid, water and ferrous chloride into a suitable second pickling solution. Sulfuric acid is added to the first pickling acid solution. This produces a rege... | 04/01/2008 |
| 7351295 | Cleaning and polishing rusted iron-containing surfaces A method for cleaning and polishing a rusted iron-containing metal surface is disclosed. The metal surface is contacted with a composition containing fluorometallate anions of a Group IVB metal. ... | 04/01/2008 |
