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| Number | Title | Issue Date |
| 8065995 | Method and apparatus for cutting and cleaning wafers in a wire saw A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web... | 11/29/2011 |
| 8061345 | Method for wire sawing A method and a device for cutting a workpiece (1, 21) in a wire saw is described, wherein a workpiece (1, 21) is fixed in a wire saw by means of a mounting beam (2, 22). In the method according to the invention, the generation of a mark or a ste... | 11/22/2011 |
| 8047195 | Multiwire sawing machine for the cutting of material in block form The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like According to the invention, in said wheel pack of the guide pulley ... | 11/01/2011 |
| 8047194 | Protection device for a rope saw assembly A protection device for a rope saw assembly (5) includes at least two, telescopically displaceable relative to each other, cover members (12, 13) having each a circular cross-section, an extending along a longitudinal axis receiving space (14) f... | 11/01/2011 |
| 7997262 | Method of improving nanotopography of surface of wafer and wire saw apparatus The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for fee... | 08/16/2011 |
| 7827980 | Method for slicing a multiplicity of wafers from a workpiece A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wi... | 11/09/2010 |
| 7770575 | Multiware sawing machine for the cutting of material in block form The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs an... | 08/10/2010 |
| 7757684 | Movable machinery, including pavement working apparatus and methods of making A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials sandwiching the closed cell foam. Metall... | 07/20/2010 |
| 7464702 | Method of producing III-nitride substrate An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at le... | 12/16/2008 |
| 7434575 | Chainsaw chain for concrete The invention relates to a chainsaw chain, especially for use in cutting concrete, comprising a plurality of teeth which are respectively provided with at least one cutting segment carrier and at least one cutting segment. The cutting segment comprises diamond punch... | 10/14/2008 |
| 7431028 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 10/07/2008 |
| 7406905 | System for driving a wire loop cutting element This invention is directed toward a system for driving a wire loop cutting element. More particularly, the disclosed invention employs a frame and pulleys to drive a wire loop cutting element. ... | 08/05/2008 |
| 7373935 | Carbide wire blade This invention relates to a carbide wire blade that is suitable for use in sawing through subsea structures. The carbide wire blade employs a tungsten carbide cutter, a vibration dampening member, and the first cylindrical spacer, slideably mounted on a solid cylind... | 05/20/2008 |
| 7370646 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 05/13/2008 |
| 7353818 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 04/08/2008 |
| 7338712 | Coating composition for a smoothing and/or polishing element and a grinding wheel provided with said coating composition The invention concerns a coating for a smoothing and/or polishing element, particularly a flexible grinding wheel, provided with a flexible abrasive insert, for smoothing and polishing stone material, consisting essentially of: a blend of epoxy resin and polysulfide... | 03/04/2008 |
| 7311101 | End supporting plate for single crystalline ingot This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support ... | 12/25/2007 |
| 7309277 | Method of manufacturing honeycomb structural body A method of manufacturing a honeycomb structure of the present invention is a method of obtaining a honeycomb structure 10 having a predetermined shape by processing a peripheral portion of a crude honeycomb structure 2, the method being characterized ... | 12/18/2007 |
| 7299594 | Brick patterned shelving An apparatus for at least one of providing a decorative shelf, decorative framing, decorative shelving, decorative paneling and a decorative member for supporting and hanging preselected articles. The apparatus comprises a panel member formed with a brick like desig... | 11/27/2007 |
| 7291058 | Method and apparatus for improving media flow The flow of media in shot peening, blast cleaning, and similar equipment is improved by applying a time varying magnetic field to the media to thereby degauss the media, allowing the media to flow through equipment without clogging and clumping due to magnetic attra... | 11/06/2007 |
| 7284548 | Cutting method by wire saw and cut workpiece receiving member in wire saw In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers 10 is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers are cut out in abutment of a workpiece B against the wire array, ... | 10/23/2007 |
| 7281536 | Cutting machine using wire saw, cutting method using wire saw, and mobile machine having wire saw cutting machine A cutting apparatus that positions a wire saw driving device movably and appropriately at the desired site by freely moving an arm of a backhoe provided with a boom, which arm carries the wire saw driving device and is turnable and movable in upward, downward, leftw... | 10/16/2007 |
| 7279047 | Reactor for extended duration growth of gallium containing single crystals An apparatus for growing bulk GaN and AlGaN single crystal boules, preferably using a modified HVPE process, is provided. The single crystal boules typically have a volume in excess of 4 cubic centimeters with a minimum dimension of approximately 1 centimeter. If de... | 10/09/2007 |
| 7261099 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 08/28/2007 |
| 7228855 | Method for cutting a single crystal ingot The object of the present invention is to provide a method whereby it is possible to cut a single crystal ingot comparatively accurately while allowing resulting slices to have a flat surface, and to lengthen the life of the blade more than would be possible with co... | 06/12/2007 |
| 7224766 | CT detector array having non-pixelated scintillator array The present invention is a directed to a non-pixelated scintillator array for a CT detector as well as an apparatus and method of manufacturing same. The scintillator array is comprised of a number of ceramic fibers or single crystal fibers that are aligned in paral... | 05/29/2007 |
| 7223155 | Method of producing III-nitride substrate An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at le... | 05/29/2007 |
| 7223344 | Method for treating an exhausted glycol-based slurry A method of separating, recovering and reusing components of an exhausted slurry used in slicing silicon wafers from a silicon ingot. In the method, the solid particles and lubricating fluid of the exhausted slurry are separated without decreasing the viscosity of t... | 05/29/2007 |
| 7222555 | Method of manufacturing a hacksaw A method for manufacturing a handsaw capable of cutting a glass bottle. The method includes cutting a steel strip to a predetermined length to form a handsaw substrate. A portion of the handsaw substrate, other than a cutter blade forming portion formed on at least ... | 05/29/2007 |
| 7221365 | System and method for distributing photons when rendering an image using photon mapping A method for distributing photons among light sources when rendering an image of a scene using photon mapping includes the steps of computing a total energy for the scene, where the scene includes a plurality of light sources, and computing an average energy of the ... | 05/22/2007 |
| 7197805 | Embedment removal method Draft tube embedments of a hydroelectric turbine are removed for replacement and/or upgrading. Several shafts for saw wire access, forming a horizontal polygonal shape are drilled outside the draft ring and a circular slot cut below the bottom ring to meet the shaft... | 04/03/2007 |
| 7195542 | Process, apparatus and slurry for wire sawing A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw accor... | 03/27/2007 |
| 7192225 | Machine tool Machine tool having a bed, a table arranged on the bed, a first saddle provided free to travel back and forth, a second saddle supported on the first saddle and provided free to travel side to side, a spindle head provided free to travel perpendicularly on the secon... | 03/20/2007 |
| 7185437 | Chainsaw bar tensioning apparatus A chain saw bar tensioning apparatus is disclosed comprising a sliding member having a recess formed therein. The sliding member is adjacent to a first tensioning member that biases the sliding member in a direction such that when the apparatus is incorporated into ... | 03/06/2007 |
| 7159586 | Portable cutting apparatus The cutting apparatus of the present invention includes a frame with first and second side members that lie parallel to one another. It also includes two or more cross-members that connect the first and second side members together as well as a cantilever member tha... | 01/09/2007 |
| 7150277 | Pivoting guide pulley stand for wire saw A guide pulley stand for wire saw use in stone quarries, for guiding the cutting wire when the wire saw unit is set up on the top of the object to be cut. The pivoting guide pulley stand comprises of a support base on the front end of the wire saw track, a guide pul... | 12/19/2006 |
| 7144314 | Sanding rope and applications thereof A disposable sanding device is fabricated as a continuous rope-like article which is adapted for selective segmentation and application as a plurality of serially arranged disposable hand sanding devices or ropes. Each hand sanding device is formed as a generally el... | 12/05/2006 |
| 7137865 | Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation A method for the division of single crystals, in particular of GaAs, is provided in which a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) are moved relative to one anoth... | 11/21/2006 |
| 7114424 | Wire sawing device A sawing device includes a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. The device includes, for ... | 10/03/2006 |
| 7116465 | Micromirror device There is provided a micromirror device, which is provided with a mirror layer including a mirror surface which is supported to be rotatable around a first axis passing through a center of the mirror surface, and an upper substrate having transparency including a fir... | 10/03/2006 |
