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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8047193 | Non-core drill bit A non-core drill bit is provided with a metallic seat 2 attached to the tip of a shank of a boring tool, a cylindrical first diamond grindstone body 3 fixed to the metallic seat 2 and having a recessed cutout portion 10 to be opened to on... | 11/01/2011 |
| 7699050 | Method of manufacturing (110) silicon wafer The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction o... | 04/20/2010 |
| 7267037 | Bidirectional singulation saw and method A singulation saw for sawing either substrate or wafers includes a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternatively engaging with a substrate to be singulated. The singulation saw further includes a trans... | 09/11/2007 |
| 7246975 | Hole saw with replaceable cutting tip A device for cutting a hole, such as in sheet metal is provided. The device includes an axially rotatably cylindrical body that is operable with a rotatable drive. A distal end portion of the body includes a replaceable cutting tip and a replaceable pilot. The cutti... | 07/24/2007 |
| 7204244 | Diamond core drill bit A diamond core drill bit (100) is disclosed. The drill bit has a right-circular cylindrical body (120) with at least one side lubrication hole (122) toward the bottom of the body and a plurality of parallel grooves (124) oriented in an ax... | 04/17/2007 |
| 7192226 | Shrink fit holder and methods of drilling and reaming A drill has a unitary drill bit and chuck structure that includes a drill bit and a chuck. The chuck encloses a portion of the drill bit and has a thread. A rotatable drive element having a thread engages the thread of the chuck. The chuck is heat shrunk onto the dr... | 03/20/2007 |
| 7134812 | Tool coolant application and direction assembly A coolant assembly for supplying coolant fluid to a tool includes an outer ring defining an inlet and an insert pressed within the outer ring including an annular channel. The annular channel is in communication with the inlet defined by the outer ring and includes ... | 11/14/2006 |
| 7131562 | Scribing and breaking apparatus, system therefor, and scribing and breaking method A separation apparatus comprising a first and a second scribing means for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first... | 11/07/2006 |
| 7089925 | Reciprocating wire saw for cutting hard materials The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, where... | 08/15/2006 |
| 6935325 | Method and apparatus for cutting and polishing stone articles A method for making a stone article includes the steps of providing a block of material having substantially square top and bottom surfaces, impacting the top and bottom surfaces with a non-square blade so as to split off-excess material from the top and bottom surf... | 08/30/2005 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor device... | 08/23/2005 |
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompass... | 07/12/2005 |
| 6908264 | Quick change drill bit A quick-change core drill includes an adapter and a generally tubular drill barrel. The adapter comprises a first end adapted to be removably connected to a drill spindle and a second end adapted to be removably connected to the drill barrel. The drill barrel includ... | 06/21/2005 |
| 6874400 | Cutting tool unit and assembly, and machine and associated cutting method A rotatable cutting tool unit of a tool assembly for a cutting machine that is used in conjunction with an associated method of cutting provides several novel aspects. The tool arrangement, which includes two tool units, includes first and second disk-shaped tools r... | 04/05/2005 |
| 6866032 | Tool and method for preparing a block for receiving an electrical receptacle The present invention is directed to a coring drill and method for preparing a block for containing a receptacle assembly. The coring drill comprises a generally cylindrically-shaped corer hub having a longitudinal drilling axis. A generally cylindrically-shaped fir... | 03/15/2005 |
| 6776078 | Cutting machine A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a m... | 08/17/2004 |
| 6752688 | Cutting solution supplying and controlling apparatus for dicing machine In the cutting solution supplying and controlling apparatus for a dicing machine, a flow rate adjusting device is provided in addition to a regulator as the pressure adjusting device. The flow rate adjusting device has a flow rate controller, which controls a propor... | 06/22/2004 |
| 6698416 | Film frame substrate fixture The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across... | 03/02/2004 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semicondu... | 02/17/2004 |
| 6659843 | Substrate dicing method A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an ... | 12/09/2003 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities,... | 10/14/2003 |
| 6612300 | Cutting method for hard, brittle materials The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping ... | 09/02/2003 |
| 6581586 | Cutting machine A cutting machine comprising a chuck means for holding a workpiece to be cut and a cutting means for cutting the workpiece held on the chuck means. The cutting machine further has a first moving means for moving the chuck means relative to the cutting mea... | 06/24/2003 |
| 6568385 | Cutting machine A cutting machine of a type having bellows means disposed at least on one side of a chuck table to be reciprocated. A protective sheet covering the upper surface of the bellows means is disposed. One end of the protective sheet is reciprocated in accordan... | 05/27/2003 |
| 6494122 | Alignment method and apparatus for aligning cutting blade Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street interven... | 12/17/2002 |
| 6493911 | Cinerary urn forming an element of a funerary column and method for making such urns in stone A cinerary urn receptacle made of stone comprising a cylindrical block hollowed from one first end to a second end and a cover having a sealing portion and an assembling portion, the sealing portion closing the block first end, the assembling portion proj... | 12/17/2002 |
| 6471583 | Method of machining rare earth alloy and method of fabricating rare earth magnet using the same The invention provides a method of machining a rare earth alloy at high machining preciseness and high efficiency. In a step of grinding a block of a rare earth alloy with a grinding wheel having, on a peripheral portion thereof, a grinding edge including... | 10/29/2002 |
| 6457468 | Vertical blade saw assembly for ceramic and masonry materials The vertical blade saw assembly for ceramic and masonry materials is designed to provide an assembly that allows the user to make cuts of any shape to ceramic tiles and masonry materials in order to permit the installation of precision cuts for a particul... | 10/01/2002 |
| 6427676 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafe... | 08/06/2002 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafe... | 06/11/2002 |
| 6398623 | Processing method of device and processing method of slider A working method capable of implementing various types of devices such as a slider available with high reliability without causing malfunction or the like due to contamination during an actual use is provided by solving a problem of deterioration in profi... | 06/04/2002 |
| 6382202 | Drill bit A drill bit for producing circular-cylindrical recesses or boreholes is formed of a drilling cylinder (1) having cutting elements (3) at the leading end in the drilling direction. A detachable core sleeve (2) is arranged in the interior of the drilling cy... | 05/07/2002 |
| 6361404 | Precision cutting apparatus and cutting method using the same Disclosed is an improved precision cutting apparatus comprising a chuck table for holding a workpiece, and first and second cutting means each including a spindle unit having a blade attached thereto. The first and second cutting means are series-arranged... | 03/26/2002 |
| 6328027 | Method for precision cutting of soluble scintillator materials A method for precision cutting liquid soluble scintillator materials by an operator is disclosed, including the steps of providing a first run of a moving filament in operative proximity to cut the scintillator materials, concurrent with wetting at least ... | 12/11/2001 |
| 6318354 | Singulation system for a BGA product A singulation system for a BGA product is disclosed, which has a cutting mechanism with a cutting head, a conveyor belt arranged under the cutting head, a cutting table positioned to connect with the conveyor belt, a cleaning station positioned beside the... | 11/20/2001 |
| 6279563 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities,... | 08/28/2001 |
| 6276355 | Cutting method and apparatus for sectioning multilayer electronic devices The slitting assembly includes a grinding wheel with a wide flat grinding face for first cutting a multilayer sheet of soft and compressible, electronic device material, such as lithium-ion polymer material for a uni-cell battery, to a first depth and inc... | 08/21/2001 |
| 6257224 | Process for working a preform made of an oxide single crystal, and a process for producing functional devices A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, includes the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradia... | 07/10/2001 |
| 6253756 | Accessory for cutting device Disclosed is an accessory mounted on a cutting device including two mutually parallel guide bars. The accessory includes a first channel formed in the accessory for receiving one of the two mutually parallel guide bars. A second channel is formed to recei... | 07/03/2001 |
| 6250295 | Tool A tool for treatment of rock, masonry or concrete by drilling, grinding or cutting off, the tool has a plurality of cutting segments each having a plurality of bonded cutting bodies formed as diamond crystals and subjected to an abrasive wear during an op... | 06/26/2001 |
