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| Number | Title | Issue Date |
| 7228855 | Method for cutting a single crystal ingot The object of the present invention is to provide a method whereby it is possible to cut a single crystal ingot comparatively accurately while allowing resulting slices to have a flat surface, and to lengthen the life of the blade more than would be possible with co... | 06/12/2007 |
| 7204320 | Active rotational balancing system for orbital sanders A system for active dynamic balancing of a rotating tool driven by a motor having a shaft supported by a first and second bearing on opposing sides of the motor includes an acceleration sensing assembly configured to sense radial accelerations on the shaft producing... | 04/17/2007 |
| 7104342 | Active rotational balancing system for orbital sanders A system for active dynamic balancing of a rotating tool driven by a motor having a shaft supported by a first and second bearing on opposing sides of the motor includes an acceleration sensing assembly configured to sense radial accelerations on the shaft producing... | 09/12/2006 |
| 7007855 | Wafer identification mark A semiconductor wafer including a plurality of pits in the semiconductor wafer. The pits are arranged in an information-providing pattern and are readable after completion of processing on the wafer. ... | 03/07/2006 |
| 6929000 | Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle Centering elements for effectively reducing the clearance between a shaft and a rotatable element, such as a blade-fixing flange of a dicing saw for semiconductor substrates or carrier substrates, installable thereon are disclosed. In addition, the centering element... | 08/16/2005 |
| 6913528 | Low amplitude, high speed polisher and method A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optio... | 07/05/2005 |
| 6907874 | Concrete hole cutting machine A machine for cutting holes in concrete slabs comprises a connector adapted to be secured to an adapter of a front-end loader. Secured to the connector is a first frame structure that includes an elongated tube and a support foot for engaging the surface of a concre... | 06/21/2005 |
| 6883511 | Portable stone cutter An improved portable stone cutter includes a base which is of a rectangular frame composed of a plurality of longitudinal bars, a pair of transverse bars and a pair sliding bars, a working table slidably secured to the sliding bars, a motor disposed on the front end... | 04/26/2005 |
| 6792934 | V grooving machine for natural or engineered stone The present invention provides for an apparatus for forming a V groove in a sheet of natural, synthetic or engineered stone material. The apparatus comprises a table for supporting a work piece of natural, synthetic or engineered stone material to be cut, two or mor... | 09/21/2004 |
| 6581586 | Cutting machine A cutting machine comprising a chuck means for holding a workpiece to be cut and a cutting means for cutting the workpiece held on the chuck means. The cutting machine further has a first moving means for moving the chuck means relative to the cutting mea... | 06/24/2003 |
| 6442841 | Device in connection with hand-operated working machine A device in connection with a hand-operated working machine with a water flow directed to the working tool comprises a first control which is a control (15) for a drive motor (3) for the tool, and a second control which is a control (17) for the water sup... | 09/03/2002 |
| 6390889 | Holding strip for a semiconductor ingot A holding strip is used to hold a semiconductor ingot during semiconductor wafer fabrication. The holding strip is formed from a semiconductor material, typically the same material used to form the ingot itself. The holding strip has a holding surface sha... | 05/21/2002 |
| 6367467 | Holding unit for semiconductor wafer sawing A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The ho... | 04/09/2002 |
| 6360737 | Annular saw and method of protecting the clamping edge and of cleaning the saw blade of an annular saw There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge an... | 03/26/2002 |
| 6318352 | Dust and particle control attachment for a saw A dust and particle control attachment for a saw having a housing and a rotary blade secured for rotation on a shaft extending from the housing comprising a rotary blade guard enclosing a portion of the rotary blade having one side thereof secured to the ... | 11/20/2001 |
| 6216682 | Cutting apparatus A cutting apparatus having a chuck table for holding a workpiece and cutting means for cutting the workpiece held by the chuck table. The cutting means includes a spindle unit, a blade to be attached to a rotating spindle of the spindle unit, a cutting-wa... | 04/17/2001 |
| 6142046 | Knife projection sensing system A knife projection sensing system for cutting machines having a rotatable surface adapted to retain a plurality of cutting knives. The system employs a plurality of sensors mountable to the cutting machine to be stationary with respect to the rotatable su... | 11/07/2000 |
| 6021772 | Bandsaw and process for cutting off slices from a workpiece A bandsaw for cutting off slices from a workpiece includes a sawband which circulates over a system of pulleys and has a band back and a cutting edge, which is situated opposite to the band back and is provided with a cutting surface. There is also a feed... | 02/08/2000 |
| 6006736 | Method and apparatus for washing silicon ingot with water to remove particulate matter A method and apparatus for washing a sliced silicon ingot reduces the consumption of detergent used to clean the ingot after it is sliced to define individual semiconductor wafers. The ingot is taken as a unit mounted to a holder after slicing to a pre-wa... | 12/28/1999 |
| 5993292 | Production of notchless wafer A shallow notch 1 as a tentative mark is engraved on a periphery of an ingot at a position corresponding to a predetermined crystal orientation in the step of grinding the periphery of the ingot. After the ingot is sliced to wafers, a mark 2 for indicatio... | 11/30/1999 |
| 5944007 | Wire type slicing machine and method Two grooved rolls 11 and 12 among three grooved rolls 11~13 engaged by a saw wire 14 are arranged one above the other and the saw wire 14 is made to travel vertically between the grooved rolls 11 and 12. A workpiece 9 is moved horizontally and pushed agai... | 08/31/1999 |
| 5927263 | Method for manufacturing completely circular semiconductor wafers In a method for manufacturing completely circular wafers, a specified crystal orientation of a cylindrical semiconductor crystal member is detected, and a support is mounted on the semiconductor crystal member in accordance with the detected specified cry... | 07/27/1999 |
| 5902171 | Method and apparatus for slicing a work An apparatus for slicing a work includes: a blade member rotating device which rotates a blade member having an internal circular cutting edge; a radial moving device which produces a relative movement between the blade member and a work in a radial direc... | 05/11/1999 |
| 5836808 | Slicing machine with built-in grinder The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distan... | 11/17/1998 |
| 5832914 | Ingot trimming method and apparatus An apparatus for cutting a semiconductor ingot utilizing an inner-diameter saw. The apparatus includes a reference structure positioned on the saw at a predetermined distance from the saw blade and a template having a cut positioning portion and a referen... | 11/10/1998 |
| 5827113 | Cutting machine A cutting machine includes: groove rollers having guide grooves; wires tensioned by the guide grooves and contacted with a work piece to be cut; and a tank filled with a working fluid and positioned under the wires.... | 10/27/1998 |
| 5681204 | Device for detecting a displacement of a blade member of a slicing apparatus A detecting device for use in a slicing apparatus which includes a blade member having an internal cutting edge in the form of a circle, a rotating driver for rotating the blade member about a center of the circle of the internal cutting edge, and a radia... | 10/28/1997 |
| 5667423 | Method and apparatus for slicing workpiece Disclosed are an improved method and apparatus for slicing a workpiece such as a semiconductor ingot, in which coolant nozzles are disposed near the cutting edge of an annular blade, air nozzles are respectively equipped near the both side surfaces, the a... | 09/16/1997 |
| 5642159 | Method for tensioning ID saw blades and an apparatus for monitoring tensioning of an ID saw blades We disclose: (1) a method for tensioning an ID saw blade, which comprises observing position of the cutting edge of the ID saw blade by using a CCD camera, exhibiting the observed position of the cutting edge of the ID saw blade on a display, adjusting te... | 06/24/1997 |
| 5632666 | Method and apparatus for automated quality control in wafer slicing An internal diameter saw, and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot of source material. The internal diameter saw has a controller which monitors the deflecti... | 05/27/1997 |
| 5628673 | Dicing machine with non-contact setup function A dicing machine comprises a work table having a surface for supporting a workpiece and a processing element for processing the workpiece. A gap detection device detects a preselected gap between the processing element and the surface of the work table. A... | 05/13/1997 |
| 5582536 | Apparatus and method for manufacturing wafer It is an object of the present invention to provide an apparatus and a method for manufacturing a wafer, which are the most suitable for meeting the requirement for the mirror grinding surface of the wafer's chamfering portion. As a result, when the ingot... | 12/10/1996 |
| 5524604 | Method and apparatus for slicing semiconductor wafers A method and apparatus for slicing semiconductor wafers. An inner peripheral cutting edge has a doughnut-shaped blade with electro-deposited diamond grains. The blade is attached to a moving trestle. The moving trestle moves along rails located on both si... | 06/11/1996 |
| 5484326 | Semiconductor ingot machining method The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, ... | 01/16/1996 |
| 5458526 | Method of slicing a semiconductor wafer and an apparatus The present invention aims at proposing a method of slicing a semiconductor wafer and an apparatus therefor which can manufacture a bowl-shaped wafer. When the blade displacement is detected with the sensor 32, the displacement value of the blade 14 to th... | 10/17/1995 |
| 5427644 | Method of manufacturing semiconductor wafer and system therefor An ingot is conveyed to a slicing machine by an ingot loader. Then, the ingot is cut into a wafer by the slicing machine. And, the cut wafer is conveyed to a peel-off portion and soaked in a warm water tank for a predetermined time so that the adhesive of... | 06/27/1995 |
| 5405285 | Machining error correction apparatus The diameter, the orientation flat width/notch depth and the length of the block 10p are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors ƊDp, ƊWp and ƊLp in the measured values against the set values are ca... | 04/11/1995 |
| 5383444 | Slicing machine The slicing machine of the present invention comprises a center blade-position detecting sensor arranged opposite a cutting area of an annular blade with a partially cut slice disposed between the center sensor and the cutting area of the blade. Two side ... | 01/24/1995 |
| 5351444 | Blade track control system The blade track control system employs a pair of bearing pads and a pair of sensors. Each bearing pad is provided with a supply of compressed air of constant pressure to provide an aerodynamic bearing surface film against a rotating saw blade. Each bearin... | 10/04/1994 |
| 5351446 | Method and apparatus for the rotary sawing of brittle and hard materials Ingot-type semiconductor single crystals having diameters of more than 200 m can be sawed into thin wafers using an annular saw if the crystal is fed towards the cutting edge of the annular saw while rotating around its longitudinal axis. The method includ... | 10/04/1994 |
