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| Number | Title | Issue Date |
| 8171879 | Maintenance system, substrate processing apparatus, remote operation unit and communication method A substrate processing apparatus having various types of elements including a substrate carrier member for performing a substrate processing; and a control section in which a remote operation information transmitted from a remote control unit in a remote place throu... | 05/08/2012 |
| 8122850 | Method and apparatus for processing polysilazane film A method of processing a polysilazane film includes a first heat process and a subsequent second heat process performed on a target substrate with a polysilazane coating film formed thereon. The first heat process is performed by supplying water vapor into a process... | 02/28/2012 |
| 8015940 | Coater/developer, method of coating and developing resist film, and computer readable storing medium A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transf... | 09/13/2011 |
| 7938080 | Method for using film formation apparatus In a method for using a film formation apparatus for a semiconductor process, process conditions of a film formation process are determined. The process conditions include a preset film thickness of a thin film to be formed on a target substrate. Further, a timing o... | 05/10/2011 |
| 7926445 | Oxidizing method and oxidizing unit for object to be processed An oxidizing method for an object to be processed according to the present invention includes: an arranging step of arranging a plurality of objects to be processed in a processing container whose inside can be vacuumed, the processing container having a predetermin... | 04/19/2011 |
| 7921802 | System and method for suppression of wafer temperature drift in cold-wall CVD systems An apparatus and corresponding method are disclosed that uses one or more optical fibers in a susceptor that monitor radiation emitted by the backside of the susceptor. The optical fibers are filtered and converted into an electrical signal. A control system is used... | 04/12/2011 |
| 7895969 | Method and apparatus for forming outer electrode of electronic component A method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat boa... | 03/01/2011 |
| 7779782 | Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plati... | 08/24/2010 |
| 7431584 | Heat processing apparatus and heat processing method A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces ... | 10/07/2008 |
| 7422768 | Film forming method, film forming apparatus, method of manufacturing device, and apparatus for manufacturing device The invention provides a film forming method that improves throughput in a preliminary discharge. The film forming method according to the present invention can include a preliminary discharge step of preliminarily discharging liquid droplets from a head and a liqui... | 09/09/2008 |
| 7410541 | Roll coater assembly system A roll coater assembly system for application of a fluid material having a transport system with a part loading system, an application system, and a curing system for curing the material applied. The transport system is a continuous conveyor having a plurality of wo... | 08/12/2008 |
| 7399364 | Hermetic cap layers formed on low-κ films by plasma enhanced chemical vapor deposition A method of forming a cap layer over a dielecrtic layer on a substrate including forming a plasma from a process gas including oxygen and tetraethoxysilane, and depositing the cap layer on the dielectric layer, where the cap layer comprises a thickness of about 600 ... | 07/15/2008 |
| 7390365 | Developing method, substrate treating method, and substrate treating apparatus A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissol... | 06/24/2008 |
| 7387684 | Single-dose spray system for application of liquids onto the human body A spray device for coating a surface of a human body with a spray liquid, the spray device including at least one nozzle and at least one liquid container, wherein the at least one liquid container is adapted to hold a volume of spray liquid substantially equal to a... | 06/17/2008 |
| 7364376 | Substrate processing apparatus After an exposure process in an exposure part, the exposure part transmits an exposure completion signal to a main controller. At time (t12) which is a predetermined time interval (T12) later than an exposure completion time (t11), the main controller transmits a su... | 04/29/2008 |
| 7353379 | Methods for configuring a plasma cluster tool A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generat... | 04/01/2008 |
| 7347900 | Chemical vapor deposition apparatus and method A chemical vapor deposition (CVD) apparatus includes a process chamber where a deposition process is performed on a wafer. A gas supply assembly is mounted in the process chamber for supplying a process gas to the process chamber, and a vacuum pump is mounted in the... | 03/25/2008 |
| 7341629 | Method, system and apparatus for scraping a roll surface in a molten metal coating process An apparatus for scraping the surface of a sink roll in a molten metal coating process comprises a support member having a pair of linearly movable arms supported thereon. The support member depends from a bridge structure spanning a continuous metal coating line, a... | 03/11/2008 |
| 7339690 | Identification card printer with client/server An identification card printer for printing an image on an identification card, is provided which includes a print mechanism adapted to deposit material on to the card. A network adapter is configured to couple to a network. A print drive module controls the print m... | 03/04/2008 |
| 7335266 | Method of forming a controlled and uniform lightly phosphorous doped silicon film Method of forming a lightly phosphorous doped silicon film. A substrate is provided. A process gas comprising a phosphorous source gas and a disilane gas is used to form a lightly phosphorous doped silicon film on the substrate. The diluted phosphorous source gas ha... | 02/26/2008 |
| 7335277 | Vacuum processing apparatus A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and a mass flow con... | 02/26/2008 |
| 7309395 | System for forming composite polymer dielectric film A system for depositing a composite polymer dielectric film on a substrate is disclosed, wherein the composite polymer dielectric film includes a low dielectric constant polymer layer disposed between a first silane-containing layer and a second silane-containing la... | 12/18/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7297211 | Single-dose spray system for application of liquids onto the human body A spray device for coating a surface of a human body with a spray liquid, the spray device including at least one nozzle and at least one liquid container, wherein the at least one liquid container adapted to hold a volume of spray liquid substantially equal to an a... | 11/20/2007 |
| 7294205 | Method for reducing the intrinsic stress of high density plasma films A layer of reduced stress is formed on a substrate using an HDP-CVD system by delaying or interrupting the application of capacitively coupled RF energy. The layer is formed by introducing a process gas into the HDP system chamber and forming a plasma from the proce... | 11/13/2007 |
| 7290146 | Managed credential issuance In a method of issuing a credential, a request for issuance of the credential is received. Next, a unique identification for the requested credential is assigned and data elements corresponding to the credential are provided. A credential production data collection ... | 10/30/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7279046 | Method and apparatus for aligning patterns on a substrate A system and method for aligning prior patterning positions formed by a first SPM tip with a second SPM tip in combination with an SPM system includes identifying first location information that includes a location of the first SPM tip and a sample reference locatio... | 10/09/2007 |
| 7271940 | Deposition of photosensitive media for digital hologram recording Hologram production devices can include holographic recording material deposition systems to deposit holographic recording material as needed by the hologram production device. Various nozzles, ink jets, and similar devices can be used to deposit one or more compone... | 09/18/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7258894 | Apparatus and method for dispensing liquid crystal material A liquid crystal material dispensing apparatus includes a spacer height measuring unit for measuring a height of a spacer on a substrate, and a liquid crystal material dispensing system for determining an amount of the liquid crystal material to be dispensed on the ... | 08/21/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7237485 | Print supply monitoring An identification card printer includes a card input, a card transport, a printhead, and a card output. The card transport is configured to feed a card from the card input along a print path. The printhead is positioned below the print path and is configured to prin... | 07/03/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7217336 | Directed gas injection apparatus for semiconductor processing A method and system (1) for utilizing shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system (20) as part of a plasma process system. By utilizing the shaped orifices, directionality of gas flow (25) ca... | 05/15/2007 |
| 7205224 | Very low dielectric constant plasma-enhanced CVD films The present invention provides a method for depositing nano-porous low dielectric constant films by reacting an oxidizable silicon containing compound or mixture comprising an oxidizable silicon component and an oxidizable non-silicon component having thermally liab... | 04/17/2007 |
| 7205240 | HDP-CVD multistep gapfill process A gapfill process is provided using cycling of HDP-CVD deposition, etching, and deposition step. The fluent gas during the first deposition step includes an inert gas such as He, but includes H2 during the remainder deposition step. The higher average mol... | 04/17/2007 |
| 7203565 | Temperature abnormality detection method and semiconductor manufacturing apparatus A semiconductor manufacturing apparatus includes: a hot plate that heats an article to be processed; a temperature control section that controls temperature of the hot plate; a main body control section that controls the entirety of the apparatus based on a process ... | 04/10/2007 |
| 7198676 | Device manufacturing apparatus and method, and driving method for device manufacturing apparatus The present invention provides a device manufacturing apparatus in which a device can be precisely manufactured by stably ejecting a predetermined amount of droplets when the device is manufactured using a droplet ejecting device. The apparatus can include a pressur... | 04/03/2007 |
| 7192486 | Clog-resistant gas delivery system Processing gases reactive with each other are provided in parallel to a processing chamber through separate delivery lines including mass flow controllers devoted to each line. The parallel delivery lines meet in a mixing manifold located proximate to the processing... | 03/20/2007 |
