Bizarre Patents
Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7757627 | Automatic coating device An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer... | 07/20/2010 |
| 7712432 | Printing apparatus and method for bonding material In printing of a bonding material in which a board is supported from a component mounting-side surface on which a plurality of components are mounted, and a bonding material is printed on a working-side surface which is a surface opposed to the component mounting-si... | 05/11/2010 |
| 7550044 | Hard mask structure for patterning of materials Techniques for magnetic device fabrication are provided. In one aspect, a method of patterning at least one, e.g., nonvolatile, material comprises the following steps. A hard mask structure is formed on at least one surface of the material to be patterned. The hard ... | 06/23/2009 |
| 7412923 | Stencil device for accurately applying solder paste to a printed circuit board A stencil device ensures that solder paste is accurately applied to a printed circuit board to create a substantially zero signal degradation solder bridge electrical connection. The printed circuit board is defined by a dielectric structure core having a first surf... | 08/19/2008 |
| 7329111 | Method and device for flowing a liquid on a surface A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liqui... | 02/12/2008 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7185419 | Method of manufacturing a mask for evaporation A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predet... | 03/06/2007 |
| 7134390 | Method and stencil for extruding material on a substrate A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded t... | 11/14/2006 |
| 7134389 | Screen printing apparatus An efficiency is further improved in comparison with a conventional manual operation by automatically applying a material to a film-like body by a machine. A film-like body is delivered from a supply apparatus and is taken up by a take-up apparatus. A material is ap... | 11/14/2006 |
| 7121647 | Method of applying an encapsulant material to an ink jet printhead A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includ... | 10/17/2006 |
| 7121199 | Method and apparatus for supporting and clamping a substrate A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support... | 10/17/2006 |
| 7093746 | Coated stencil with reduced surface tension A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than... | 08/22/2006 |
| 7077908 | Substrate holder In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circui... | 07/18/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6997107 | Paste container for screen printing and screen printing apparatus A cream solder cartridge used in a screen printing apparatus which prints cream solder on a board through pattern holes by sliding, on a mask plate, a closed squeegee that is stored with cream solder inside is composed of a long and narrow concave portion made of a ... | 02/14/2006 |
| 6995321 | Etched hole-fill stand-off An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the st... | 02/07/2006 |
| 6962248 | Printed circuit board support A printed circuit board conveying and processing system. In accordance with the present invention, a printed circuit board conveying system is provided comprising a pair of conveyor rails and a printed circuit board support. The conveyor rails are positioned to enga... | 11/08/2005 |
| 6962111 | Screen-printing plate, manufacturing method of laminated-ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are pro... | 11/08/2005 |
| 6938227 | System and method for modifying electronic design data Customer data relating to the location and character of features (e.g., conductive pads to which electronic parts are soldered on a printed circuit board) are stored in a digital form (e.g., as “Gerber data”). A library of footprints that characterize the featur... | 08/30/2005 |
| 6921550 | Etch resist using printer technology The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate ... | 07/26/2005 |
| 6921505 | Hole filling using an etched hole-fill stand-off An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the st... | 07/26/2005 |
| 6881265 | Grease rework applicator A grease applicator is assembled from three parts, a base unit, a cap unit and a slider unit. The base unit has tenons that couple with corresponding slots in the cap unit to form a cavity with a window opening on a first surface and a slider opening on a second sur... | 04/19/2005 |
| 6820544 | Screen printing apparatus and method of screen printing Cream solder stored in a squeegee head is pressurized by a pressurizing plate, and the squeegee head is slid on a mask plate, so that the cream solder is printed onto a substrate via pattern apertures. This is done by a screen printing apparatus, in which pressurize... | 11/23/2004 |
| 6814804 | Apparatus and method for printing solder paste A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is sc... | 11/09/2004 |
| 6802250 | Stencil design for solder paste printing A stencil design for solder paste printing, or other metal stencil printing, is disclosed. A stencil for stencil printing of solder onto a semiconductor wafer for semiconductor wafer bumping includes a substrate. The substrate has a hole defined therein substantiall... | 10/12/2004 |
| 6739498 | Solder ball attachment system A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto ... | 05/25/2004 |
| 6708873 | Apparatus and method for filling high aspect ratio via holes in electronic substrates An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction w... | 03/23/2004 |
| 6698347 | Screen printing apparatus and method of screen printing Cream solder stored in a squeegee head is pressurized by a pressurizing plate, and the squeegee head is slid on a mask plate, so that the cream solder is printed onto a substrate via pattern apertures. This is done by a screen printing apparatus, in which... | 03/02/2004 |
| 6682778 | Stencil to pad method for applying a coating to a part An apparatus and method is disclosed for applying a coating of material to a predefined area on a surface of a part. A movable stencil is provided having a wall or surface with a predefined aperture corresponding to a pattern of the defined area to be coa... | 01/27/2004 |
| 6663712 | Dual track stenciling system with solder gathering head A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. A stencil, having two ... | 12/16/2003 |
| 6656274 | Device for the dosing and distribution of hotmelt A device for dosing and distribution of hotmelt on a substrate is provided. The device includes substrate throughput, hotmelt supply, at least one hotmelt application position with a stencil, hotmelt distribution and a squeegee device. The hotmelt distrib... | 12/02/2003 |
| 6607599 | Apparatus for improving stencil/screen print quality A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip... | 08/19/2003 |
| 6554901 | Rotary machine for decorating tiles The machine comprises: a mobile rest plane for tiles on which the tiles transit in a predetermined advancement direction; a decorating apparatus which comprises a plurality of cylinders, located above the mobile rest plane; means for setting the plurality... | 04/29/2003 |
| 6461136 | Apparatus for filling high aspect ratio via holes in electronic substrates An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in co... | 10/08/2002 |
| 6450091 | Mini-stencil and device for using same A stencil (8) with a tension part combined with an operational device allowing deposition of solder paste to replace constituents on an electronic board. The stencil consists of a flat sheet (1), of rectangular shape, made of synthetic flexible material o... | 09/17/2002 |
| 6387181 | Coating device for coating solder resist on both sides of a printed circuit board An application device for applying at least a solder resist onto both surfaces of a printed circuit board that are in particular provided with structurized printed conductors comprises at least two application bodies that can be assigned to the correspond... | 05/14/2002 |
| 6374729 | Apparatus for transporting circuit boards in a screen printer A method and apparatus is provided for transporting circuit boards in a screen printer. In embodiments of the present invention, a transportation system is provided for a printer that prints material on a substrate. The transportation system has the abili... | 04/23/2002 |
| 6363847 | Method of applying adhesive material to parts mounted circuit board The invention greatly improves an efficiency of a whole of aparts mounting process. In a method of applying an adhesive material to a parts mounted circuit board, a recess portion surrounding a part of a circuit board in which the parts are already mounte... | 04/02/2002 |
| 6355103 | Coating mask device for lighting device A coating mask device for a lighting device in which a mask body is divided into a plurality of sections so that the mask body can be easily handled. The coating mask device for a lighting device includes a support jig 10, on which a component part 14 of ... | 03/12/2002 |
| 6352026 | Screen printing apparatus for printing layers having different thicknesses A screen printing apparatus for applying a printing agent in different thicknesses to a plate. A mask of the apparatus has a width corresponding to or matching the widths of two plates to be printed. A first portion of the mask, for applying a first print... | 03/05/2002 |
