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| Number | Title | Issue Date |
| 7988774 | Electroless deposition of cobalt alloys Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster ... | 08/02/2011 |
| 7794530 | Electroless deposition of cobalt alloys Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster ... | 09/14/2010 |
| 7361262 | Acid plating bath and method for the electrolytic deposition of satin nickel deposits The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quarternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compare... | 04/22/2008 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing... | 02/19/2008 |
| 7300563 | Use of N-alllyl substituted amines and their salts as brightening agents in nickel plating baths An aqueous acidic plating bath for the electrodeposition of a nickel or nickel alloy deposit. The bath includes nickel ions and an additive having the general formula: H2C═CHCH2NR1R2 or [H2... | 11/27/2007 |
| 7267889 | Sprayable composition The present invention provides a sprayable composition comprising a ceramic particulate including albite, illite, and quart, and a metallic composition, including nickel, chromium, iron, and silicon. The sprayable composition may be a composite particle, a blend, or... | 09/11/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexin... | 08/30/2005 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing a... | 06/28/2005 |
| 6911269 | Lead-free chemical nickel alloy Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith. ... | 06/28/2005 |
| 6911068 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 06/28/2005 |
| 6902605 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical ch... | 06/07/2005 |
| 6860925 | Printed circuit board manufacture A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an imm... | 03/01/2005 |
| 6858122 | Nickel electroplating solution Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least ... | 02/22/2005 |
| 6852211 | Nickel electroplating solution Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least ... | 02/08/2005 |
| 6837923 | Polytetrafluoroethylene dispersion for electroless nickel plating applications A low viscosity silicone glycol surfactant together with glycerin is added to a polytetrafluoroethylene dispersion for use with an electroless nickel plating bath. The improved plating bath produces a stable PTFE dispersion that continues to work as the plating bath... | 01/04/2005 |
| 6824597 | Stabilizers for electroless plating solutions and methods of use thereof Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition. ... | 11/30/2004 |
| 6821324 | Cobalt tungsten phosphorus electroless deposition process and materials Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten. Electolessly deposited metals produced are substantially devoi... | 11/23/2004 |
| 6800121 | Electroless nickel plating solutions This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous... | 10/05/2004 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6730209 | Solder electroplating bath including brighteners having reduced volatility In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied... | 05/04/2004 |
| 6689199 | Apparatus and method for introducing small amounts of refractory elements into a vapor deposition coating A method of introducing small amounts of a refractory element into a vapor deposition coating. A second material (30), containing at least two elements which are desired to be deposited as a coating on a base material, has placed over it a first material ... | 02/10/2004 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6436479 | Solution for forming nickel metal thin film and method of forming nickel metal thin film using the said solution Disclosed is a method of forming a nickel metal thin film, comprising the steps of coating a substrate with a solution for forming a nickel metal thin film, the solution being formed of an alcohol solution containing nickel ions and a reducible chelate ty... | 08/20/2002 |
| 6406611 | Nickel cobalt phosphorous low stress electroplating An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous. The process solutions contains nickel and optionally cobalt sulfate, hypophosphorous... | 06/18/2002 |
| 6319308 | Coating compositions containing nickel and boron and particles The invention is directed to corrosion and wear resistant metallic coatings containing nickel, boron, particles. The coatings are preferably deposited on catalytically active substrates from an electroless coating bath containing nickel ions, a stabilizer... | 11/20/2001 |
| 6303231 | Coating solutions for use in forming bismuth-based ferroelectric thin films, and ferroelectric memories formed with said coating solutions, as well as processes for production thereof The invention discloses a coating solution for use in forming Bi-based ferroelectric thin films containing Bi, metallic element A (at least one selected from the group consisting of Bi. Pb, Ba, Sr, Ca, Na, K and rare earth elements) and metallic element B... | 10/16/2001 |
| 6290088 | Corrosion resistant gas cylinder and gas delivery system A corrosion resistant gas cylinder and gas delivery system includes an electroless nickel-phosphorous layer overlying the inner surface of a steel alloy cylinder. The nickel-phosphorous layer has a thickness of at least about 20 micrometers and a porosity... | 09/18/2001 |
| 6284123 | Electroplating formulation and process for plating iron onto aluminum/aluminum alloys An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electroplating bath includi... | 09/04/2001 |
| 6273943 | Electroless composite Plating Solution and Electroless composite plating method An electroless composite plating solution comprising metal ions, a complexing agent for said metal ions, a hypophosphite serving as a reducing agent, a surface active agent, and a water-insoluble composite material, said surface active agent comprising a ... | 08/14/2001 |
| 6262129 | Method for producing nanoparticles of transition metals A method of forming nanoparticles includes steps of forming a metal precursor solution from a transition metal, injecting the metal precursor solution to the surfactant solution, adding a flocculent to cause nanoparticles to precipitate out of solution wi... | 07/17/2001 |
| 6197366 | Metal paste and production process of metal film According to the present invention, a metal paste comprising an organo- or inorganometallic compound of a metal that is a solid at ordinary temperature and belongs to group 3 through 15 of the periodic table, and an amino compound as medium, and which exh... | 03/06/2001 |
| 6183546 | Coating compositions containing nickel and boron The invention is directed to corrosion and wear resistant metallic coatings containing nickel, boron, and thallium. The coatings are preferably deposited on catalytically active substrates from an electroless coating bath containing nickel ions, a mixture... | 02/06/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6179985 | Metal alloy fluoroborate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider use... | 01/30/2001 |
| 6143059 | Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate Disclosed are a self-catalytic bath and a method for the deposition of Ni-P alloy on a substrate. The bath comprises nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer and traces of lead as a stabilizer. It also includes a c... | 11/07/2000 |
| 6099624 | Nickel-phosphorus alloy coatings Nickel phosphorus alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonate and phosphorus acid.... | 08/08/2000 |
| 5989460 | Electrically conductive coating An electrically conductive floor coating comprising a ferroalloy containing layer including particles of ferroalloy interspersed with a resinous binder.... | 11/23/1999 |
