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| Number | Title | Issue Date |
| 7767009 | Solution and process for improving the solderability of a metal surface The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles... | 08/03/2010 |
| 7531031 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 05/12/2009 |
| 7419536 | Electroless gold plating liquid There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-solubl... | 09/02/2008 |
| 7402232 | Silver electroplating solution A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or... | 07/22/2008 |
| 7396394 | Electroless gold plating solution The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide wat... | 07/08/2008 |
| 7390354 | Electroless gold plating solution A cyanide-free immersion type electroless gold plating solution that is less toxic can be used at near neutrality and gives an excellent and improved solder adhesion and plated film adhesion is provided. The electroless gold plating solution contains a cyanid... | 06/24/2008 |
| 7384458 | Non-cyanide electroless gold plating solution and process for electroless gold plating The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electrol... | 06/10/2008 |
| 7371880 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 05/13/2008 |
| 7323581 | Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or more monodentate or multidentate organic ligands, and complexed with o... | 01/29/2008 |
| 7323220 | Gas phase growth system, method of operating the system, and vaporizer for the system A method of operating a gas phase growth system is disclosed. The method includes a processing stage and a stabilizer feeding stage. In a non-limiting embodiment of the disclosure, an organometallic complex is vaporized by a vaporizer, and subsequently fed to a reac... | 01/29/2008 |
| 7306662 | Plating solution for electroless deposition of copper An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electrol... | 12/11/2007 |
| 7300501 | Electroless gold plating liquid The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold s... | 11/27/2007 |
| 7297190 | Plating solutions for electroless deposition of copper An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substanc... | 11/20/2007 |
| 7282088 | Method for copper-plating or bronze-plating an object and liquid mixtures therefor The invention relates to an aqueous concentrate which is stable with respect to freezing and defrosting and which contains at least one water-soluble or water-dispersible copper compound and, optionally, also a water-soluble or water-dispersible tin compound for use... | 10/16/2007 |
| 7273832 | Alkali metal tungstate compositions and uses thereof Fluids, such as completion fluids, containing at least one alkali metal tungstate and optionally at least one chelating agent are described. Methods of removing a filter cake from a well bore surface, which may include one or more alkaline earth metal sulfates, is a... | 09/25/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7241912 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 07/10/2007 |
| 7220347 | Electrolytic copper plating bath and plating process therewith An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary p... | 05/22/2007 |
| 7220296 | Electroless plating baths for high aspect features An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a catalyst reducing agent having an initial concentration of 0.02 to 1.... | 05/22/2007 |
| 7169216 | Electroless copper plating solution, electroless copper plating process and production process of circuit board An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating re... | 01/30/2007 |
| 7169215 | Copper molybdenum electroless deposition process and materials Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a solu... | 01/30/2007 |
| 7166732 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 01/23/2007 |
| 7160384 | Amine-containing cement processing additives An exemplary method of the invention comprises introducing into a grinding mill, wherein cement clinker is ground to provide cement powder, a diamine such as tetrahydroxylethylethylene diamine, and an alkanolamine such as triethanolamine or triisopropanolamine. The ... | 01/09/2007 |
| 7150781 | Pyrophosphoric acid bath for use in copper-tin alloy plating The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound b... | 12/19/2006 |
| 7147767 | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions. | 12/12/2006 |
| 7144491 | Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode ... | 12/05/2006 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7087710 | Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups A fluorine containing polymer which acts as a wetting, flow or leveling agent, and has at least one polar group. The polymer has at least one pendant or ether side chain containing from about 1 to about 20 carbon atoms with at least 25% of the hydrogen atoms being r... | 08/08/2006 |
| 7084288 | Organometallic precursor for forming metal film or pattern and method of forming metal film or pattern using the same The object of this invention is to provide an organometallic precursor for forming a metal film or pattern and a method of forming the metal film or pattern using the same. More particularly, the present invention provides an organometallic precursor containing a hy... | 08/01/2006 |
| 7074315 | Copper bath and methods of depositing a matt copper coating In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to depo... | 07/11/2006 |
| 7022169 | Electroless gold plating solution An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite a... | 04/04/2006 |
| 7011697 | Electroless gold plating solution An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper c... | 03/14/2006 |
| 7005055 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In parti... | 02/28/2006 |
| 6998036 | Electrolyte and method for depositing tin-silver alloy layers The invention relates to an acidic electrolyte used for depositing tin-silver alloys. The acidic electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin (II) salts, one or more soluble silver (I) salts and one or m... | 02/14/2006 |
| 6991675 | Electroless displacement gold plating solution and additive for use in preparing plating solution An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement go... | 01/31/2006 |
| 6951666 | Precursor compositions for the deposition of electrically conductive features A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composit... | 10/04/2005 |
