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Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 8298325 | Electroless deposition from non-aqueous solutions A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided. ... | 10/30/2012 |
| 8197583 | Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for ... | 06/12/2012 |
| 7988773 | Electroless gold plating bath, electroless gold plating method and electronic parts An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H... | 08/02/2011 |
| 7985285 | Electroless gold plating bath, electroless gold plating method and electronic parts An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C | 07/26/2011 |
| 7691189 | Printed wiring board and its manufacturing method The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constr... | 04/06/2010 |
| 7686875 | Electroless deposition from non-aqueous solutions A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided. ... | 03/30/2010 |
| 7611569 | Electroless copper compositions Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates. ... | 11/03/2009 |
| 7534289 | Electroless gold plating solution An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like. ... | 05/19/2009 |
| 7527681 | Electroless copper and redox couples Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates. ... | 05/05/2009 |
| 7501014 | Formaldehyde free electroless copper compositions Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ... | 03/10/2009 |
| 7473307 | Electroless copper plating solution, method of producing the same and electroless copper plating method Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5... | 01/06/2009 |
| 7419536 | Electroless gold plating liquid There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-solubl... | 09/02/2008 |
| 7396394 | Electroless gold plating solution The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide wat... | 07/08/2008 |
| 7390354 | Electroless gold plating solution A cyanide-free immersion type electroless gold plating solution that is less toxic can be used at near neutrality and gives an excellent and improved solder adhesion and plated film adhesion is provided. The electroless gold plating solution contains a cyanid... | 06/24/2008 |
| 7384458 | Non-cyanide electroless gold plating solution and process for electroless gold plating The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electrol... | 06/10/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7315068 | Interface layer for the fabrication of electronic devices The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably pr... | 01/01/2008 |
| 7306662 | Plating solution for electroless deposition of copper An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electrol... | 12/11/2007 |
| 7300501 | Electroless gold plating liquid The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold s... | 11/27/2007 |
| 7297190 | Plating solutions for electroless deposition of copper An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substanc... | 11/20/2007 |
| 7282088 | Method for copper-plating or bronze-plating an object and liquid mixtures therefor The invention relates to an aqueous concentrate which is stable with respect to freezing and defrosting and which contains at least one water-soluble or water-dispersible copper compound and, optionally, also a water-soluble or water-dispersible tin compound for use... | 10/16/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7259100 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7259101 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7230188 | Printed wiring board and its manufacturing method The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be c... | 06/12/2007 |
| 7220296 | Electroless plating baths for high aspect features An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a catalyst reducing agent having an initial concentration of 0.02 to 1.... | 05/22/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7189341 | Electrochemical sensor ink compositions, electrodes, and uses thereof The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes.... | 03/13/2007 |
| 7169215 | Copper molybdenum electroless deposition process and materials Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a solu... | 01/30/2007 |
| 7169216 | Electroless copper plating solution, electroless copper plating process and production process of circuit board An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating re... | 01/30/2007 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 10/31/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7122108 | Tin-silver electrolyte A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate. ... | 10/17/2006 |
| 7115218 | Low temperature method and composition for producing electrical conductors A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive elect... | 10/03/2006 |
