Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8328919 | Electroless deposition solutions and process control One embodiment of the present invention is a method of electroless deposition of cap layers for fabricating an integrated circuit. The method includes controlling the composition of an electroless deposition bath so as to substantially maintain the electroless depos... | 12/11/2012 |
| 8317909 | Compositions and processes for deposition of metal ions onto surfaces of conductive substrates The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form n... | 11/27/2012 |
| 8292993 | Electroless nickel plating bath and method for electroless nickel plating Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at ... | 10/23/2012 |
| 8182594 | Electroless nickel plating liquid An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing... | 05/22/2012 |
| 8147601 | Composite electroless plating This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essential... | 04/03/2012 |
| 8137447 | Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for ... | 03/20/2012 |
| 8012251 | Electroless plating bath and method for producing high-temperature apparatus member using the bath There is provided an electroless plating bath which makes it possible to form a diffusion barrier layer of a Re-based alloy, having a uniform thickness regardless of the shape and size of a workpiece, on the surface of a Ni-based alloy by a relatively simple method.... | 09/06/2011 |
| 7875110 | Electroless plating bath composition and method of use An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit coba... | 01/25/2011 |
| 7850770 | Compositions for the currentless deposition of ternary materials for use in the semiconductor industry The present invention relates to the use of ternary nickel-containing metal alloys of the NiMR type (where M=Mo, W, Re or Cr, and R=B or P) deposited by an electroless process in semiconductor technology. In particular, the present invention relates to the use of th... | 12/14/2010 |
| 7780772 | Electroless deposition chemical system limiting strongly adsorbed species An electroless deposition chemical system includes an electroless solution including a metal component, and a strongly adsorbed species component having a concentration less than a concentration of the metal component. ... | 08/24/2010 |
| 7758681 | Cobalt-based alloy electroless plating solution and electroless plating method using the same A cobalt-based alloy electroless plating solution according to the present invention comprises a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dim... | 07/20/2010 |
| 7744685 | Composite electroless plating This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essential... | 06/29/2010 |
| 7704306 | Manufacture of electroless cobalt deposition compositions for microelectronics applications A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treat... | 04/27/2010 |
| 7686874 | Electroless plating bath composition and method of use An electroless plating composition comprising succinic acid, potassium carbonate, a source of cobalt metal ions, a reducing agent, and water is provided. An optional buffering agent may also be included in the composition. The composition may be used to deposit coba... | 03/30/2010 |
| 7658790 | Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers An electroless solution for deposition of a cobalt-based alloy on a substrate is provided. The electroless solution may be formed by mixing first and second solutions, with the first and second solutions being prepared from concentrated precursors. In one embodiment... | 02/09/2010 |
| 7655081 | Plating bath and surface treatment compositions for thin film deposition An aqueous substrate surface treatment composition includes cysteine and an acidic solution having a pH of about 7 or less. The composition enables a selective deposition of a metal ion sensitizer and a subsequent selective plating of a metallic cap layer. Various C... | 02/02/2010 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7338586 | Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus An insulated vibration-stirring apparatus comprising a vibration generating means containing a vibration motor and a vibrating member attached to that motor, and a vibrating rod attached by an installation piece to allow vibration linked with the vibration generatin... | 03/04/2008 |
| 7328744 | Methods and compositions for treating subterranean formations with gelled hydrocarbon fluids In one embodiment, a method of treating a subterranean formation is provided comprising the steps of providing a gelled liquid hydrocarbon treatment fluid comprising a liquid hydrocarbon and a gelling agent that comprises a polyvalent metal salt of an organophosphon... | 02/12/2008 |
| 7323581 | Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or more monodentate or multidentate organic ligands, and complexed with o... | 01/29/2008 |
| 7314850 | Methods and compositions for treating subterranean formations with gelled hydrocarbon fluids Improved methods and compositions for treating subterranean formations penetrated by well bores are provided. A method for breaking a gelled hydrocarbon fluid comprised of a hydrocarbon liquid, a ferric iron or aluminum polyvalent metal salt of a phosphonic acid est... | 01/01/2008 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7288021 | Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanic... | 10/30/2007 |
| 7282190 | Silicon layer production method and solar cell production method A solar cell is produced by dipping a multicrystalline silicon substrate 28 in a solution 24 containing silicon, growing a silicon layer on the substrate 28 while decreasing with time the temperature drop rate of the solution during the dipping ... | 10/16/2007 |
| 7273832 | Alkali metal tungstate compositions and uses thereof Fluids, such as completion fluids, containing at least one alkali metal tungstate and optionally at least one chelating agent are described. Methods of removing a filter cake from a well bore surface, which may include one or more alkaline earth metal sulfates, is a... | 09/25/2007 |
| 7235867 | Semiconductor device with electrically biased die edge seal A die seal arrangement and method for making the same negatively biases the die edge seal of a die by connecting the die edge seal to a source of negative electrical potential, with respect to electrical ground. The die edge seal, made of copper, for example, has it... | 06/26/2007 |
| 7204871 | Metal plating process A process for forming a coating on a metal substrate includes contacting the substrate with a molybdate solution having a pH of between 3.5 and 5 inclusive containing an acid with the proviso that the acid is not nitric acid. The substrate is contacted with the solu... | 04/17/2007 |
| 7189341 | Electrochemical sensor ink compositions, electrodes, and uses thereof The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes.... | 03/13/2007 |
| 7172979 | Substrate processing apparatus and method A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held... | 02/06/2007 |
| 7169215 | Copper molybdenum electroless deposition process and materials Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a solu... | 01/30/2007 |
| 7157051 | Sampling management for a process analysis tool to minimize sample usage and decrease sampling time A method and system for analysis of additives in electrolysis plating solutions, using a flow management system that minimizes loss of plating solutions and decreases sampling time. The system includes at least one analysis chamber, a sampling duct connected to proc... | 01/02/2007 |
| 7153449 | Acidic treatment liquid and method of treating copper surfaces The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as a... | 12/26/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7056806 | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure.... | 06/06/2006 |
| 7037559 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 05/02/2006 |
| 7002447 | Fuel tank resistor card having improved corrosion resistance A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The... | 02/21/2006 |
| 6962112 | Entirely combustible inductive primer A pyrotechnical primer for igniting propellant powder for sleeveless ammunition comprises an igniting element (4) and a coil (1). The energy required for triggering is transmitted in an electromagnetic manner (inductively). The inductive primer is cost... | 11/08/2005 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface regi... | 09/13/2005 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexin... | 08/30/2005 |
| 6927176 | Cleaning method and solution for cleaning a wafer in a single wafer process The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), wate... | 08/09/2005 |
