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| Number | Title | Issue Date |
| 7211345 | Membrane electrode assemblies for use in fuel cells Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by ... | 05/01/2007 |
| 7211205 | High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... | 05/01/2007 |
| 7141185 | High conductivity inks with low minimum curing temperatures Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a subs... | 11/28/2006 |
| 7138354 | Method for the fabrication of an electrocatalyst layer Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by ... | 11/21/2006 |
| 7087341 | Metal-air battery components and methods for making same Energy devices such as batteries and methods for fabricating the energy devices. The devices are small, thin and lightweight, yet provide sufficient power for many handheld electronics. ... | 08/08/2006 |
| 7066976 | Method for the production of electrocatalyst powders Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by ... | 06/27/2006 |
| 6967183 | Electrocatalyst powders, methods for producing powders and devices fabricated from same Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by ... | 11/22/2005 |
| 6911412 | Composite particles for electrocatalytic applications Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by ... | 06/28/2005 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6663793 | Sol-gel-based composite materials for direct-write electronics applications The present invention relates to a method for producing a low temperature 0-3 composite material, comprising the steps of providing a mixture, wherein the mixture comprises a liquid phase and a particulate phase and wherein the liquid phase comprises a re... | 12/16/2003 |
| 6558581 | Transparent electro-conductive structure, process for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid A transparent electro-conductive structure comprising a transparent substrate and formed successively thereon a transparent electro-conductive layer and a transparent coat layer, which is used in, e.g., front panels of display devices such as CRTs. The tr... | 05/06/2003 |
| 6524499 | Transparent conductive film and display device The transparent conductive film of the present invention is formed to have a conductive layer containing at least ruthenium fine particles, gold fine particles and silver fine particles, the weight ratio of ruthenium fine particles and gold fine particles... | 02/25/2003 |
| 6508959 | Preparation of energy storage materials A process is provided for the preparation of a metallic oxide composite including mixing an aqueous solution of a water-soluble metal compound and colloidal silica, depositing the mixture upon a substrate, heating the mixture-coated substrates at temperat... | 01/21/2003 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6197222 | Lead free conductive composites for electrical interconnections An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermop... | 03/06/2001 |
| 6103146 | Thick film conductor paste compositions for aluminum nitride substrates The invention relates to thick film conductor paste compositions with which thick film technology can be applied to aluminum nitride substrates and which can form a conductor as a thick film on a substrate by printing or coating and then firing and paste ... | 08/15/2000 |
| 6086790 | Transparent conductive film and composition for forming same The present invention discloses a double-layer structured low-resistance and low-reflectivity transparent conductive film, comprising a lower high-reflectivity conductive layer containing a fine metal powder in a silica-based matrix and a silica-based low... | 07/11/2000 |
| 5985308 | Process for producing anti-microbial effect with complex silver ions Production of an anti-microbial effect in an alcohol or water based electrolyte is achieved by preparing silver materials that form complex ions other than Ag+, Ag2+, or Ag3+, and which produce an anti-microbial effect tha... | 11/16/1999 |
| 5922245 | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the... | 07/13/1999 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5866044 | Lead free conductive composites for electrical interconnections An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermop... | 02/02/1999 |
| 5830389 | Electrically conductive compositions and methods for the preparation and use thereof Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Dep... | 11/03/1998 |
| 5753251 | Anti-microbial coating for medical device Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapor deposition techniques to produce atomic disorder in the coating such that a sustained release of metal... | 05/19/1998 |
| 5698015 | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the... | 12/16/1997 |
| 5581588 | Insulated protective coating doped with a noble metal for mitigation of stress corrosion cracking A method for mitigating crack initiation and propagation on the surface of metal components in a water-cooled nuclear reactor. An electrically insulating coating doped with a noble metal is applied on the surfaces of IGSCC-susceptible reactor components. ... | 12/03/1996 |
| 5250358 | Palladium thick film resistor containing boron nitride An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium pow... | 10/05/1993 |
| 5242623 | Screen-printable thick film paste composition A screen printable thick film paste composition comprising finely divided particles of electrically functional solids dispersed in an organic medium comprising a plurality of solid organic polymers having high and low relaxation rate constants (kr | 09/07/1993 |
| 5167869 | Gold conductor composition for forming conductor patterns on ceramic based substrates A gold conductor composition comprising by weight, basis total inorganic solids, finely divided particles of 75-95% metallic gold at least 90% by weight of which gold particle have an aspect ratio of no greater than 2, 0.5-10% cadmium borosilicate glass, ... | 12/01/1992 |
| 5075262 | Silver-glass pastes An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.... | 12/24/1991 |
| 5062891 | Metallic inks for co-sintering process Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.... | 11/05/1991 |
| 5011530 | Metallizing composition for use with ceramics Metallizing composition for use in ceramics, comprises 100 parts by weight of a CuO-Cu combination consisting of 30-70 wt % CuO and 70-30 wt % Cu, at least one inorganic component selected from not more than 10 parts by weight of MnO2, not more... | 04/30/1991 |
| 5011725 | Substrates with dense metal vias produced as co-sintered and porous back-filled vias Dense metal vias in pure alumina substrates are derived from a metallization composition having 80-97% refractory metal, 2-15% alumina, 0.05-5% sintering aid, and 0-5% bonding additive; it has been found that for alumina contents greater than about 12%, a... | 04/30/1991 |
| 4963187 | Metallizing paste for circuit board having low thermal expansion coefficient Metallizing paste is composed, by weight, of 100 parts of Pt, 0.5 to 5 parts of Ag, 0.1 to 1 part of CuO, and 2 to 10 parts of a low thermal expansion fritt, which may also contain up to 100 parts of Au. Another metallizing paste is composed, by weight, o... | 10/16/1990 |
| 4910072 | Selective catalytic activation of polymeric films Catalytically inert films comprising complexes of polymer with a compound of a Group 1B or Group 8 metal at unusually low proportions of metal can be selectively activated, e.g. to provide a catalytic surface. Such films can be advantageously activatable ... | 03/20/1990 |
| 4904415 | Oxide glasses having low glass transformation temperatures PbO-B2 O3 -Ag2 O glasses having a preferred weight ratio range of 76-88:10-15:2-10 have glass transition temperatures of less than 300° C. and are especially useful for adhering together ceramic substrates such as for att... | 02/27/1990 |
| 4891069 | Composition for the electrolytic coating of circuit boards without an electroless metal coating A process and composition are disclosed for directly electrometallizing a non-conductive substrate such as the non conductive surfaces of a circuit board and to directly effect through hole plating and/or form circuits on the boards without employing an e... | 01/02/1990 |
| 4847003 | Electrical conductors In the fabrication of various hybrid devices, it is the practice to provide thick film conductors of two different compositions, namely, a high palladium content silver-palladium film and an essentially pure silver film. The silver-palladium films are use... | 07/11/1989 |
| 4804410 | Palladium-base electroless plating solution The present invention provides a palladium-base electroless plating solution which is excellent in stability and which is capable of forming a satisfactory palladium-base deposit, the solution being an aqueous solution containing (a) a palladium compound,... | 02/14/1989 |
| 4701218 | Compositions comprising inorganic particles Floccular compositions comprising ultrafine inorganic particles having maximum particle dimensions of from 0.5 to 3000 (preferably 2 to 1500) nm combined with a size-stabilizer which is a lyophobic substance with lyophilic activity on its surface and also... | 10/20/1987 |
| 4695403 | Thick film conductor composition A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorga... | 09/22/1987 |
