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| Number | Title | Issue Date |
| 7267713 | Conductive paste and glass circuit structure Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit hav... | 09/11/2007 |
| 7259101 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7259100 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 08/21/2007 |
| 7221253 | Fusible resistor and method of fabricating the same A fusible resistor and method of fabricating the same is provided. The fusible resistor has a very low resistance of 20 to 470 mΩ. by depositing thin films as a fusible element made of a material with low resistivity such as copper having a temperature coefficient ... | 05/22/2007 |
| 7211205 | High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... | 05/01/2007 |
| 7159756 | Method of soldering and solder compositions The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and conne... | 01/09/2007 |
| 7141185 | High conductivity inks with low minimum curing temperatures Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a subs... | 11/28/2006 |
| 7135061 | Conductive paste and glass circuit structure Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit hav... | 11/14/2006 |
| 7125820 | Non-noble metal catalysts for the oxygen reduction reaction Non-noble metal transition metal catalysts can replace platinum in the oxidation reduction reaction (ORR) used in electrochemical fuel cells. A RuxSe catalyst is prepared with comparable catalytic activity to platinum. An environmentally friendly aqueous ... | 10/24/2006 |
| 7116209 | Strain gauges The present invention provides a strain gauge comprising a resistive layer. The resistive layer comprises metallic or semiconducting nanoparticles or aggregates thereof in which the nanoparticles or aggregates thereof are separated by insulating and/or semiconductin... | 10/03/2006 |
| 7078276 | Nanoparticles and method for making the same A method for making nanoparticles, nanoparticle inks and device layers therefrom is disclosed. In accordance with the present invention, nanoparticles are isolated from a composite material that is formed by treating a metal oxide precursor to form the metal nanopar... | 07/18/2006 |
| 7067173 | Method for manufacturing laminated electronic component Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used a... | 06/27/2006 |
| 7026908 | Extended temperature range thermal variable-resistance device A sensor and method of manufacturing an extended temperature range variable resistance sensor that is cost effective and highly reliable, with stable resistance with an operating range of up to 1700° C. in hostile environments. The sensor is formed of highly stable... | 04/11/2006 |
| 7014979 | Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corros... | 03/21/2006 |
| 6994806 | Conductive paste A conductive paste for defogging heat wires of automobile windows contains a silver powder having particle size in the range of about 0.1 to 20 μm, a molybdenum compound such as molybdenum silicide or molybdenum boride, a glass frit having s softening point of 730... | 02/07/2006 |
| 6979491 | Antimicrobial yarn having nanosilver particles and methods for manufacturing the same The present invention provides a yarn with antimicrobial effects. The antimicrobial antifungal effect of the yarn is derived from nanosilver particles (diameter between 1 and 100 nm) which are adhered to the yarn. The yarn contains fibers which are made of cotton, l... | 12/27/2005 |
| 6979416 | Method of forming an electronic component using ink A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 ... | 12/27/2005 |
| 6951666 | Precursor compositions for the deposition of electrically conductive features A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composit... | 10/04/2005 |
| 6869637 | Bath and method of electroless plating of silver on metal surfaces Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in man... | 03/22/2005 |
| 6787239 | Electrode material, dielectric material and plasma display panel using them A material usable for the electrodes and the dielectric layer plasma display panels and capable of reducing the occurrence of yellowing and a high-image-quality plasma display panel using the material are provided. Using glass powder containing 25 to 50 wt % of Bi | 09/07/2004 |
| 6749775 | Conductive via composition A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof. ... | 06/15/2004 |
| 6736997 | Sol-gel derived resistive and conductive coating A composition for application to a substrate to form a an electrically conductive coating thereon. The composition includes a sol-gel solution filled with a conductive powder. The coating may be conductive or resistive depending on the application. A process is prov... | 05/18/2004 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6689296 | Conductive paste A conductive paste for defogging heat wires of automobile windows contains a silver powder having particle size in the range of about 0.1 to 20 μm, a molybdenum compound such as molybdenum silicide or molybdenum boride, a glass frit having a softening po... | 02/10/2004 |
| 6225392 | Conductive paste A conductive paste comprising conductive powder and low-melting glass frit, wherein the low-melting glass frit constituting the conductive paste crystallizes crystals during firing to increase the resistivity of the conductive paste.... | 05/01/2001 |
| 5985308 | Process for producing anti-microbial effect with complex silver ions Production of an anti-microbial effect in an alcohol or water based electrolyte is achieved by preparing silver materials that form complex ions other than Ag+, Ag2+, or Ag3+, and which produce an anti-microbial effect tha... | 11/16/1999 |
| 5972485 | Electroconductive composition for glass substrate and anti-fog window glass for automobiles Disclosed herein is an electroconductive composition for a glass substrate and an anti-fog window glass for automobiles making use of the composition. The electroconductive composition of the present invention can be fired at low temperature, and forms a ... | 10/26/1999 |
| 5928571 | Thick film compositions for making medical electrodes The invention is directed to a conductive composition for iontophoretic electrodes comprising, based on solids: (a) 20-90% wt finely divided particles of silver, carbon, graphite and mixtures thereof; (b) 0-75% wt. finely divided particles of silver chlor... | 07/27/1999 |
| 5753251 | Anti-microbial coating for medical device Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapor deposition techniques to produce atomic disorder in the coating such that a sustained release of metal... | 05/19/1998 |
| 5723073 | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same A conductive paste for filling through holes for the interlayer electrical connection in a low-temperature firable ceramic circuit substrate to be fired at 800° to 1,000° C., which comprises a) 100 parts by weight of flaky and/or spherical silver-based ... | 03/03/1998 |
| 5698015 | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the... | 12/16/1997 |
| 5663109 | Low temperature glass paste with high metal to glass ratio A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: about ... | 09/02/1997 |
| 5661041 | Conductive paste, solar cells with grid electrode made of the conductive paste, and fabrication method for silicon solar cells The conductive paste according to the present invention, used when forming an n-type layer formed on one surface of a p-type silicon semiconductor substrate and a conducting electrode, is characterized in that the conductive paste comprises silver powder,... | 08/26/1997 |
| 5658499 | Aqueous silver compositions Coating compositions of silver flake suspended in predominantly aqueous vehicle is disclosed for laying down a coating of electrically conductive metal on resistive or dielectric substrates useful in the electronics industry. The coating compositions prov... | 08/19/1997 |
| 5543366 | Low temperature glass paste with improved thermal stress properties A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis: about 40-65% Ag2 O about 15-35% V2 O5 | 08/06/1996 |
| 5492653 | Aqueous silver composition Coating compositions of silver flake suspended in predominantly aqueous vehicle is disclosed for laying down a coating of electrically conductive metal on resistive or dielectric substrates useful in the electronics industry. The coating compositions prov... | 02/20/1996 |
| 5431718 | High adhesion, solderable, metallization materials A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The comb... | 07/11/1995 |
| 5417745 | Silver containing conductive coatings Silver-containing conductive coatings are provided. The coatings are prepared from compositions comprising silver particulate material, a low firing lead-free glass frit and a liquid organic vehicle. The composition is coated on a substrate and fired to f... | 05/23/1995 |
| 5409638 | Electrically conductive liquid for an electrical stun gun A new and improved electric stun gun is provided to utilize an electrically conductive liquid mixed in storage containers, which is discharged by use of a compressed gas and activated by a three-position trigger and two liquids combined outside of the dis... | 04/25/1995 |
| 5403389 | Resinless pseudoplastic bonding compositions An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.... | 04/04/1995 |
