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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 8152914 | Process for applying a metal coating to a non-conductive substrate Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated subst... | 04/10/2012 |
| 7713340 | Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plat... | 05/11/2010 |
| 7338686 | Method for producing conductive particles The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mai... | 03/04/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7272915 | Shingle and mat tensile strength with urea formaldehyde resin modifier A composite sheet, and a process of making the same, including cured modified urea formaldehyde reinforced by glass fibers. The modifier is an acrylonitrile-butadiene-styrene copolymer. A roofing shingle, formed by coating the composite sheet with filled asphalt, re... | 09/25/2007 |
| 7198662 | Electroless plating pre-treatment solution and electroles plating method It is an object of the present invention to provide an electroless plating pre-treatment solution and an electroless plating method capable of shortening the incubation time and achieving cost reduction. As the pre-treatment solution 7 to be supplied o... | 04/03/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed It is an object of the present invention to provide a semiconductor wafer on which a thin, smooth, uniform and good adhesive electroless plating layer that can be suitable for a seed layer is formed, and to provide an electroless plating method which is suitable for... | 02/20/2007 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components... | 01/23/2007 |
| 7122746 | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The mu... | 10/17/2006 |
| 7103965 | Method of making chip resistor The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the fi... | 09/12/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7087267 | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes,... | 08/08/2006 |
| 7056448 | Method for forming circuit pattern A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper ... | 06/06/2006 |
| 7045461 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a ob... | 05/16/2006 |
| 7029529 | Method and apparatus for metallization of large area substrates A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stampi... | 04/18/2006 |
| 7018552 | Method of manufacturing electronic device A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the wiring material layer by a reactive ion etching treatment with a resist... | 03/28/2006 |
| 7013558 | Method for shielding an electronic component The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates us... | 03/21/2006 |
| 6949289 | Impregnated glass fiber strands and products including the same The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a coating composition on at least a portion of at least one of the glass fibers, the coating composition comprising at least one coating comprising... | 09/27/2005 |
| 6933231 | Methods of forming conductive interconnects, and methods of depositing nickel The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel sa... | 08/23/2005 |
| 6911138 | Method for plating electrodes of ceramic chip electronic components A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group con... | 06/28/2005 |
| 6902765 | Method for electroless metal plating A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selecti... | 06/07/2005 |
| 6875260 | Copper activator solution and method for semiconductor seed layer enhancement The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at lea... | 04/05/2005 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a su... | 02/08/2005 |
| 6821902 | Electroless plating liquid and semiconductor device The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, su... | 11/23/2004 |
| 6780467 | Plating pretreatment agent and metal plating method using the same The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is trea... | 08/24/2004 |
| 6776827 | Method and solution for treating fluorocarbon surfaces A method and solution to activate and metallize the surface of a fluorocarbon material, suitable for circuit boards is disclosed. The surface of fluorocarbon materials is both hydrophobic and oleophobic, and highly inert and repellent to oils, dyes, adhesive and coa... | 08/17/2004 |
| 6776826 | Composition and method for electroless plating of non-conductive substrates Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and appro... | 08/17/2004 |
| 6717189 | Electroless plating liquid and semiconductor device The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, su... | 04/06/2004 |
| 6344242 | Sol-gel catalyst for electroless plating A sol-gel catalyst composition for electroless plating includes a metal alkoxide in a polar organic solvent, an acid, a chloride salt or acid chloride, and a catalytic metallic salt. The sol-gel catalyst adheres to smooth surfaces without the precondition... | 02/05/2002 |
| 6284123 | Electroplating formulation and process for plating iron onto aluminum/aluminum alloys An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electroplating bath includi... | 09/04/2001 |
| 6277181 | Method to extend the bathlife of alkaline accelerator solutions This invention is a method to extend the bath life of certain alkaline accelerators used in metal/tin colloid catalyst used in direct plating processes on printed circuit boards. The method is comprised of the following steps: measuring the pH of the alka... | 08/21/2001 |
| 6277180 | Method of replacing evaporation losses from colloidal catalyst baths A method to make volumetric additions of dilute aqueous acid solutions to a colloidal catalyst bath that will retard the salt crystallization. The process includes the steps of measuring the volumetric loss of water by physical measurements and adding dil... | 08/21/2001 |
| 6206981 | Process for enhancing the adhesion of organic coatings to metal surfaces A process is described for increasing the adhesion of organic coatings to metal surfaces, particularly aluminum and aluminum alloys. The process involves the utilization of an adhesion promoting composition in conjunction with a chromating composition in ... | 03/27/2001 |
| 6174353 | Pretreating solution for electroless plating, electroless plating bath and electroless plating process As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film... | 01/16/2001 |
| 6156413 | Glass circuit substrate and fabrication method thereof A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei ... | 12/05/2000 |
| 5989787 | Activating catalytic solution for electroless plating and method for electroless plating A hydrophilic activating catalytic solution for electroless plating is a mixture of lactate, palladium and alkaline medium. The solution enables depositing palladium catalyst in a short time radiation exposure and removing unwanted photo-sensitive film mo... | 11/23/1999 |
| 5908543 | Method of electroplating non-conductive materials This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a co... | 06/01/1999 |
| 5843517 | Composition and method for selective plating This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printe... | 12/01/1998 |
| 5810913 | Activating catalytic solution for electroless plating and method of electroless plating There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating... | 09/22/1998 |
