Bizarre Patents
Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7090560 | System and method for detecting abrasive article orientation Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abr... | 08/15/2006 |
| 7090559 | Ophthalmic lens manufacturing system A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support structure, a resilient member which biases the vacuum gripper in a di... | 08/15/2006 |
| 7089081 | Modeling an abrasive process to achieve controlled material removal In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of feedback controls within the abrasive manufacturing process. For exampl... | 08/08/2006 |
| 7085619 | Method for controlling an industrial process The invention relates to a method for controlling an industrial process for manufacturing or processing a product, in particular for controlling the cooling line of a hot-rolling mill, said cooling line being simulated by a physical model. To optimize the cooling pr... | 08/01/2006 |
| 7083495 | Advanced process control approach for Cu interconnect wiring sheet resistance control A wafer based APC method for controlling an oxide (Cu, or TaN) polish step is described and combines a feed forward model that compensates for incoming wafer variations with a feed backward model which compensates for CMP variations. The method is geared toward mini... | 08/01/2006 |
| 7077731 | Chemical mechanical planarization (CMP) system and method for preparing a wafer in a cleaning module A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the... | 07/18/2006 |
| 7059942 | Method of backgrinding wafers while leaving backgrinding tape on a chuck A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed f... | 06/13/2006 |
| 7048609 | Pressure control system and polishing apparatus A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers fo... | 05/23/2006 |
| 7044830 | Numeric controller A chopping control process, for controlling a machine tool during chopping, i.e., shaping or cutting a workpiece, is allowed without adding an extra axis dedicated just to the chopping, i.e., a chopping dedicated axis. To correct a chopping operation (i.e., an opera... | 05/16/2006 |
| 7039488 | Method of determining remaining film thickness in polishing process A method of determining remaining film thickness in polishing process provides a technology for controlling a polishing amount of CMP in a device isolating process with satisfactory accuracy regardless of the ratio between the area of each of device forming regions ... | 05/02/2006 |
| 7029993 | Method for treating substrates for microelectronics and substrates obtained according to said method The invention relates to a method for treating substrates (50) for microelectronics or optoelectronics, whereby said substrates comprise a useful layer (52) on at least one of the surfaces thereof. The inventive method includes a mechanical/chemical po... | 04/18/2006 |
| 7024268 | Feedback controlled polishing processes Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishin... | 04/04/2006 |
| 7024262 | Process management systems and methods of the same In a manufacturing process management system 10, each of input terminals 401 to 40n located respectively in multiple manufacturing processes of a process flow with regard to a preset product reads a barcode 164 attac... | 04/04/2006 |
| 7011762 | Metal bridging monitor for etch and CMP endpoint detection One aspect of the present invention relates to a wafer containing a semiconductor substrate, at least one metal layer formed over the semiconductor substrate, and at least one electrical sensor embedded at least one of on and in the wafer to facilitate real time mon... | 03/14/2006 |
| 6997788 | Multi-tool, multi-slurry chemical mechanical polishing A chemical mechanical polishing method is disclosed in which a batch of wafers is first supplied to a low-selectivity, first CMP tool for partly polishing the batch with one or more relatively non-selective CMP slurries (e.g., silica (SiO2) based); and in... | 02/14/2006 |
| 6985791 | Grinding wheel system A grinding wheel system includes a grinding wheel with at least one embedded sensor. The system also includes an adapter disk containing electronics that process signals produced by each embedded sensor and that transmits sensor information to a data processing plat... | 01/10/2006 |
| 6959227 | Lens layout setting apparatus for lens grinding process and display apparatus for the same A lens layout setting apparatus for lens grinding processing apparatus having a display screen of a display device for various settings for processing data of eyeglass lens shape for an eyeglass frame, and data of lens grinding process to grind the lens based on the... | 10/25/2005 |
| 6951624 | Method and apparatus of arrayed sensors for metrological control A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded i... | 10/04/2005 |
| 6950718 | Computer controlled grinding machine A computer (100) located within an electrical console (102) and a rotationnaly operating machine generally denoted by the number by the numeral (10). As must be noted, the rotating machine of the present example and figures can be used for any r... | 09/27/2005 |
| 6945848 | Lens shape data processing apparatus and lens grinding machine having the same apparatus A lens shape data processing apparatus and a lens grinding machine having the same apparatus in which the lens shape data reading out and the layout setting work for another spectacle lens can be conducted during the lens edge measurement or the grinding process is ... | 09/20/2005 |
| 6932675 | Plated grinding wheel life maximization method A method of determining the condition of a grinding wheel is provided to avoid over use or premature changing of the grinding wheel in a grinding machine, such as for crankshaft or camshaft grinding. The grinding machine has a motor which drives a grinding spindle c... | 08/23/2005 |
| 6926585 | Pressure control system and polishing apparatus A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers fo... | 08/09/2005 |
| 6908367 | Apparatus for processing a lens An apparatus for processing a lens comprising a rotating tool for chamfering used for chamfering a peripheral portion of a spectacle lens, the apparatus comprising: a holding shaft supporting the lens and a lens-holding unit that rotates the holding shaft and displa... | 06/21/2005 |
| 6889112 | Method for processing surface and apparatus for processing same A method for processing a surface corrects a relationship between a processing condition and a removal quantity (polished removal quantity) or a removal depth (polished removal depth) in accordance with a worked surface to obtain desired removal quantity or removal ... | 05/03/2005 |
| 6883373 | Method and apparatus for balancing A balancer assembly 10 which automatically provides balancer limits, which achieves a balancing state while substantially minimizing short term vibration increases and which provides for multi-plane balancer dithering. ... | 04/26/2005 |
| 6785585 | Method for marking or drilling holes in glass lenses and device for realizing the same To at least one of mark and drill holes in a workpiece spectacle lens, a position of bores of a lens template is scanned, in which the template includes one of a template spectacle lens, a pattern disk and a support disk. The scanning is performed by a scanning arra... | 08/31/2004 |
| 6763279 | System and method for efficiently inscribing bullion articles utilizing a milling tool and a numeric controller A system and method for inscribing a bullion article, including a first processor having a display terminal and a mouse controller. A drawing program generates and displays a selected font illustration. The processor incorporates a program for rendering a single lin... | 07/13/2004 |
| 6751522 | Lens layout setting apparatus for lens grinding process and display apparatus for the same A lens layout display apparatus for lens grinding processing apparatus having a display screen on which is displayed data of eyeglass lens shape for an eyeglass frame, and data of eyeglass lens grinding process to grind the eyeglass lens based on the data of eyeglas... | 06/15/2004 |
| 6732009 | Machining error correction method adapted for numerically controlled machine tool and grinding machine using the same A machining error correction method corrects error in machining of a work by a tool. The method is adapted for a machine tool that includes a numerical control unit in which a movement amount of the tool is programmed and a tool moving unit that is driven by an inst... | 05/04/2004 |
| 6690991 | Machine control gage system performing roundness measuring function A machine control gage system has a control unit, which analyzes roundness of a workpiece. The control unit controls a grinding machine controller in such a manner as to machine the workpiece to a desired size according to data measured by a measuring hea... | 02/10/2004 |
| 6687566 | Method of machining a female screw and dressing a grinding wheel for female screw machining The present invention provides a method of machining a female screw groove in a workpiece whereby the spindle of an internal grinding wheel for machining the workpiece into a female screw is tilted relative to the screw's axis at an angle (.xi.) smaller t... | 02/03/2004 |
| 6684128 | Robot and method of controlling the robot A robot capable of being operated at a high-speed by the full use of a power of a servo-motor, including a motor and a speed reducer, wherein the motor drives the robot through the speed reducer, and the speed reducer is a variable speed reducer capable o... | 01/27/2004 |
| 6681143 | Match grinding of spool to control valve body of oil activated fuel injector A method is provided for matching dimensions of a spool to a control valve body of a fuel injector. The method includes the steps of measuring land locations and an overall length of a first component of the fuel injector and measuring land locations of a... | 01/20/2004 |
| 6662072 | Grinding process and control device for a knife shaft The present invention relates to a process and control device to grind a knife shaft used in a machine intended for cutting sheets of materials into strips, for example, sheets of paper, plastic, plates of photosensitive film or any other material having ... | 12/09/2003 |
| 6640155 | Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head CMP systems and methods implement instructions for moving a polishing pad relative to a wafer and a retainer ring and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with determinations of desired inputs of vari... | 10/28/2003 |
| 6625515 | Roll defect management process The Roll Defect Management Process (RDMP) is a system which is designed to manage, track and evaluate all mill rolls found in use in the hot and cold production of flat rolled metal strip. The RDMP is capable of detection, distinction and differentiation ... | 09/23/2003 |
| 6618646 | Method and apparatus for balancing A balancer assembly 10 which automatically provides balancer limits, which achieves a balancing state while substantially minimizing short term vibration increases and which provides for multi-plane balancer dithering.... | 09/09/2003 |
| 6594542 | Method and system for controlling chemical mechanical polishing thickness removal An improved method and apparatus for controlling the depth of removal by chemical mechanical polishing of a selected material on a supporting semiconductor underlayer where it is desired to terminate removal of the selected material, such as silicon oxide... | 07/15/2003 |
| 6577917 | Process and apparatus for the automatic measurement of processing and workpiece characteristics when grinding gears Located for rotation in a machine base (1) is a work spindle (4) for the setting up of a workpiece (6). A grinding spindle (10) for setting up a grinding wheel (11) can be radially infed relative to the work spindle (4) and displaced in the plane at right... | 06/10/2003 |
| 6459945 | System and method for facilitating determining suitable material layer thickness in a semiconductor device fabrication process The present invention relates to a test wafer for use in optimizing a process. The test wafer includes a substrate and a material layer formed over the substrate, wherein the material layer includes N number of test regions (N being an integer greater tha... | 10/01/2002 |
