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| Number | Title | Issue Date |
| 4835704 | Adaptive lithography system to provide high density interconnect An adaptive method and system are disclosed for providing high density interconnections of very large scale integrated circuits on a substrate. The procedure is performed in four basic steps: first an artwork representation for the interconnections of the... | 05/30/1989 |
| 4829444 | Charged particle beam lithography system A charged particle beam lithography system has a high-throughput and inexpensive system configuration. The system configuration is constituted by a plurality of charged particle optical systems each adapted to focus and deflect a beam of charged particles... | 05/09/1989 |
| 4821196 | High resolution automatic focus correction electronic subsystem for E-beam lithography This electronic signal processing system is a subsystem of an automatic focus system for an E-beam lithography tool. This subsystem allows the automatic focus system to achieve resolution of 0.25 microns. An automatic focus system is composed of several s... | 04/11/1989 |
| 4805110 | Circuit element mounting system and method A circuit element mounting system and method capable of utilizing data from a CAD device for mounting a circuit element on a printed circuit board to permit mounting in high density or concentration. The system and method include a mounting head for holdi... | 02/14/1989 |
| 4700311 | System for optimizing process parameters in photoactive semiconductor manufacturing in-situ Materials and systems substantially having photoactive properties are produced with a high quality output and without time losses in the fabrication process. To determine the quality of the photoactive material in situ, conductivity is induced in the mate... | 10/13/1987 |
| 4571685 | Production system for manufacturing semiconductor devices A production system for manufacturing semiconductor devices comprises apparatus for making a semiconductor wafer during a first process step. A plurality of semiconductor devices, or semiconductor chips are arranged and incorporated in the wafer. A second... | 02/18/1986 |
| 4566071 | Apparatus for automatically inserting electronic parts into printed circuit board An automatic insertor for inserting pins of ICs into holes formed in a printed circuit board includes a cassette holding section for holding a number of cassettes, each of which contains a plurality of ICs of the same kind, an IC discharging section for s... | 01/21/1986 |
| 4502829 | Electronic component sensing system A system for sensing the size of electronic components processed within a machine for placing components on a media such as a printed circuit board. The size of a component is determined at a sensing station and the component is thereafter precisely posit... | 03/05/1985 |
| 4464833 | Variable rate control logic for component insertion machine A variable insertion rate control system for a component insertion machine is disclosed. An insertion rate is read and retained by the control system which thereafter authorizes insertion of components at the indicated insertion rate. In order to achieve ... | 08/14/1984 |
| 4430959 | Semiconductor vapor phase growing apparatus In apparatus for vapor phase growing N or P type semiconductor layers on semiconductor substrates supported by a rotary support disposed in a reaction furnace, and various types of gases are admitted into the furnace through a pipe line network and valves... | 02/14/1984 |
| 4383644 | Process and apparatus for the electrostatic spraying of electrically conductive paint The invention relates to a process and apparatus for the electrostatic spraying of electrically conductive paint. Paint free of electric charge is intermittently fed from a main supply system to a buffer supply vessel, from which the paint is intermittent... | 05/17/1983 |
| 4331702 | Method for reproducible manufacture of metallic layers Reproducible manufacture of metallic layers for semiconductor and thin film technology is attained by dynamic control of the layering process whereby the specific electrical resistance, .rho., is determined as a function of layer thickness, d, and layerin... | 05/25/1982 |
| 4070117 | Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the ... | 01/24/1978 |
| 4052603 | Object positioning process and apparatus Objects, such as a pattern mask and a photoresist coated substrate, are placed in translational and/or rotational alignment by a system in which a target on one object is successively aligned to two targets on the other object so that the accuracy of each... | 10/04/1977 |
| 4027246 | Automated integrated circuit manufacturing system A computer controlled manufacturing system employing random access semiconductor wafer storage in the fabrication of integrated circuit devices. A computer controlled manufacturing system for fabricating semiconductor wafers into large scale integrated ci... | 05/31/1977 |
| 3955072 | Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the ... | 05/04/1976 |
| 3941985 | Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor In an automatic wire bonder, a rotatable work stage for a lead frame on which a plurality of leads are arranged and an electronic circuit element having a plurality of electrodes is mounted for rotation to align the circuit element in a predetermined dire... | 03/02/1976 |
