Quotables
"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
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| Number | Title | Issue Date |
| 8095901 | Method and system alerting an entity to design changes impacting the manufacture of a semiconductor device in a virtual fab environment A design coordination engine coordinates design implementation among a manufacturing facility, a customer, an IP vendor, and a design group during the design phase of a semiconductor device. The design coordination engine includes a tracking module configured to tra... | 01/10/2012 |
| 8095231 | Graphical automated machine control and metrology A graphical programming system allows a user to place geometric shapes onto a scaled image, the shape having associated behavior that operates on the image or on the object of which the image is formed. In a preferred embodiment, the shapes are objects in the Visio ... | 01/10/2012 |
| 8095896 | Method and system of displaying an exposure condition There is provided a device which may easily and visually judge which chip in an FEM wafer has a normal exposure condition, or which chip has an abnormal exposure condition. A feature quantity for a sectional shape of a resist pattern of an FEM wafer is calcul... | 01/10/2012 |
| 8090464 | Method and system for enhancing the yield in semiconductor manufacturing Roughly described, a manufacturing process is enhanced by using TCAD and TCAD-derived models. A TCAD simulation model of the process is developed, which predicts, in dependence upon a plurality of process input parameters, a value for a performance parameter of a pr... | 01/03/2012 |
| 8078306 | Polishing apparatus and polishing method An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substr... | 12/13/2011 |
| 8073559 | Material transport systems using autonomous controls A plurality of autonomous control processes, with each controlling one or more components of the material transport (or processing) system, is used to radically simplify the controller software. Each autonomous control process is responsible for the actions of only ... | 12/06/2011 |
| 8060233 | Control system for a plurality of chip mounters and operating method thereof A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the print... | 11/15/2011 |
| 8050789 | System and methods for automatic generation of component data A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automaticall... | 11/01/2011 |
| 8050790 | Inductor/transformer and manufacturing method thereof A manufacturing method for the inductor/transformer is disclosed. A simulator is used to simulate the inductance, the quality factor, and the self-resonance frequency of said inductor/transformer to generate at least one group of the area size, the number of the con... | 11/01/2011 |
| 8019458 | Creating multi-layer/multi-input/multi-output (MLMIMO) models for metal-gate structures The invention provides a method of processing a wafer using multilayer processing sequences and Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models and libraries that can include one or more measurement procedures, one or more Poly-Etch (P-E) sequences, and one or ... | 09/13/2011 |
| 8014891 | Etching amount calculating method, storage medium, and etching amount calculating apparatus An etching amount calculating method that can stably and accurately calculate the amount of etching even if a disturbance is added. Superposed interference light resulting from superposition of interference light of reflected light from a mask film and reflected lig... | 09/06/2011 |
| 8014890 | Method for manufacturing a high-frequency assembly In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific compo... | 09/06/2011 |
| 8010221 | Cleaning apparatus and method for immersion light exposure A cleaning apparatus for immersion light exposure includes a cleaning apparatus main body including a mechanism configured to perform a cleaning process on the substrate, and a control section configured to control respective components of the cleaning apparatus mai... | 08/30/2011 |
| 8010222 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a ... | 08/30/2011 |
| 8001494 | Table-based DFM for accurate post-layout analysis Disclosed is a system and method for integrated circuit designs and post layout analysis. The integrated circuit design method includes providing a plurality of IC devices with various design dimensions; collecting electrical performance data of the IC devices; extr... | 08/16/2011 |
| 7996102 | Process control using process data and yield data A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first proce... | 08/09/2011 |
| 7991499 | Advanced finishing control A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tr... | 08/02/2011 |
| 7987014 | Systems and methods for selecting wafer processing order for cyclical two pattern defect detection A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lo... | 07/26/2011 |
| 7979154 | Method and system for managing semiconductor manufacturing device A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing... | 07/12/2011 |
| 7979153 | Exposure data generating apparatus An exposure-data generating apparatus comprises a first memory, a second memory, and an exposure data memory. The first memory stores drawing data in bitmap format as first data that is used for an exposure. The second memory stores second data whose data unit in a ... | 07/12/2011 |
| 7974729 | Server device and program with sub-recipe measurement communication A server device is provided with a measurement information storage unit 1201 which can store plural measurement information, i.e., information having a measurement value and time information indicating time; an instruction receiving unit for receiving an outp... | 07/05/2011 |
| 7974728 | System for extraction of key process parameters from fault detection classification to enable wafer prediction A system, method, and computer readable medium for extracting a key process parameter correlative to a selected device parameter are provided. In an embodiment, the key process parameter is determined using a gene map analysis. The gene map analysis includes groupin... | 07/05/2011 |
| 7970486 | Method for controlling semiconductor manufacturing apparatus and control system of semiconductor manufacturing apparatus A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment ... | 06/28/2011 |
| RE42481 | Semiconductor yield management system and method A system and method for yield management is disclosed wherein a data set containing one or more prediction variable values and one or more response values is input into the system. The system can pre-process the input data set to remove prediction variables with mis... | 06/21/2011 |
| 7962864 | Stage yield prediction In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a ... | 06/14/2011 |
| 7957826 | Methods for normalizing error in photolithographic processes A method for fabricating parts using a photolithography system, includes: performing a search of normalization data for an estimated dose operating point; and using the estimated dose operating point for fabrication of new parts. ... | 06/07/2011 |
| 7957829 | Method for positioning and/or guiding at least one arbitrary process head for the metalization of thin substrates at a defined distance above the substrate surface A method for positioning or guiding at least one arbitrary print head or a printing unit having at least one pressure nozzle for the imprinting of thin substrates such as wafers at a defined distance above the surface of the substrate, which is to be provided on a s... | 06/07/2011 |
| 7957827 | Method of controlling statuses of wafers A method of controlling statuses of a plurality of wafers is described. A status of a wafer among the wafers is determined. An action related to the status is taken, according to the status determined, to the wafer and/or other wafers to improve a yield or yields th... | 06/07/2011 |
| 7957828 | Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage medium In the present invention, the line widths within a substrate of an etching pattern are measured for a substrate for which photolithography processing and an etching treatment thereafter have been finished. The line width measurement results are converted into the li... | 06/07/2011 |
| 7953512 | Substrate processing system, control method for substrate processing apparatus and program stored on medium The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates.... | 05/31/2011 |
| 7925370 | Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program A substrate processing system which is capable of preventing dust from becoming attached to substrates without increasing the degree of cleanliness of a clean room to a predetermined level, and also capable of increasing the substrate processing throughput without i... | 04/12/2011 |
| 7925369 | Method and apparatus for optimizing models for extracting dose and focus from critical dimension A method includes defining a reference model of a system having a plurality of terms for modeling data associated with the system. A reference fit error metric is generated for the reference model. A set of evaluation models each having one term different than the r... | 04/12/2011 |
| 7920938 | Concept for monitoring the manufacture of objects consisting of multiple material layers The manufacture of an object consisting of multiple material layers successively built up one upon the other can be monitored in an advantageous manner in that after the application of a material layer, a height profile of a circumference of the object is establishe... | 04/05/2011 |
| 7917244 | Method and system for reducing critical dimension side-to-side tilting error A method for reducing a critical dimension error of a substrate is provided. A first function is identified for correlating a critical dimension error with a first effect. A second function is identified for correlating a critical dimension error with a scan speed. ... | 03/29/2011 |
| 7908025 | Semiconductor manufacturing apparatus and control system and control method therefor Disclosed herein is technology for, among other things, a semiconductor manufacturing apparatus, and a control system and a control method therefor, by which a target parameter that is measured from a wafer processed with a plurality of processing parameters that ar... | 03/15/2011 |
| 7899570 | Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced... | 03/01/2011 |
| 7899571 | Predictive method to improve within wafer CMP uniformity through optimized pad conditioning A method of conditioning a CMP polishing pad to attain a desired thickness profile in a polished layer on a wafer is disclosed. The incoming thickness profile of the layer to be polished, the thickness profile of the polishing pad, a polish rate of layer as a functi... | 03/01/2011 |
| 7894927 | Using Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models for metal-gate structures The invention provides a method of processing a wafer using multilayer processing sequences and Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models and libraries that can include one or more measurement procedures, one or more Poly-Etch (P-E) sequences, and one or ... | 02/22/2011 |
| 7894926 | Global predictive monitoring system for a manufacturing facility A global predictive monitoring system for a manufacturing facility. The system may be employed in an integrated circuit (IC) device fabrication facility to monitor processing of semiconductor wafers. The system may include deployment of a swarm of individually separ... | 02/22/2011 |
| 7890204 | Method of determining mounting condition To provide a method for determining a mounting condition to be set for at least one apparatus among apparatuses for manufacturing component-mounted boards. The method includes: determining, from among the apparatuses, a specific apparatus which satisfies a predeterm... | 02/15/2011 |
