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Class 528/91 - Material contains a boron atom


Subclass of Class 528 - Synthetic resins or natural rubbers -- part of the class 520 series
Definition: Subject matter wherein the specified material contains boron
No. of patents: 139
Last issue date: 05/06/2008


1        
NumberTitleIssue Date
7368524Cationically curing two component materials containing a noble metal catalyst
The invention relates to two-component preparations comprising epoxy compounds and a noble metal species, in particular for the preparation of dental compositions. The invention particularly relates to two-component dental compositions which comprise epoxy compounds...
05/06/2008
7351784Chip-packaging composition of resin and cycloaliphatic amine hardener
A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting o...
04/01/2008
7351645Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method fo...
04/01/2008
7247596Stabilized organoborane polymerization initiators and polymerizable compositions
The invention is polymerizable compositions comprising in one part an organoboron compound capable of forming a free radical generating species and a stabilizing amount of one or more compounds comprising a dihydrocarbyl hydroxyl amine, an alicyclic hydroxyl amine, ...
07/24/2007
7157399Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components
In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo...
01/02/2007
7112635Acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxides and uses thereof
Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxy resins. The polyols can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatin...
09/26/2006
7026411Variable temperature curable composition
Curable composition comprising at least one polyaromatic having reactive end groups, at least one thermoset resin, and a reactive catalyst, wherein the reactive end groups are adapted to react with the catalyst, characterized in that the catalyst comprises a Lewis a...
04/11/2006
7008555Epoxy resin curing agents and epoxy resin compositions
A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine).
03/07/2006
6949603Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components
In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo...
09/27/2005
6949592Liquid epoxy resin emulsions, method for the production and use thereof
The invention relates to novel liquid epoxy resin emulsions which contain the following components, dissolved and/or dispersed in water: (A) at least one binding agent selected from the group made of epoxy resins and modified epoxy resins, (B) at least one non ionic...
09/27/2005
6902641Method of labelling an article
A method of labelling an article is carried out by providing a heat-transfer label that includes a support portion and a transfer portion over the support portion for transfer of the transfer portion from the support portion to the article upon application of heat t...
06/07/2005
6894144Two-constituent elastomer materials based on alkyl aziridine comprising a catalyst constituent that contains a boric acid complex
The invention relates to elastomer materials based on N-alkylaziridino compounds with a base component which contains the aziridino compounds and with a catalyst component which contains at least one acid-acting compound, both components being mixed before use, char...
05/17/2005
6800717Acid catalyzed copolymerization of water and epoxy resin and uses thereof
Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphen...
10/05/2004
6703124Epoxy resin composition and laminate using the same
The present invention relates to a nonflammable epoxy resin composition for using a thin copper film laminate, which is applied to a printed circuit board (PCB), and using the same. The present invention provides for nonflammable epoxy resin composition f...
03/09/2004
6670017Photocurable form-in-place gasket for electronic applications
Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in...
12/30/2003
6652281Dental materials
Dental materials containing monomers and/or prepolymers can be subjected to a polymer-forming reaction. The dental materials comprise at least one initiating system and optionally comprise fillers, colorants, flow modifiers, stabilizers, ion-releasing sub...
11/25/2003
6649728Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition
A catalyst for curing epoxy resins comprises a tetraalkylphosphonium tetrafluoroborate represented by Formula (1): ##STR1## wherein R1, R2, R3, and R4 are each C1-C5 linear or branched alkyl and may be the same ...
11/18/2003
6642344Curing agents for epoxy-based polymers
A method for making flexible epoxy resins by curing an epoxide and a bis-phenol with an aliphatic secondary diamine having the structural formula (I) or (II): ##STR1## where R1 and R2 are each individually an alkyl, alkenyl, aryl, or...
11/04/2003
6613839Polyepoxide, catalyst/cure inhibitor complex and anhydride
An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value "n" of greater than zero and less than 2.5, or an organic acid havin...
09/02/2003
6599960Storage-stable cationcally polymerized preparations with improved hardening characteristics
The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic alkaline earth and/or alkali metal compounds. The preparations ac...
07/29/2003
6420460Cationically curable compositions containing triarylcyclopropenylium salts
The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. T...
07/16/2002
6352783Copolyester containing 4,4'-biphenyldicarboxylic acid, 1,4-cyclohexanedimethanol and an ultraviolet light absorbing compound and articles made therefrom
A copolyester blend resistant to ultraviolet radiation consists essentially of a polyethylene terephthalate based copolyester having 1,4-cyclohexanedimethanol residues; an effective amount of an ultraviolet radiation absorber selected from the group consi...
03/05/2002
6316049Low temperature epoxy wrinkle coating powder
Coating compositions comprising an epoxy resin and a curative which is methylenedisalicylic acid and/or a methylendisalicylic acid ring-substituted homologue are found to cure at and produce a wrinkle finish at relatively low temperatures when a borontrif...
11/13/2001
6232426Epoxy resin composition
Disclosed herein is a one-part polythiol-type epoxy resin composition having an excellent low-temperature quick curability and a good storage stability (shelf stability), which can be prepared by using, as essential components, (1) an epoxy resin having t...
05/15/2001
5959061Hardeners for water-dilutable epoxy resin systems with a potlife indication
Water-dispersible curing agents for epoxy resins are disclosed which, as a mixture with epoxy resins, have a potlife indication by showing the end of the processing time by a clear increase in viscosity, and which comprise reaction products (ABC) of adduc...
09/28/1999
5955551Polyglycidyl ethers of secondary alcohols, their preparation, and curable compositions containing them
The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R1 represents (i) a straight chain or branched alkyl groups of 1 to 16 carbon atoms, which may b...
09/21/1999
5759692Phosphorous-modified coating compositions, a process for their preparation, and their use as an intumescent coating
The invention relates to expandable, halogen-free, flame-retardant coating compositions comprising epoxy resins, polyphosphoric esters and a curing agent, which composition comprises from 75 to 95 parts by weight of epoxy resin and from 5 to 25 parts by w...
06/02/1998
5759691Phosphorus-modified coating compositions, a process for their preparation, and their use
The invention relates to an expandable, halogen-free, flame-retardant coating composition comprising epoxy resins, polyphosphoric/polyphosphonic esters and a curing agent, which composition comprises from 75 to 95 parts by weight of epoxy resin and from 5...
06/02/1998
5721323Cure inhibited epoxy resin compositions and laminates prepared from the compositions
A class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures including an epoxy resin composition containing a) a polyepoxide; b) an amine or amide curing agent for the polyepoxide; c) at least about 15 meq (per equ...
02/24/1998
5652322Heat-curable epoxy resin systems having a good reactivity/stability ratio
Heat-curable epoxy resin systems comprising (a) at least one epoxy resin, (b) at least one polycarboxylic acid anhydride, and (c) 1,4-diazabicyclo(2,2,2)octane or a C1 -C4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing...
07/29/1997
5641859Water-soluble self-acid-doped polyaniline, method of preparation thereof, and polymer blends made therefrom
The present invention discloses a water-soluble self-acid-doped polyaniline, and its sodium salt, which can be cast into free-standing films from their aqueous solutions. A process for preparing a water-soluble self-acid-doped polyaniline is also disclose...
06/24/1997
5623023Curable compositions which release imidazole upon irradiation
Disclosed is a curable composition comprising (A) an imidazole derivative represented by the following general formula (1), which is capable of generating free imidazole by exposure to light, and (B) a polyfunctional epoxy compound: ##STR1## whe...
04/22/1997
5620789Cure inhibited epoxy resin compositions and laminates prepared from the compositions
The invention pertains to a composition useful for curing a polyepoxide or advanced epoxy resin consisting essentially of (A) a curing agent capable of reacting with a polyepoxide at elevated temperatures; and (B) boric acid in an amount of from about 0.0...
04/15/1997
5597886Heat-curable epoxy resin systems having a good reactivity/stability ratio
Heat-curable epoxy resin systems comprising (a) at least one epoxy resin, (b) at least one polycarboxylic acid anhydride, and (c) 1,4-diazabicyclo(2,2,2)octane or a C1 -C4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing...
01/28/1997
5541000Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms
A thermally-curable aromatic amine-epoxy composition comprises (a) at least one polyepoxy compound; (b) a curing amount of at least one aromatic polyamine compound; and (c) a catalytically effective amount of at least one cure accelerator compound which is a π-ele...
07/30/1996
5521261Epoxy resin mixtures containing advancement catalysts
Epoxy resin compositions comprising an epoxy resin which is liquid at room temperature and has on average more than one epoxy group per molecule and a quaternary perhydroazepinium salt or a quaternary octahydroazocinium salt as advancement catalyst, when ...
05/28/1996
5508328Curing epoxy resins using dicy, imidazole and acid
A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxi...
04/16/1996
5503936N-alkyl-N'-aryl-P-phenylenediamines as modifiers for epoxy resins
N-Alkyl-N'-aryl-p-phenylenediamines, when added at 2.5 to 12.5% by weight, based on the total weight of the epoxy resin and hardener, cause the epoxy resin after curing to exhibit substantial increases in physical properties, such as strength, stiffness, ...
04/02/1996
5484873Triethylenediamine and bicyclic amidine based catalysts and use in thermosettable compoitions
Described are novel triethylenediamine adducts of certain 4-hydroxy-substituted, 3,5-hydroxy-substituted and 2,3,4-hydroxy-substituted benzoic acid derivatives, and novel boron trifluoride complexes with cyclic amidines, which are useful for the conv...
01/16/1996
5464910Epoxy resin adduct combined with a borate ester and phenolic compound
An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding ...
11/07/1995
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