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| Number | Title | Issue Date |
| 7358312 | Epoxy resin curing agent of epoxy resin-liquid amine adduct and polyamidoamine This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing. The composition is useful for high solids coating applications, for adhesive and membrane applications, and for preparing ... | 04/15/2008 |
| 7252735 | Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii... | 08/07/2007 |
| 7041771 | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface m... | 05/09/2006 |
| 7008555 | Epoxy resin curing agents and epoxy resin compositions A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine). | 03/07/2006 |
| 6987161 | Epoxy hardeners for low temperature curing Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines... | 01/17/2006 |
| 6809130 | Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin togeth... | 10/26/2004 |
| 6740359 | Ambient cure fast dry solvent borne coating compositions The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacet... | 05/25/2004 |
| 6734260 | Cationic coating composition The present invention provides a cationic coating composition capable of forming a coating film which is excellent in an electrodepositablly coating property and an adhesive property toward a rust preventive steel plate, a corrosion resistance and a low temperature ... | 05/11/2004 |
| 6723763 | Cure accelerators for anaerobic adhesive compositions The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provid... | 04/20/2004 |
| 6706417 | Fluxing underfill compositions This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arr... | 03/16/2004 |
| 6624216 | No-flow underfill encapsulant A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the compo... | 09/23/2003 |
| 6605688 | Low Viscosity imine reactive diluents and coating compositions made therefrom This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.... | 08/12/2003 |
| 6555023 | Enhanced oxidation resistant polymeric insulation composition for air-cooled generators A high voltage capable, insulating and resinous composition is disclosed. An epoxy-anhydride resin is prereacted with an antioxidant oligomer selected from the group consisting of organophosphorus compounds, sterically-hindered alkylated phenolics, alkyl ... | 04/29/2003 |
| 6512057 | Resin composition The object of the present invention is to provide resin compositions conferring cured materials (a coating or the like) with excellent appearance, excellent mechanical properties, or the like. The present invention provides resin compositions containing a... | 01/28/2003 |
| 6500912 | Epoxy resin system A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20 -C60 dicarboxylic a... | 12/31/2002 |
| 6489405 | Epoxy resin formulation containing epoxy group-terminated polyesters A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester... | 12/03/2002 |
| 6462108 | High Tg potting compound A liquid epoxy-based potting composition has a glass transition temperature equal to or greater than 200° C. and comprises a cyclo-aliphatic epoxy, present in an amount of 50 to 80 parts by weight; a multi-functional aromatic epoxy (having more than two ... | 10/08/2002 |
| 6458472 | Fluxing underfill compositions This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball g... | 10/01/2002 |
| 6410635 | Curable coating compositions containing high aspect ratio clays Provided are curable coating compositions comprised of any of a variety of film-forming polymers containing reactive functional groups, a curing agent containing functional groups which are reactive with the functional groups of the polymer, and an exfoli... | 06/25/2002 |
| 6399742 | Low viscosity imine reactive diluents and coating compositions made therefrom This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.... | 06/04/2002 |
| 6395845 | Waterproofing membrane from epoxy resin and amine-terminated polyamide The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared... | 05/28/2002 |
| 6258920 | Polyamidoamine curing agents based on mixtures of fatty and aromatic carboxylic acids Compositions of amine terminated polyamidoamine resins useful for curing epoxy resins are disclosed comprising combinations of fatty monocarboxylic acids, aromatic mono- and dicarboxylic acids, and polyethyleneamines, wherein the ratio of equivalents of f... | 07/10/2001 |
| 6136943 | Multi-branched compounds and curable composition A multi-branched compound which can give a compound having a relatively high molecular weight but a low viscosity and having excellent coating performances, and can give a solvent-less composition having sufficient coating performances and having a low vi... | 10/24/2000 |
| 6087417 | Epoxy resin/acid/tertiary amine reaction product with reactive diluent The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent, and, optionally, (C) curing agent. The compositions are use... | 07/11/2000 |
| 6077929 | Internally blocked polyamine crosslinkers and coating compositions containing the same The present invention pertains to coating compositions including a particular class of internally blocked polyamines as replacement for traditional blocked and unblocked polyamine crosslinkers. The use of these internally blocked polyamines results in bet... | 06/20/2000 |
| 6077879 | Curable resin and resin composition The present invention provides a radically polymerizable curable resin obtained by modifying an epoxy resin by reacting a phenol compound having an alcoholic hydroxyl group; and an unsaturated monobasic acid, to the epoxy resin having two or more epoxy gr... | 06/20/2000 |
| 5880228 | Hardeners for epoxy resin systems, which are formed from epoxy, monohydroxy aromatic, and amine adducts Hardeners for epoxy resins include a reaction product of (A) a compound having an average of at least one 1,2-epoxide group per molecule, compound (A) being a reaction products of (A1) a polyfunctional epoxide having ate least two 1,2-epoxide groups per m... | 03/09/1999 |
| 5783644 | Curable epoxy resin composition A curable epoxy resin composition comprising (I) an epoxy resin having more than one epoxy groups per one molecule, and (II) a specific Mannich base as essential components, with the amount of the Mannich base (II) being 1 to 50 parts by weight per 100 pa... | 07/21/1998 |
| 5756829 | Process for the preparation of amine-modified epoxy (meth) acrylates The present invention relates to a process for the preparation of amine-modified epoxy (meth)acrylates by reacting organic compounds having epoxy groups with a) acrylic and/or methacrylic acid in a carboxyl/epoxide equivalent ratio of 0.8:1 to 0.99:1 and ... | 05/26/1998 |
| 5709947 | Epoxy resins based on diaminobisimide compounds A method for the preparation of a diaminobisimide compound of the formula (I) substantially free of oligomers: ##STR1## wherein Ar1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen cont... | 01/20/1998 |
| 5708120 | Gelled reactive resin compositions The present invention relates to an epoxy composition that is isolated in the form of an infusible, gelled, heat curable, epoxy functional reaction product. The reaction product is formed by mixing together: (A) one or more epoxy resins or epoxy group con... | 01/13/1998 |
| 5698657 | Flexibilizing epoxy resins with low molecular weight acrylate copolymers Flexible epoxy resins are made by curing the epoxy with an amine curing agent in the presence of a low molecular weight acrylate copolymer made from a major amount of a lower aliphatic ester or amide of acrylic or methacrylic acid and a minor amount of an... | 12/16/1997 |
| 5693725 | Crosslinked Mannich-Michael polycondensates Novel polymers of general formula: ##STR1## wherein where n is a whole number from 2 to 10; R is a spacing group comprising (a) at least one of m methylene units where m is a whole number from 1 to 20, m' methine units where m' is a whole number from... | 12/02/1997 |
| 5668226 | 2,4-diamino-s-triazinyl group-containing polymer and negative radiation-sensitive resist composition containing the same A polyhydroxystyrene having a 2,4-diamino-s-triazinyl group substituted for 1-50 mol % of its hydroxyl group and a weight average molecular weight of 3,000-50,000 is provided. A negative radiation-sensitive resist composition comprising the polymer, prefe... | 09/16/1997 |
| 5616658 | Process for the production of matt epoxy resin and hybrid powder coatings A curing agent for a composition useful for the production of matt epoxy resin and hybrid powder coatings, comprising a mixture of a) salts of phthalic acid, isophthalic acid and terephthalic acid with the following amines ##STR1## in which R1 | 04/01/1997 |
| 5589554 | Adhesive composition and process for preparing it An adhesive composition is here disclosed which comprises a 2-cyanoacrylate and at least one of compounds (a) and (b): (a) an addition reaction product of an epoxy group and a compound having a cyano group and a carboxylic acid group in its molecule, and (b) a... | 12/31/1996 |
| 5556937 | Salts of pyromellitic acid, a process for their preparation, and their use The invention relates to salts of pyromellitic acid which comprise 1 mol of pyromellitic acid and 0.5. to 2 mol of a guanidine of the following composition: ##STR1## in which R, R1, R2, R3 and R4 are identi... | 09/17/1996 |
| 5503936 | N-alkyl-N'-aryl-P-phenylenediamines as modifiers for epoxy resins N-Alkyl-N'-aryl-p-phenylenediamines, when added at 2.5 to 12.5% by weight, based on the total weight of the epoxy resin and hardener, cause the epoxy resin after curing to exhibit substantial increases in physical properties, such as strength, stiffness, ... | 04/02/1996 |
| 5439977 | Acid anhydride-containing one package of epoxy resin composition An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a laten... | 08/08/1995 |
| 5393850 | Modification of vinyl ester resins with reactive liquid polymers Vinyl ester resins of the type already having reactive liquid polymers reacted into the backbone of the resins, are cured in the presence of a reactive liquid polymer additive admixed with the prereacted vinyl ester resin. Heating of the system during cur... | 02/28/1995 |
