Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8044154 | Latent hardener for epoxy compositions Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastome... | 10/25/2011 |
| 8026320 | Cationic electrodeposition coating composition An object of the present invention is to provide a coating composition that has excellent electrodeposition coating applicability onto hot dip galvanized steel sheets, and that provides a cationic electrodeposition coating film having a superior finish and excellent... | 09/27/2011 |
| 7879956 | Circuit-connecting material and circuit terminal connected structure and connecting method A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connec... | 02/01/2011 |
| 7820772 | Hardener for epoxy resin and epoxy resin composition An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight... | 10/26/2010 |
| 7671147 | Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent Disclosed is a flame-retardant epoxy resin composition characterized by containing (A) an epoxy resin containing 0.5-10 equivalent/kg of oxazolidone rings, (B) an epoxy group-containing phosphazene compound, (C) at least one compound selected from the group consisti... | 03/02/2010 |
| 7649060 | Curable compositions The present invention relates to curable compositions of benzoxazines, a combination of adducts one of which is prepared from hydroxy-containing compounds, isocyanate-containing compounds and phenolic compounds and the second of which is prepared from the first addu... | 01/19/2010 |
| 7598325 | Diglycidyl/isophoronediamine adduct, diglycidyl/1,3-bis(aminomethyl)cyclohexane adduct, isophoronediamine and 1,3-bis(aminomethyl)cyclohexane The present invention relates to a curing agent for epoxy resins comprising (A) an epoxy adduct of isophoronediamine, (B) an epoxy adduct of 1,3-bis(aminomethyl) cyclohexane, (C) isophoronediamine and (D) 1,3-bis (aminomethyl) cyclohexane wherein the weight ratio of... | 10/06/2009 |
| 7479527 | Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured pr... | 01/20/2009 |
| 7425598 | Adhesive of epoxy resin and curing agent with xylylene diamine structure The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin composition being formed into an epoxy resin cured product containing a sk... | 09/16/2008 |
| 7410673 | Smooth board and process for preparing a smooth board The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 08/12/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7371459 | Electrical devices having an oxygen barrier coating An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material containing a thermosetting polymer component is present on the exposed surfac... | 05/13/2008 |
| 7335795 | Crosslinked amine polymers The present invention provides methods and compositions for the treatment of ion imbalances. In particular, the invention provides polymeric and pharmaceutical compositions comprising crosslinked amine polymers. Methods of use of the polymeric and pharmaceutical com... | 02/26/2008 |
| 7336106 | Phase detector and method having hysteresis characteristics A phase detector generates a first output signal if a feedback clock signal leads a reference clock signal by more than a first time. The phase detector generates a second output signal if the feedback clock signal lags the reference clock signal by more than a seco... | 02/26/2008 |
| 7282543 | Polyepoxy resin compositions The present invention relates to polyepoxy resins, methods for making polyepoxy resins water soluble, curable coating compositions, and kits useful in their preparation. ... | 10/16/2007 |
| 7276563 | Polyphenylene ether oligomer compound, derivatives thereof and use thereof The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition ... | 10/02/2007 |
| 7271224 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/18/2007 |
| 7267877 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/11/2007 |
| 7244801 | Low-cure powder coatings and methods for using the same Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 | 07/17/2007 |
| 7230052 | Epoxy resin composition and fiber reinforced composite material using epoxy resin composition A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa·s and provides a cured product displaying a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epox... | 06/12/2007 |
| 7150902 | High Tcoatings Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy... | 12/19/2006 |
| 7125917 | Epoxy molding compounds with resistance to UV light and heat A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantial... | 10/24/2006 |
| 7108806 | Conductive materials with electrical stability and good impact resistance for use in electronics devices A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a c... | 09/19/2006 |
| 7091286 | Low-cure powder coatings and methods for using the same Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 | 08/15/2006 |
| 7045577 | Nonisocyanate polyurethane materials, and their preparation from epoxidized soybean oils and related epoxidized vegetable oils, incorporation of carbon dioxide into soybean oil, and carbonation of vegetable oils Novel carbonated vegetable oils (such as carbonated soybean oil) are made by reacting carbon dioxide with an epoxidized vegetable oil. The carbonated vegetable oils advantageously may be used for producing nonisocyanate polyurethane materials. ... | 05/16/2006 |
| 7026377 | High performance fiber reinforced thermoplastic resin, method and apparatus for making the same A process for producing a fiber-reinforced molded article and the resulting article such as a cantilevered battery tray. In the process, thermoplastic material in its solid state having a melt flow index above 25 g/10 minutes is fed into a suitable processing machin... | 04/11/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 7008555 | Epoxy resin curing agents and epoxy resin compositions A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine). | 03/07/2006 |
| 6998365 | Catalysts for low-cure powder coatings and methods for using the same Catalysts useful for low-cure powder coating compositions are disclosed, having the structure (I): wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivale... | 02/14/2006 |
| 6977274 | Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction... | 12/20/2005 |
| 6977279 | Solvent-free room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of t... | 12/20/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6916890 | Thermally reworkable epoxy resins and compositions based thereon The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic a... | 07/12/2005 |
| 6914103 | Powder coating composition, method for the curing thereof, and articles derived therefrom A powder coating composition includes an epoxy resin and a styrene-maleic anhydride copolymer having a glass transition temperature less than 105° C. The compositions provide low gloss finishes at low curing temperatures, as well as consistent gloss over a wide ran... | 07/05/2005 |
| 6890999 | Coating powder of epoxy resin and low temperature curing agent A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent capable of maintaining its own domain during extrusion which... | 05/10/2005 |
| 6884854 | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compo... | 04/26/2005 |
| 6875825 | Composition of bisphenol or novolak epoxy resin, epoxy resin from monoaromatic backbone and aromatic amine A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa's, and provides a cured product displays a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy ... | 04/05/2005 |
| 6855738 | Nanoporous laminates A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; ... | 02/15/2005 |
| 6849337 | Powder coatings containing oxirane groups beta to urethane or urea groups A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups. ... | 02/01/2005 |
| 6825315 | Method of making thermally removable adhesives A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homog... | 11/30/2004 |
