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| Number | Title | Issue Date |
| 7566758 | Epoxy resin composition An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and h... | 07/28/2009 |
| 7410673 | Smooth board and process for preparing a smooth board The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 08/12/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7351787 | Process for the preparation of activated polyethylene glycols A process for preparing activated polyethylene glycols is disclosed. In some embodiments, the process includes reacting a molten polyethylene glycol with an activator. In other embodiments, the process includes reacting a polyethylene glycol with an activator in the... | 04/01/2008 |
| 7311972 | Filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 12/25/2007 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7285602 | Granular epoxy resin, production method thereof, and granular epoxy resin package A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less ... | 10/23/2007 |
| 7196151 | Functionalized main chain polymers A non crosslinked, covalently crosslinked and/or ionically crosslinked polymer, having repeating units of the general formula (1) —K—R— (1) In which K is a bond, oxygen, sulphur, t... | 03/27/2007 |
| 7150902 | High Tcoatings Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy... | 12/19/2006 |
| 7108920 | Reworkable compositions incorporating episulfide resins This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of whic... | 09/19/2006 |
| 7087663 | Adducts of epoxy resins and phosphorus-derived acids and a process for their preparation Adducts ABC of epoxy resins A and reaction products BC of epoxy resins B with phosphorus-derived acids C, and mixtures of such adducts, containing a mass fraction of not more than 5% of unreacted acid C, the reaction products BC containing at least one acidic phosph... | 08/08/2006 |
| 7087304 | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of comp... | 08/08/2006 |
| 7064157 | Flame retardant resin and flame retardant composition containing the same The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: | 06/20/2006 |
| 7019086 | Process for producing modified polymer A process for producing a modified polymer having, in the molecule thereof, an organic group(s) introduced thereinto and derived from a compound(s) having a free radical comprising reacting a polymer such as an elastomer with a compound having the free radical stabl... | 03/28/2006 |
| 6977279 | Solvent-free room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of t... | 12/20/2005 |
| 6955851 | Hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and la... | 10/18/2005 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine gr... | 10/04/2005 |
| 6908963 | Thioester polymer derivatives and method of modifying the N-terminus of a polypeptide therewith The invention provides reagents and methods for conjugating polymers specifically to the α-amine of polypeptides in high yield. The invention provides monofunctional, bifunctional, and multifunctional PEGs and related polymers having a thioester moiety capable of s... | 06/21/2005 |
| 6894116 | S,S′-bis-(α, α′—disubstituted—α″—acetic acid)—trithiocarbonates and polymers thereof for toughening thermosetting resins A toughener comprising a trithiocarbonate polymer having an epoxy end group is described which is utilized with various thermosettable polymers such as epoxy, polyurethane, and the like. A toughened composition is made by curing the thermosettable polymer and the to... | 05/17/2005 |
| 6855738 | Nanoporous laminates A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; ... | 02/15/2005 |
| 6849337 | Powder coatings containing oxirane groups beta to urethane or urea groups A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups. ... | 02/01/2005 |
| 6818702 | Thermosetting resin composition and flexible circuit overcoating material comprising the same A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured ... | 11/16/2004 |
| 6815491 | Reinforced thermoplastic composition and articles derived therefrom A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a polyolefin-graft-cyclic anhydride copolymer, and a reinforcing filler. The ... | 11/09/2004 |
| 6814881 | Polyamide fiber substrate having stain resistance, composition and method Semi-bleached to bleached sulfonated aromatic condensation resin alone or in combination with a semi-soluble methacrylic polymer of high molecular weight provides improved resistance to staining by acid colorants in a fibrous polyamide or wool substrate. ... | 11/09/2004 |
| 6812299 | Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin... | 11/02/2004 |
| 6809160 | Flexible hydrophobic resin with sulfonium and propargyl groups-containing resin A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): ... | 10/26/2004 |
| 6805958 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight o... | 10/19/2004 |
| 6800371 | Adhesives and adhesive compositions containing thioether groups In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics... | 10/05/2004 |
| 6779656 | Polymerizable preparations based on epoxides that contain silicon The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar... | 08/24/2004 |
| 6765071 | Composition of aromatic polyepisulfide,polyglycidyl ether and/or ester, and acid anhydride This invention relates to a resin composition containing an aromatic episulfide which exhibits excellent moldability, heat resistance and optical properties. The composition comprises an aromatic episulfide compound (A) having two or more reactive groups represented... | 07/20/2004 |
| 6740732 | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith Novel phosphorus element-containing epoxy resin compositions and novel phosphorus-element containing epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds including non-halogenated, ignition resistant epoxy resin fo... | 05/25/2004 |
| 6737474 | Modified polyvinyl acetal resin, curable resin composition containing the same, and laminated products Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: w... | 05/18/2004 |
| 6709753 | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified e... | 03/23/2004 |
| 6670425 | Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodi... | 12/30/2003 |
| 6663916 | Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodi... | 12/16/2003 |
| 6616979 | Powder coating with non-crystalline and crystalline epoxy resins and curing agent Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions... | 09/09/2003 |
| 6613438 | Single component adhesive with an adaptable open joint time The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and... | 09/02/2003 |
| 6576690 | Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin h... | 06/10/2003 |
| 6555601 | Process for impregnating electrical coils, and selected epoxy composition for carrying out the impregnation A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual tur... | 04/29/2003 |
| 6555617 | Composition of cyclic anhydride modified polyvinyl acetal and curable resin and laminated products Disclosed are a modified polyvinyl acetal resin consisting essentially of repeating units represented by the following formula (I), and a modifier for curable resins which comprises the modified polyvinyl acetal resin: ##STR1## wherein R1 repre... | 04/29/2003 |
