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| Number | Title | Issue Date |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7365135 | Method for preparing a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite The method of the present invention includes grafting a glycidyl alkylene trialkoxy silane to a novolac phenolic resin in an organic solvent to form a modified novolac phenolic resin; mixing a tetralkoxy silane, an acid and water with the resulting organic solution ... | 04/29/2008 |
| 7354978 | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semic... | 04/08/2008 |
| 7321005 | Encapsulant composition and electronic package utilizing same A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity o... | 01/22/2008 |
| 7314702 | Composition for a bottom-layer resist A composition for a bottom-layer resist, having superior anti-refractivity and dry-etch resistance for use in a bi-layer resist process employing a light source at a wavelength of 193 nm or below, is disclosed. The composition for the bottom-layer resist contains a ... | 01/01/2008 |
| 7279574 | Epoxy compound and cured epoxy resin product The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivit... | 10/09/2007 |
| 7268192 | Process for producing high-purity epoxy resin and epoxy resin composition A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component w... | 09/11/2007 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains th... | 09/11/2007 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well a... | 09/04/2007 |
| 7259213 | Indole resins epoxy resins and resin compositions containing the same This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent f... | 08/21/2007 |
| 7217779 | Phosphoric ester demulsifier composition A phosphoric ester demulsifier composition prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates or one or more polyalkylene glycols, or a mixture thereof, with about 0.001 to about 1.0 molar equivalents of one or more phosphorous compounds sel... | 05/15/2007 |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7132213 | Positive photoresist composition and method of forming resist pattern A positive photoresist composition comprising an alkali-soluble novolak resin (A) containing a structural unit (a1) represented by a general formula (I) shown below, and a structural unit (a2) represented by a general formula (II) shown below, and a photosensitizer ... | 11/07/2006 |
| 7125931 | Thermosetting compositions containing alternating copolymers of isobutylene type monomers A thermosetting composition that includes an ungelled copolymer composition and a crosslinking agent. The ungelled copolymer composition includes a functional group-containing copolymer that includes segments of alternating residues derived from a donor monomer comp... | 10/24/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7094844 | Liquid epoxy resin composition and semiconductor device A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the... | 08/22/2006 |
| 7049388 | Process for manufacturing an α-dihydroxy derivative and epoxy resins prepared therefrom A process for manufacturing an α-dihydroxy derivative from an aryl allyl ether wherein such α-dihydroxy derivative can be used to prepare an α-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an α-halohydrin intermediate produc... | 05/23/2006 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this... | 03/14/2006 |
| 7009009 | Fluxing underfill compositions A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which... | 03/07/2006 |
| 6998432 | Adhesive composition for skin and adhesive tape or sheet for skin comprising the composition The present invention provides an adhesive tape or sheet for application to skin, which is made of an adhesive composition containing an acrylic copolymer having a specific composition and a specific carboxylic acid ester, wherein the acrylic copolymer has a gel fra... | 02/14/2006 |
| 6955851 | Hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and la... | 10/18/2005 |
| 6906156 | Accelerators for cationic polymerization catalyzed by iron-based catalyst Accelerators that can be useful for an energy polymerizable composition comprising a cationically curable material; energy polymerizable compositions comprising at least one cationically curable material and an initiation system therefor, the initiation system compr... | 06/14/2005 |
| 6893784 | Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f)... | 05/17/2005 |
| 6808819 | Heat resistant resin composition and adhesive film A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf st... | 10/26/2004 |
| 6794478 | Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidol A process for preparing an epoxy resin involves the reaction of a polyhydric phenol with an epihalohydrin in a water-soluble solvent in the presence of an alkali reactive catalyst wherein a continuous distillation of the reaction product is conducted to (1) i... | 09/21/2004 |
| 6743522 | Self heat sealable packaging and a method for making same The present invention is directed to saturants for fibrous webs that will confer upon those webs the ability to be heat sealed to many materials without compromising the drapability of the fibrous webs. The present invention is further directed to fibrous webs satur... | 06/01/2004 |
| 6579963 | Bonding resins Phenol/aldehyde resins particularly phenol/formaldehyde resins are manufactured by replacing a proportion of the phenol content by a mixture of at least two different natural materials having a phenolic content. The resulting resins which can be used in b... | 06/17/2003 |
| 6565772 | Conductive resin composition A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particul... | 05/20/2003 |
| 6562410 | Heat curable epoxy compositions Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1... | 05/13/2003 |
| 6534621 | Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom A process for manufacturing an -halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an -halohydrin intermediate produced from an in situ halide substitution-deesterification of an -hydroxy ester derivat... | 03/18/2003 |
| 6469109 | Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure... | 10/22/2002 |
| 6465528 | Aromatic aldehyde resins and their use as emulsion breakers The present invention relates to resins obtained by reacting a compound of formula 1 with an aldehyde and alkoxylating, in any order: ##STR1## wherein X is --OH, Y is ortho-, meta- or para- to X and is a radical of formula 4, ##STR2## wherein R5 | 10/15/2002 |
| 6432539 | Phosphorus-containing polymer having phenolic units and uses thereof A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohyd... | 08/13/2002 |
| 6420320 | High molecular weight polyols, process for preparation and use thereof The invention is a high molecular weight polyether polyol prepared by the reaction of one or more compounds having one or more active hydrogen compounds with one or more alkylene oxides in the presence of a catalyst comprising calcium having counterions o... | 07/16/2002 |
| 6391979 | Epoxidized poly-p-hydroxystyrene Disclosed are epoxy resins prepared by reacting p-hydroxystyrene and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy resins prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol agents wi... | 05/21/2002 |
| 6344500 | Aqueous primer coating composition and article coated therewith The present invention provides: an aqueous primer coating composition of which the deterioration of the water resistance is prevented with the high adhesion maintained, and which is excellent in the gasohol resistance and the pigment dispersion stability;... | 02/05/2002 |
| 6307192 | Ovenable food tray and its manufacturing method The invention is related to an ovenable food tray (1) and its manufacturing method. The paperboard or cardboard tray is provided with at least one layer of polymeric coating (3, 4) which, according to the invention, is lying at least on the side of the tr... | 10/23/2001 |
| 6255434 | High molecular weight polyols, process for preparation and use thereof The invention is a high molecular weight polyether polyol prepared by the reaction of one or more compounds having one or more active hydrogen compounds with one or more alkylene oxides in the presence of a catalyst comprising calcium having counterions o... | 07/03/2001 |
| 6180723 | Epoxy resin prepared by reacting poly-p-hydroxystyrene with epichlorohydrin Disclosed are epoxides prepared by reacting a p-hydroxystyrene polymer and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy agents prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol age... | 01/30/2001 |
| 6150492 | Cross-catalyzed phenol-resorcinol adhesive A two-part adhesive is provided wherein the first part comprises a stable aqueous alkaline monohydroxylic phenolic resole resin solution containing a methylene donor such as oxazolidine or a methylolurea and the second part comprises a stable resorcinolic... | 11/21/2000 |
